| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 07/04/2002 | US20020084189 Immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features, especially by mechanical vibration |
| 07/02/2002 | US6413390 Plating system with remote secondary anode for semiconductor manufacturing |
| 06/27/2002 | WO2002026381A3 Ionic liquids and their use |
| 06/27/2002 | US20020080588 Probe card assembly and kit, and methods of making same |
| 06/27/2002 | US20020079230 Method and apparatus for controlling thickness uniformity of electroplated layer |
| 06/27/2002 | US20020079229 Anode inserted in a hole of a work, and a member for rotating the work about its center axis and supplying a plating current; plating a ring shaped bonded magnet |
| 06/27/2002 | US20020079215 Workpiece processor having processing chamber with improved processing fluid flow |
| 06/26/2002 | EP1217102A2 Plating apparatus and method of managing plating liquid composition |
| 06/20/2002 | US20020074244 Plating bath analysis |
| 06/20/2002 | DE10061226A1 Verfahren und Vorrichtung zur Behandlung von Waren in einem Tauchbad Method and apparatus for the treatment of goods in an immersion bath |
| 06/18/2002 | US6406608 Monitoring for plating solutions |
| 06/13/2002 | WO2002045476A2 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 06/13/2002 | US20020071917 Protective layer is provided on workpieces in horizontal and vertical fashion in galvanizing tank; uniformity |
| 06/13/2002 | US20020071207 Thin film magnetic head having gap layer made of nip and method of manufacturing the same |
| 06/13/2002 | US20020070126 Polishing method, polishing apparatus, plating method, and plating apparatus |
| 06/13/2002 | US20020070117 Electrochemical processing power device |
| 06/12/2002 | EP1213373A2 Process and installation for the treatment of articles in a immersion bath |
| 06/12/2002 | CN1353779A System for electrochemically processing workpiece |
| 06/12/2002 | CN1353778A Workpiece processor having processing chamber with improved processing fluid flow |
| 06/11/2002 | US6403230 Anodizing with chromic acid; solution treatment, annealing, deformation, and aging; heat treating curable, crosslinked phenolic resin |
| 06/11/2002 | US6402925 Prevent accumulation by polishing |
| 06/06/2002 | US20020067181 Probe card assembly and kit, and methods of making same |
| 06/06/2002 | US20020066664 Method and apparatus for supplying electricity uniformly to a workpiece |
| 06/04/2002 | US6398944 Method of removing acid formed during cathodic electrodip coating |
| 05/30/2002 | US20020063097 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating |
| 05/29/2002 | EP0950130A4 Apparatus and method for electroforming |
| 05/29/2002 | DE10143076A1 Material für die Kupfergalvanisierung, Verfahren für dessen Herstellung und Kupfergalvanisierungsverfahren Material for the copper plating, process for its preparation and Kupfergalvanisierungsverfahren |
| 05/29/2002 | CN1351530A Method and apparatus for deposition on and polishing of a semiconductor surface |
| 05/23/2002 | US20020060157 Electroplating bath control |
| 05/23/2002 | US20020060155 Method of removing acid formed during cathodic electrodip coatings |
| 05/22/2002 | EP1207219A1 Equipment and method for covering a metallic element with a layer of copper |
| 05/21/2002 | US6391209 Recycling fluid, oxidation, connecting, coupling, controlling and heating |
| 05/21/2002 | US6391179 Plating and antideposit agents |
| 05/21/2002 | US6391166 Plating apparatus and method |
| 05/21/2002 | CA2112592C Phosphate chemical treatment method |
| 05/16/2002 | WO2002038827A1 Plasma electroplating |
| 05/16/2002 | US20020056649 Method of fabricating thin magnetic film and electrolytic plating apparatus for fabricating thin magnetic film |
| 05/16/2002 | US20020056647 Plating method and plating apparatus |
| 05/16/2002 | US20020056644 Pulse plating by pulsed electrolysis by periodically applying electricity while controlling pulse frequency and current density |
| 05/16/2002 | US20020056636 Interpenetrating network free radical block polymer having hydrophobic and hydrophilic regions; improved thermal and mechanical stability; fuel cells |
| 05/14/2002 | US6387227 Metal plate electrolyzation apparatus and electrode for electrolyzing metal plate |
| 05/10/2002 | WO2002036860A1 Method and apparatus for electrolytic deposition of copper |
| 05/10/2002 | WO2002036839A1 Method and installation of metal retrieving from used chroming solutions |
| 05/09/2002 | US20020053734 Probe card assembly and kit, and methods of making same |
| 05/09/2002 | US20020053518 Material for copper electroplating, method for manufacturing same and copper electroplating method |
| 05/09/2002 | US20020053516 Anode, a shaping plate, a liquid electrolyte, and electrical contact members |
| 05/08/2002 | EP1203950A1 Plating bath analysis |
| 05/02/2002 | EP0966557B1 Circuitry and method for an electroplating plant or etching plant pulse power supply |
| 04/30/2002 | US6379559 Sedimentation of impurities |
