Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
09/2001
09/24/2001CA2341575A1 Method of and an apparatus for operating a multistage counter-flow cascade washer
09/20/2001WO2001068953A1 Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof
09/20/2001WO2001068952A1 Method and apparatus for electroplating
09/20/2001WO2001068949A1 Electro-plating apparatus and method
09/20/2001US20010022156 Sink roll blade apparatus used in continuous molten metal plating apparatus and method for preventing occurrence of dents
09/20/2001DE10024239C1 Process for galvanically treating workpieces used e.g. in the production of circuit boards comprises contacting the workpieces with a palladium colloidal solution, and recovering the solution after use
09/20/2001DE10013298A1 Applying metal layer to surfaces of light metals comprises electrolytically depositing iron from deposition bath containing iron (II) compounds formed during oxidation of iron (II) compounds at anodes
09/20/2001CA2403122A1 Electro-plating apparatus and method
09/20/2001CA2391038A1 Method and device for regulating the metal ion concentration in an electrolyte fluid as well as application of said method and use of said device
09/19/2001EP1134301A1 Sink roll blade apparatus used in continuous molten metal plating apparatus and method for preventing occurrence of dents
09/19/2001EP1133786A2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
09/19/2001EP1133589A2 Enhanced membrane electrode devices useful for electrodeposition coating
09/13/2001WO2001066830A2 Method for applying a metal layer to a light metal surface
09/13/2001US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
09/13/2001US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
09/12/2001EP1132502A2 Method and apparatus for supplying electricity uniformly to a workpiece
09/12/2001EP1132500A2 Method for electrochemical deposition of metal using modulated waveforms
09/12/2001CN1312391A Method of recovering metal from metal-containing sludge
09/05/2001EP1129237A2 Method and apparatus for electrochemical mechanical deposition
09/05/2001CN1311830A Alkali zinc nickel bath
08/2001
08/30/2001US20010017266 Process and apparatus for preparing and replenishing an electrolyte in an electrolyte bath
08/30/2001US20010017258 Wafer plating apparatus
08/30/2001US20010017105 Wafer plating apparatus
08/29/2001EP0963463B1 Method and device for making layer electrodes
08/28/2001US6280602 Electroplating test electrode at constant or known current in mixing chamber wherein base metal plating solution is mixed with small volumes of sample and various calibration solutions containing additive to be measured, measuring potential
08/23/2001US20010015652 Probe card assembly and kit, and methods of making same
08/22/2001EP1125007A1 Submicron metallization using electrochemical deposition
08/22/2001CN1309881A Method for metal coating of substrates
08/16/2001US20010014409 Article, method, and apparatus for electrochemical fabrication
08/15/2001CN1307938A Preparation of aluminium alloy part with precoating
08/14/2001US6274021 Regulate in a time-defined manner during electrolytic deposition the concentration of the electrolyte constituents, additional electrodes,
08/08/2001EP1122339A2 Megasonic plating using a submerged transducers-array
08/08/2001CN1307793A Assembly of an electronic component with spring packaging
08/07/2001US6270647 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
08/07/2001US6270635 Consistent plating system for electroplating
08/02/2001WO2000033356A9 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
07/2001
07/31/2001US6267860 Electroconductive support; resistor
07/26/2001WO2001054179A1 Method and apparatus for reclaiming a metal from a cmp process for use in an electroplating process
07/26/2001WO2001053204A1 A method for treatment of hexavalent chromium compounds in waste water originating from processing of metals
07/26/2001US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging
07/26/2001US20010009226 Device for supporting semiconductor in electroplating solution; electrical circuit, including electrode, for applying electrical potential across solution; control device to change distance between electrode and semiconductor
07/24/2001US6264817 Method for microplasma oxidation of valve metals and their alloys
07/24/2001US6264809 Enhanced membrane electrode devices useful for electrodeposition coating
07/24/2001US6264806 Plating fluid replenishment system and method
07/17/2001US6261435 Plating pretreatment method comprising vibrationally stirring treatment bath, aerating treatment bath, swinging plating target, and applying vibration to plating target simultaneously in single tank at a time
07/17/2001US6261425 Electroplating machine
07/12/2001WO2001050505A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
07/12/2001WO2000033356A3 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
07/12/2001DE19958202A1 Verfahren zur Herstellung einer Metallschicht mit einer vorgegebenen Dicke A process for producing a metal layer having a predetermined thickness
07/11/2001EP1114882A2 Apparatus and method for depositing an electroless solution
07/11/2001CN1303124A Method of forming semiconductor apparatus
07/10/2001US6258244 Treating method and apparatus utilizing chemical reaction
07/10/2001US6258241 Process for electroplating metals
07/10/2001US6258240 Anodizing apparatus and method
07/10/2001US6258239 Depositing electrocatalyst by electrochemical deposition on porous, electrically conductive substrate having ion-conducting polymer film
07/05/2001WO2001048275A1 Plating device and plating method
07/04/2001EP1113487A1 Method for plating a film on a semiconductor device
07/04/2001EP1113094A2 Plating analysis method
07/03/2001US6254759 Method and apparatus for anodizing objects
07/03/2001US6254757 Method for electrochemical fluidized bed coating of powders
06/2001
06/28/2001DE10063624A1 Electroplating system has anodes in the plating bath together with electrically conductive rollers as cathodes to move the workpieces forwards or backwards through the bath
06/27/2001CN2436517Y Aluminium ion stabilizing and acid recovering device
06/27/2001CN1301313A Method for electro copperplating substrates
06/27/2001CN1300882A Apparatus and method for electroplating treatment
06/26/2001US6251255 Secondary cell, separate from the main process plating cell, which has a dedicated rectifier, and in which a soluble tin anode and a cathode are separated by a perm-selective ion exchange membrane.
