Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
01/2007
01/09/2007US7160421 Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
01/09/2007CA2253144C Cleaning apparatus for magnetic filter and cleaning method thereof
01/04/2007DE102005030684A1 Process and assembly to recover and recycle spent ionic liquids used in an electrolytic treatment process within basin sub-divided by membrane
01/02/2007US7157051 Sampling management for a process analysis tool to minimize sample usage and decrease sampling time
01/02/2007US7156972 High quality metal or alloy thin film deposition on magnetic head; dissolving hydrogen in solution; low cost impurity reduction
12/2006
12/28/2006WO2006137555A1 Apparatus and method for manufacturing plated film
12/28/2006US20060289312 Method and system for electrolyzer diagnosis based on curve fitting analysis and efficiency optimization
12/28/2006DE202006012437U1 Three phase current galvanising drum drive current monitor measures and compares phase currents with processor generating disturbance status indication
12/27/2006CN2851292Y Stirring device for electroplating bath
12/27/2006CN1292099C Apparatus for plating treatment
12/21/2006US20060283710 Methods of and apparatus for making high aspect ratio microelectromechanical structures
12/20/2006EP1733076A2 Wireless electrolytic cell monitoring powered by ultra low bus voltage
12/20/2006EP1733074A2 Monitoring electrolytic cell currents
12/20/2006CN2848883Y Uniform filtering heating device of electroplating solution
12/20/2006CN1880518A Method and apparatus for adjusting the ion concentration of an electrolytic solution
12/20/2006CN1291071C Electroplating apparatus with plating rack off-position caution device
12/14/2006WO2006132397A1 Plating method, light-transmitting electrically-conductive film and light-transmitting electromagnetic wave shield film
12/14/2006US20060279300 Probe Card Assembly And Kit
12/13/2006EP1629704B1 Process for filling micro-blind vias
12/13/2006CN1289719C Segmented counter electrode for an electrolytic treatment system
12/13/2006CN1289715C Electroforming apparatus and electroforming method
12/07/2006WO2005108649A3 One-point recalibration method for reducing error in concentration measurements for an electrolytic solution
12/07/2006US20060272950 High purity electrolytic sulfonic acid solutions
12/07/2006DE10234285B4 Vorrichtung zur galvanischen Abscheidung prothetischer, metallischer Dentalformteile Apparatus for electrodepositing prosthetic, metallic, molded dental components
12/07/2006DE102005024910A1 Verfahren und System zur In-Line-Steuerung der Lothöcker-Abscheidung Method and system for in-line control of the deposition of solder bump
12/07/2006DE102005004361B4 Vorrichtung und Verfahren zum Entfernen von Blasen aus einer Prozessflüssigkeit Apparatus and method for removing bubbles from a process liquid
12/06/2006CN1288279C Detin liquid and its preparation technology and use
12/05/2006US7144489 Adding saccharic acid or a salt or lactone as an additive to the electroplating solution; contacting the additive with an iron(III) species to form an iron(III)-additive species; irradiating the electroplating solution
12/05/2006US7144488 Electrode, electrochemical cell, and method for analysis of electroplating baths
11/2006
11/30/2006WO2006126518A1 Gravure cylinder-use copper plating method and device
11/30/2006WO2004094702A3 Multi-chemistry plating system
11/30/2006US20060266654 electroless metal deposition by ion exchanging; use a membrane to replenish the deposition metal ion
11/30/2006US20060266653 Current densities are calculated from the measured differential voltages and correlated to thickness values of plated materials; a real time thickness profile is then generated by integrating current values associated with the differential voltage values
11/30/2006US20060266652 Method and system for on-line controlling of solder bump deposition
11/29/2006EP1726690A2 In-situ profile measurement in an electroplating process
11/29/2006EP1726683A1 Method and apparatus for adjusting the ion concentration of an electrolytic solution
11/29/2006CN2841125Y Series and parallel filtering machine capable of switching-over
11/29/2006CN1869289A Zero drainage circulation ultilization process and equipment of electroplate waste water
11/28/2006US7142000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
11/28/2006US7141156 rigorous control of the relative proportions of respective inorganic and organic ingredients in the electrochemical deposition bath is critical to the achievement of satisfactory results in the rate of metal film formation and the quality of the film so formed
11/28/2006US7140929 Electronic connector terminal, a method for plating, and a terminal stack
11/28/2006US7140883 Contact carriers (tiles) for populating larger substrates with spring contacts
11/23/2006DE102005024771A1 Electro-plating assembly for plastic bathroom fittings agitates fittings through an orbital path using two linked arms
11/23/2006DE102005022692A1 Verfahren zur Herstellung beschichteter Oberflächen und Verwendung derselben A process for preparing coated surfaces, and using the same
11/23/2006DE10120847B4 Verfahren zum galvanischen Abscheiden einer Dispersionsschicht auf einer Oberfläche eines Werkstückes A method for the galvanic deposition of a dispersion layer on a surface of a workpiece
11/22/2006EP1724377A1 Device for electroplating of workpieces and trays for said apparatus