| 04/30/2002 | US6379521 Method of producing zinc oxide film, method of producing photovoltaic element, and method of producing semiconductor element substrate |
| 04/30/2002 | US6379520 Plating semiconductors |
| 04/30/2002 | US6379511 Paddle design for plating bath |
| 04/25/2002 | WO2002033150A2 Electrochemical processing power device |
| 04/25/2002 | WO2001092604A3 Electrolysis cell for restoring the concentration of metal ions in processes of electroplating |
| 04/25/2002 | US20020048966 Trapping the particles of zinc oxide precipitated in the bath by circulating or stirring before the formation of the zinc oxide film |
| 04/25/2002 | US20020046953 Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires |
| 04/25/2002 | DE10051830A1 Container used for a galvanic liquid which releases corrosive vapors comprises a separator on the container edge with suction openings, and a filling body chamber with filling bodies arranged above the openings in the separator |
| 04/24/2002 | EP1199386A2 Plating methods and systems |
| 04/24/2002 | CN1346510A Mehtod and apparatus for holding and positioing semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 04/18/2002 | WO2002031227A2 Deposition uniformity control for electroplating apparatus, and associated method |
| 04/17/2002 | EP1198001A2 Method of testing and mounting devices using a resilient contact structure |
| 04/16/2002 | US6372111 Chemical mechanical planarization |
| 04/16/2002 | US6372055 Method for replenishing baths |
| 04/11/2002 | WO2002029875A2 Plating system with remote secondary anode for semiconductor manufacturing |
| 04/11/2002 | WO2002029137A2 Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| 04/11/2002 | WO2001091163A3 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 04/11/2002 | US20020040854 Carbon cathode rod activated with negative voltage |
| 04/10/2002 | EP1194616A1 Copper replenishment technique for precision copper plating system |
| 04/10/2002 | EP1194613A1 Workpiece processor having processing chamber with improved processing fluid flow |
| 04/10/2002 | CN2485317Y Vacuum immersion apparatus |
| 04/04/2002 | WO2002026381A2 Ionic liquids and their use |
| 04/03/2002 | EP1192298A2 System for electrochemically processing a workpiece |
| 04/03/2002 | CN1342788A 电解质净化方法 Electrolyte purification method |
| 04/03/2002 | CN1342787A Copper plated material, its manufacturing method and method for copper plating |
| 04/02/2002 | US6365017 Substrate plating device |
| 03/28/2002 | DE10043560A1 Producing metal layer, used in semiconductor technology and manufacture of integrated circuits, involves electrochemical growth of metal on substrate |
| 03/27/2002 | EP1191129A2 Metal plating method |
| 03/27/2002 | EP1191128A2 Plating method and plating apparatus |
| 03/27/2002 | CN1342218A Copper recovery process |
| 03/26/2002 | US6362103 Method and apparatus for rejuvenating a CMP chemical solution |
| 03/26/2002 | US6361677 Plant and process for the electrolytic dissolution by oxidation of a metal |
| 03/21/2002 | WO2001066830A3 Method for applying a metal layer to a light metal surface |
| 03/21/2002 | US20020033368 Using precipitation promoter; adjustment ph |
| 03/21/2002 | US20020033340 Method and apparatus for conditioning electrochemical baths in plating technology |
| 03/20/2002 | EP1015667B1 Method and device for regulating the concentration of substances in electrolytes |
| 03/19/2002 | US6358390 Obtaining a surface charge on ceramic materiall depositing an electroconductive material on surface of ceramic material; activating electroconductive material; electrolytically plating metal on surface of electroconductive material |
| 03/14/2002 | US20020032499 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 03/14/2002 | US20020029974 Method and apparatus of purifying an electrolyte |
| 03/14/2002 | US20020029973 Coated anode apparatus and associated method |
| 03/14/2002 | DE10042002A1 Device for galvanically depositing magnetic metallic alloys comprises a process cell containing a cathode, anode and electrolyte, a spectral photometer |
| 03/07/2002 | WO2001094656A3 Plating apparatus with individually controllable anode segments and associated method |
| 03/07/2002 | US20020027082 Method of improving contact reliability for electroplating |
| 03/07/2002 | US20020027080 Plating apparatus and method |
| 03/06/2002 | EP1184487A1 Process for purifying an electrolyte |
| 03/06/2002 | CN1338969A Device for cleaning a fluid in the form of vapor from a circuit |
| 03/01/2002 | CA2317233A1 Ultrasonically assisted plating bath for vias metallization in printed circuit board manufacturing |
| 02/28/2002 | DE10053656A1 Immersion bath heater used in galvanizing devices comprises an electrical heating insert arranged in an immersion tube and connected in series to a thermal switch arranged within the immersion tube |
| 02/27/2002 | EP1181965A1 Device for cleaning a fluid in the form of a vapor from a circuit |
| 02/26/2002 | US6351682 Semiconductor processing workpiece position sensing |
| 02/26/2002 | US6350362 Method and device for regulating the concentration of substances in electrolytes |