Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
11/2005
11/30/2005CN1702199A Constant temperature singlechip controller for electroplating tank
11/29/2005US6969672 Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation
11/24/2005WO2005111275A2 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
11/24/2005US20050258046 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
11/24/2005US20050258044 Magnetic focus rings for improved copper plating
11/24/2005DE102004021260A1 System und Verfahren für eine erhöhte Badlebensdauer in einem Einzelbadplattierungsverfahren System and method for enhanced bath life in a Einzelbadplattierungsverfahren
11/23/2005EP1598449A2 Improved plating method
11/23/2005EP1598448A1 Lead-free bump and method for forming the same
11/23/2005EP1597735A1 A commutator, a gas electrode, a method of electroplating and a method of initiating cold fusion
11/23/2005CN1699635A Real-time control method in metal electrodeposition process based on neuron networks
11/22/2005US6966976 Electroplating panel with plating thickness-compensation structures
11/22/2005CA2362120C Device for cleaning a fluid in the form of a vapor from a circuit
11/22/2005CA2302916C Anodizing method and apparatus for performing the same
11/17/2005WO2005108650A1 Methods and apparatus for determining organic component concentrations in an electrolytic solution
11/17/2005WO2005108649A2 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
11/17/2005WO2005026688A3 Sampling management for a process analysis tool to minimize sample usage and decrease sampling time
11/09/2005CN1693541A Continuous cyclone clarification treatment device for electroplating waste water
11/03/2005WO2005065430A3 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
11/03/2005WO2005033377A3 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
11/03/2005US20050245083 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
11/03/2005US20050241955 Substrate processing apparatus and substrate processing method
11/03/2005US20050241948 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
11/03/2005US20050241947 System and method for an increased bath lifetime in a single-use plating regime
11/03/2005US20050241945 Plating analyzing method and apparatus
11/02/2005CN2737807Y Electroplating liquid purifying device
10/2005
10/27/2005US20050237818 Plating internal stress measurement program and plating internal stress measurement system
10/27/2005US20050236274 Methods and apparatus for determining organic component concentrations in an electrolytic solution
10/27/2005US20050236273 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
10/27/2005US20050236268 Substrate processing apparatus
10/26/2005EP1266546B1 Treatment of circuit supports with impulse excitation
10/26/2005CN2736375Y Device for removing impurity zinc and impurity copper in nickel tank liquid
10/26/2005CN1687489A Method for removing chromic anhydride after muffler being chromeplated
10/25/2005US6958113 Plating apparatus and plating method
10/20/2005US20050233653 Electronic connector terminal, a method for plating, and a terminal stack
10/20/2005US20050230260 Plating apparatus and method
10/19/2005EP1586680A2 Program and system for measuring internal stress of an electroplated film
10/19/2005CN1683602A On-line nickel recovering integrated machine for electroplating production line
10/19/2005CN1683222A Surface treating device
10/18/2005US6955747 Cam driven paddle assembly for a plating cell
10/13/2005US20050227381 Using cell voltage as a monitor for deposition coverage
10/13/2005US20050224340 System for electrochemically processing a workpiece
10/12/2005CN1680631A Electrolysis treating method and apparatus
10/12/2005CN1222641C Plating apparatus and method
10/06/2005US20050221621 Proximity head heating method and apparatus
10/06/2005US20050218002 Electroplating using an apparatus with a selective shield/material flow assembly between the anode and the cathode and forming adjustable openings having adjustable sizes for selectively and controllably adjusting the amount of electric flux passing through the assembly and distribution on the workpiece
10/06/2005US20050218001 Monitoring electrolytic cell currents
10/06/2005US20050218000 Conditioning of contact leads for metal plating systems
10/06/2005US20050217999 Non-leachable or diffusible redox mediator; for glucose or lactate concentrations; to monitor glucose in diabetic patients and lactate during critical care events
10/06/2005US20050217995 Advanced electrodeionization for fluid recycling
10/05/2005EP1583135A1 Proximity head heating method and apparatus
10/05/2005CN1679156A Tilted electrochemical plating cell with constant wafer immersion angle
