Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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09/24/2001 | CA2341575A1 Method of and an apparatus for operating a multistage counter-flow cascade washer |
09/20/2001 | WO2001068953A1 Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof |
09/20/2001 | WO2001068952A1 Method and apparatus for electroplating |
09/20/2001 | WO2001068949A1 Electro-plating apparatus and method |
09/20/2001 | US20010022156 Sink roll blade apparatus used in continuous molten metal plating apparatus and method for preventing occurrence of dents |
09/20/2001 | DE10024239C1 Process for galvanically treating workpieces used e.g. in the production of circuit boards comprises contacting the workpieces with a palladium colloidal solution, and recovering the solution after use |
09/20/2001 | DE10013298A1 Applying metal layer to surfaces of light metals comprises electrolytically depositing iron from deposition bath containing iron (II) compounds formed during oxidation of iron (II) compounds at anodes |
09/20/2001 | CA2403122A1 Electro-plating apparatus and method |
09/20/2001 | CA2391038A1 Method and device for regulating the metal ion concentration in an electrolyte fluid as well as application of said method and use of said device |
09/19/2001 | EP1134301A1 Sink roll blade apparatus used in continuous molten metal plating apparatus and method for preventing occurrence of dents |
09/19/2001 | EP1133786A2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
09/19/2001 | EP1133589A2 Enhanced membrane electrode devices useful for electrodeposition coating |
09/13/2001 | WO2001066830A2 Method for applying a metal layer to a light metal surface |
09/13/2001 | US20010020546 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
09/13/2001 | US20010020545 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
09/12/2001 | EP1132502A2 Method and apparatus for supplying electricity uniformly to a workpiece |
09/12/2001 | EP1132500A2 Method for electrochemical deposition of metal using modulated waveforms |
09/12/2001 | CN1312391A Method of recovering metal from metal-containing sludge |
09/05/2001 | EP1129237A2 Method and apparatus for electrochemical mechanical deposition |
09/05/2001 | CN1311830A Alkali zinc nickel bath |
08/30/2001 | US20010017266 Process and apparatus for preparing and replenishing an electrolyte in an electrolyte bath |
08/30/2001 | US20010017258 Wafer plating apparatus |
08/30/2001 | US20010017105 Wafer plating apparatus |
08/29/2001 | EP0963463B1 Method and device for making layer electrodes |
08/28/2001 | US6280602 Electroplating test electrode at constant or known current in mixing chamber wherein base metal plating solution is mixed with small volumes of sample and various calibration solutions containing additive to be measured, measuring potential |
08/23/2001 | US20010015652 Probe card assembly and kit, and methods of making same |
08/22/2001 | EP1125007A1 Submicron metallization using electrochemical deposition |
08/22/2001 | CN1309881A Method for metal coating of substrates |
08/16/2001 | US20010014409 Article, method, and apparatus for electrochemical fabrication |
08/15/2001 | CN1307938A Preparation of aluminium alloy part with precoating |
08/14/2001 | US6274021 Regulate in a time-defined manner during electrolytic deposition the concentration of the electrolyte constituents, additional electrodes, |
08/08/2001 | EP1122339A2 Megasonic plating using a submerged transducers-array |
08/08/2001 | CN1307793A Assembly of an electronic component with spring packaging |
08/07/2001 | US6270647 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
08/07/2001 | US6270635 Consistent plating system for electroplating |
08/02/2001 | WO2000033356A9 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
07/31/2001 | US6267860 Electroconductive support; resistor |
07/26/2001 | WO2001054179A1 Method and apparatus for reclaiming a metal from a cmp process for use in an electroplating process |
07/26/2001 | WO2001053204A1 A method for treatment of hexavalent chromium compounds in waste water originating from processing of metals |
07/26/2001 | US20010009724 Depositing coating on elongate member to give a coated elongate member, coating comprising at least one metal and at least one additive, the additive capable of codepositing with the metal, heat treating; electronics packaging |
07/26/2001 | US20010009226 Device for supporting semiconductor in electroplating solution; electrical circuit, including electrode, for applying electrical potential across solution; control device to change distance between electrode and semiconductor |
07/24/2001 | US6264817 Method for microplasma oxidation of valve metals and their alloys |
07/24/2001 | US6264809 Enhanced membrane electrode devices useful for electrodeposition coating |
07/24/2001 | US6264806 Plating fluid replenishment system and method |
07/17/2001 | US6261435 Plating pretreatment method comprising vibrationally stirring treatment bath, aerating treatment bath, swinging plating target, and applying vibration to plating target simultaneously in single tank at a time |
07/17/2001 | US6261425 Electroplating machine |
07/12/2001 | WO2001050505A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
07/12/2001 | WO2000033356A3 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