11/22/2006CN1865523A Operation board for electric source for electroplating
11/22/2006CN1865522A Electroplating method and device for automatic separation treatment of electroplating discharging liquid containing heavy metal
11/22/2006CN1865161A Electroplating waste water disposal method
11/22/2006CN1285419C Internal heat spreader plating methods and devices
11/21/2006US7138043 Coating lining on internal combustion engines; corrosion and wear resistance
11/21/2006US7138040 Suppressing the generation of copper or copper oxide particles on anode, use a formed black film composed of copper phosphide and copper chloride formed on the anode surface due to electrolysis
11/15/2006EP1721021A1 Recycling of hot-dip zinc galvanizing bath
11/09/2006WO2006118537A1 Method for adsorption of metal and an adsorption material directed thereto and method for re-use of the adsorption material
11/09/2006WO2006117035A1 Electrolytic cell
11/08/2006CN1860259A A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
11/08/2006CN1283847C Electro-plating apparatus and method
11/07/2006CA2372730C Electrolytic phosphate chemical treatment method
11/02/2006WO2006074412A3 Anodizing system with a coating thickness monitor and an anodized product
11/02/2006US20060246591 Method and device for controlling at least one operating parameter of an electrolytic bath
11/02/2006US20060243604 Method and apparatus for treating waste water
11/01/2006CN1856596A Electrochemical deposition chambers for depositing materials onto microfeature workpieces
11/01/2006CN1854352A Galvanic bath
11/01/2006CN1282616C Recovering and using technology of water in electroplating
10/2006
10/31/2006US7128985 Anodizing system with a coating thickness monitor and an anodized product
10/18/2006EP1711961A2 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
10/18/2006CN2828067Y Real-time monitoring device for concentration of additive in electrolyte
10/17/2006US7124120 Method and apparatus for real time monitoring of electroplating bath performance and early fault detection
10/17/2006US7122387 Deposition stop time detection apparatus and methods for fabricating copper wiring using the same
10/17/2006US7122105 Use of siderophores to increase the current efficiency of iron plating solutions
10/12/2006WO2006074106A3 A system capable of determining applied and anodized coating thickness of a coated-anodized product
10/11/2006CN1844485A Process for electrodeposition preparation of orientated short fiber reinforced metal -base composite materials
10/11/2006CN1279218C Anodization device and anodization method
10/10/2006US7118664 plating in fine channels or in opening portions in a resist formed on a substrate surface after deaerating dissolved gas in the plating solution without needing to add a surface active agent
10/05/2006US20060219564 Conductivity sensor and manufacturing method therefor
10/04/2006CN2823247Y Solar energy assisted heating vacuum evaporation concentrating device
10/04/2006CN1840218A Method for preparing environment-friendly electroplating powder
10/03/2006US7115196 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
09/2006
09/28/2006US20060213777 Discharge surface treatment method and discharge surface treatment apparatus
09/28/2006DE202005007535U1 Device for protecting anodes in electroplating with a frame attached to the anode and a protective cover attached to the frame useful for anode protection in electroplating avoids disturbance of electroplating conditions by anode slime
09/27/2006EP1705268A2 Plating apparatus for dental products
09/27/2006EP1360348A4 Method and apparatus for controlling thickness uniformity of electroplated layer
09/27/2006EP1354078A4 Spouted bed apparatus for contacting objects with a fluid
09/27/2006EP1295312A4 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
09/26/2006US7112264 For performing plating on a long conductive substrate
09/21/2006US20060207887 Monitoring apparatus and method for improving the accuracy and repeatability of electrochemical capacitance voltage (ecv) measurements
09/20/2006CN1835191A Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof
09/20/2006CN1834307A Zn-Ni-Al2O3 nano composite deposit and its prepn. process
09/19/2006US7108776 Plating apparatus and plating method
09/19/2006CA2262311C Method and apparatus for anodizing objects
09/14/2006WO2006095817A1 Base material processing apparatus and base material processing method
09/14/2006DE10210941B4 Anlage zum Behandeln von Gegenständen Plant for the treatment of Objects
09/13/2006CN2816055Y Heat-exchanging type Heshi tank structure
09/08/2006WO2005090644A3 Wireless electrolytic cell monitoring powered by ultra low bus voltage
09/08/2006WO2005090639A3 Monitoring electrolytic cell currents
09/07/2006US20060199381 Electro-chemical deposition apparatus and method of preventing cavities in an ecd copper film
09/07/2006DE102005009024A1 Verfahren und System zum Steuern einer Substratposition in einem elektrochemischen Prozess A method and system for controlling a position of the substrate in an electrochemical process,
09/05/2006US7101517 Processing solution preparation and supply method and apparatus
08/2006
08/31/2006US20060191795 Apparatus and method for electrochemically processing a microelectronic workpiece
08/30/2006EP1694885A2 Multi-chemistry plating system
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