10/05/2005CN1676677A Plating internal stress measurement program and plating internal stress measurement system
10/05/2005CN1221685C Device for electroplating steel band metal coating
09/2005
09/29/2005WO2005090644A2 Wireless electrolytic cell monitoring powered by ultra low bus voltage
09/29/2005WO2005090639A2 Monitoring electrolytic cell currents
09/29/2005US20050211551 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/29/2005CA2558231A1 Wireless electrolytic cell monitoring powered by ultra low bus voltage
09/29/2005CA2558230A1 Monitoring electrolytic cell currents
09/28/2005EP0886894B1 Contact carriers for populating substrates with spring contacts
09/28/2005CN1673423A Metal wire on-line purger
09/28/2005CN1673422A Heating temperature control and stirring equipment for electric plating and chemical plating
09/22/2005US20050209727 Data output processor and method of manufacturing a semiconductor device
09/22/2005US20050208201 Method and apparatus for determining the concentrations of additives in a plating solution
09/22/2005US20050205429 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
09/22/2005US20050205419 Apparatus and methods for electrochemical processsing of microelectronic workpieces
09/22/2005US20050205409 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/22/2005DE202005011141U1 Galvanic bath with electrolyte injector for surface treatment of suspended workpieces with guide plates, upper lower, and side plates and anode plates useful in electrodeposition of metals
09/21/2005EP1576209A1 Method for regeneration of an electrolysis bath for the production of a compound i-iii-vi sb 2 /sb in thin layers
09/21/2005CN1670259A Additive for plating bath
09/15/2005US20050202660 Electrochemical fabrication process including process monitoring, making corrective action decisions, and taking appropriate actions
09/15/2005US20050202180 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material
09/14/2005CN1668785A Device and method for monitoring an electrolytic process
09/14/2005CN1667879A Electronic connector terminal, a method for plating, and a terminal stack
09/13/2005US6942780 Method and apparatus for processing a substrate with minimal edge exclusion
09/13/2005US6942779 Method and system for regenerating of plating baths
09/09/2005WO2005083134A1 Recycling of hot-dip zinc galvanizing bath
09/08/2005US20050194248 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/07/2005CN1664174A Method for copperizing continuously
09/01/2005WO2003071008A3 Methods of and apparatus for making high aspect ratio microelectromechanical structures
09/01/2005US20050189227 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
09/01/2005US20050189226 Contacting negatively charged electrode and pattern during immersion and movement of substrate in electrolytic bath; industrial scale, continuous process, economical
09/01/2005US20050189220 Electrode cartridge and a system for measuring an internal stress for a film of plating
09/01/2005US20050189214 Apparatus and methods for electrochemical processing of microelectronic workpieces
08/2005
08/31/2005CN1217034C Workpiece processor having processing chamber with improved processing fluid flow
08/25/2005WO2005076977A2 Plating apparatus and method
08/25/2005US20050184369 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
08/25/2005US20050183959 Automatic process control; using facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
08/25/2005US20050183958 Method and apparatus for real time monitoring of industrial electrolytes
08/25/2005US20050183521 Inspection apparatus and method for film carrier tapes for mounting electronic components and semiconductor devices
08/24/2005CN1659317A Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
08/24/2005CN1659315A Apparatus and methods for electrochemical processing of microelectronic workpieces
08/24/2005CN1658378A Inspection apparatus and method for film carrier tapes for mounting electronic components and semiconductor devices
08/24/2005CN1657448A Recovering and using technology of water in electroplating
08/18/2005WO2005076680A2 Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectrict substrate
08/18/2005WO2005075712A2 Ecmp system
08/18/2005WO2002031227A3 Deposition uniformity control for electroplating apparatus, and associated method
08/18/2005US20050181316 With improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process
08/18/2005DE10228400B4 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards
08/17/2005EP0859686B1 Fabricating interconnects and tips using sacrificial substrates
08/11/2005US20050173250 Preventing voids during metal electrodeposition on integrated circuits; simultaneously regulating voltage between anode and cathode to reference electrode
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