07/12/2001 | DE19958202A1 Verfahren zur Herstellung einer Metallschicht mit einer vorgegebenen Dicke A process for producing a metal layer having a predetermined thickness |
07/11/2001 | EP1114882A2 Apparatus and method for depositing an electroless solution |
07/11/2001 | CN1303124A Method of forming semiconductor apparatus |
07/10/2001 | US6258244 Treating method and apparatus utilizing chemical reaction |
07/10/2001 | US6258241 Process for electroplating metals |
07/10/2001 | US6258240 Anodizing apparatus and method |
07/10/2001 | US6258239 Depositing electrocatalyst by electrochemical deposition on porous, electrically conductive substrate having ion-conducting polymer film |
07/05/2001 | WO2001048275A1 Plating device and plating method |
07/04/2001 | EP1113487A1 Method for plating a film on a semiconductor device |
07/04/2001 | EP1113094A2 Plating analysis method |
07/03/2001 | US6254759 Method and apparatus for anodizing objects |
07/03/2001 | US6254757 Method for electrochemical fluidized bed coating of powders |
06/28/2001 | DE10063624A1 Electroplating system has anodes in the plating bath together with electrically conductive rollers as cathodes to move the workpieces forwards or backwards through the bath |
06/27/2001 | CN2436517Y Aluminium ion stabilizing and acid recovering device |
06/27/2001 | CN1301313A Method for electro copperplating substrates |
06/27/2001 | CN1300882A Apparatus and method for electroplating treatment |
06/26/2001 | US6251255 Secondary cell, separate from the main process plating cell, which has a dedicated rectifier, and in which a soluble tin anode and a cathode are separated by a perm-selective ion exchange membrane. |
06/26/2001 | US6251234 Electroplating machine |
06/22/2001 | CA2329553A1 An electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths |
06/13/2001 | DE10013339C1 Process for regulating the concentration of metal ions in an electrolyte liquid comprises feeding part of the liquid through an auxiliary cell consisting of an insoluble auxiliary anode and an auxiliary cathode |
06/13/2001 | CN2434313Y Solution concentration detector of electroplating filter |
06/12/2001 | US6246247 Probe card assembly and kit, and methods of using same |
06/12/2001 | US6244276 Apparatus for the recovery of dragged-out treatment solutions by immersion barrels |
06/07/2001 | US20010003008 Measuring an electrical resistance of the metal layer via connections on a starting layer provided under the metal layer and determining layer thickness from the resistance measurement |
06/07/2001 | DE10007799C1 Zur Stromzuführung zu elektrolytisch zu behandelnden Werkstücken oder Gegenelektroden dienender Träger und Verfahren zur elektrolytischen Behandlung von Werkstücken For supplying current to electrolytically treated workpieces or counter electrode serving carrier and method for electrolytic treatment of workpieces |
06/05/2001 | US6241860 Electroplating machine |
05/31/2001 | WO2001038610A1 Process for the extended use of electrolytes |
05/31/2001 | DE19956666A1 Continuous operational use of electrolytes is achieved by recycling side stream via filters and adding fresh active substances as appropriate |
05/30/2001 | EP1104227A2 Method for replenishing adhesion promoting baths |
05/30/2001 | EP1103639A2 Plating apparatus and method |
05/30/2001 | EP1102875A2 Alkali zinc nickel bath |
05/29/2001 | US6238539 Measuring displacement; controlling current |
05/23/2001 | EP1100984A1 Installation and method for multilayered immersion coating |
05/22/2001 | US6235178 Method and device for coating a metal strip |
05/17/2001 | US20010001192 Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head |
05/17/2001 | DE19932523C1 Verfahren und Vorrichtung zur elektrochemischen Behandlung Method and apparatus for electrochemical treatment |
05/16/2001 | EP1099782A1 Installation and process for the electrolytic dissolution of a metal by oxidation |
05/16/2001 | EP1099013A2 Paced chemical replenishment system |
05/16/2001 | EP1099010A2 Method for recovering precious metals |
05/15/2001 | US6231743 Method for forming a semiconductor device |
05/15/2001 | US6231729 Apparatus for preparing and replenishing an electrolyte in an electrolyte bath |
05/12/2001 | CA2325890A1 Facility and process for electrolytic dissolution by oxidation of a metal |
05/10/2001 | WO2001032362A1 Method and apparatus for deposition on and polishing of a semiconductor surface |
05/10/2001 | DE19948005A1 Electrode for the regeneration of chromic acid solutions has a porous structure through which a chromic acid solution can pass |
05/08/2001 | US6228243 Electrochemical synthesis of crystalline compound or alloy films |
05/01/2001 | US6224670 Cup-type plating method and cleaning apparatus used therefor |
04/26/2001 | WO2001029548A1 Method and apparatus for determination of additives in metal plating baths |
04/24/2001 | US6221437 Metal layer |
04/24/2001 | US6221177 Providing aluminum-alloy article precursor; anodizing article precursor; applying curable organic coating material; heat-treating coated aluminum article precursor to its final heat-treated state |
04/24/2001 | CA2041870C Process for electrodepositing a metallic coating of a nickel-cobalt alloy on an object and electrolyte solution used therein |
04/19/2001 | WO2001027358A1 Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces |
04/18/2001 | EP1092338A1 Assembly of an electronic component with spring packaging |