06/26/2001US6251234 Electroplating machine
06/22/2001CA2329553A1 An electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths
06/13/2001DE10013339C1 Process for regulating the concentration of metal ions in an electrolyte liquid comprises feeding part of the liquid through an auxiliary cell consisting of an insoluble auxiliary anode and an auxiliary cathode
06/13/2001CN2434313Y Solution concentration detector of electroplating filter
06/12/2001US6246247 Probe card assembly and kit, and methods of using same
06/12/2001US6244276 Apparatus for the recovery of dragged-out treatment solutions by immersion barrels
06/07/2001US20010003008 Measuring an electrical resistance of the metal layer via connections on a starting layer provided under the metal layer and determining layer thickness from the resistance measurement
06/07/2001DE10007799C1 Zur Stromzuführung zu elektrolytisch zu behandelnden Werkstücken oder Gegenelektroden dienender Träger und Verfahren zur elektrolytischen Behandlung von Werkstücken For supplying current to electrolytically treated workpieces or counter electrode serving carrier and method for electrolytic treatment of workpieces
06/05/2001US6241860 Electroplating machine
05/2001
05/31/2001WO2001038610A1 Process for the extended use of electrolytes
05/31/2001DE19956666A1 Continuous operational use of electrolytes is achieved by recycling side stream via filters and adding fresh active substances as appropriate
05/30/2001EP1104227A2 Method for replenishing adhesion promoting baths
05/30/2001EP1103639A2 Plating apparatus and method
05/30/2001EP1102875A2 Alkali zinc nickel bath
05/29/2001US6238539 Measuring displacement; controlling current
05/23/2001EP1100984A1 Installation and method for multilayered immersion coating
05/22/2001US6235178 Method and device for coating a metal strip
05/17/2001US20010001192 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head
05/17/2001DE19932523C1 Verfahren und Vorrichtung zur elektrochemischen Behandlung Method and apparatus for electrochemical treatment
05/16/2001EP1099782A1 Installation and process for the electrolytic dissolution of a metal by oxidation
05/16/2001EP1099013A2 Paced chemical replenishment system
05/16/2001EP1099010A2 Method for recovering precious metals
05/15/2001US6231743 Method for forming a semiconductor device
05/15/2001US6231729 Apparatus for preparing and replenishing an electrolyte in an electrolyte bath
05/12/2001CA2325890A1 Facility and process for electrolytic dissolution by oxidation of a metal
05/10/2001WO2001032362A1 Method and apparatus for deposition on and polishing of a semiconductor surface
05/10/2001DE19948005A1 Electrode for the regeneration of chromic acid solutions has a porous structure through which a chromic acid solution can pass
05/08/2001US6228243 Electrochemical synthesis of crystalline compound or alloy films
05/01/2001US6224670 Cup-type plating method and cleaning apparatus used therefor
04/2001
04/26/2001WO2001029548A1 Method and apparatus for determination of additives in metal plating baths
04/24/2001US6221437 Metal layer
04/24/2001US6221177 Providing aluminum-alloy article precursor; anodizing article precursor; applying curable organic coating material; heat-treating coated aluminum article precursor to its final heat-treated state
04/24/2001CA2041870C Process for electrodepositing a metallic coating of a nickel-cobalt alloy on an object and electrolyte solution used therein
04/19/2001WO2001027358A1 Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces
04/18/2001EP1092338A1 Assembly of an electronic component with spring packaging
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