Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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10/30/2007 | US7288178 Electrochemistry extrusion; three-dimensional structure; conformable contact masking |
10/30/2007 | US7288177 Selective shield/material flow mechanism |
10/30/2007 | US7288170 Generation. conditioning , reuse of metal containing electrolytes; surface treatment; ion exchanging |
10/25/2007 | WO2007120357A2 Electrochemical processing with dynamic process control |
10/24/2007 | EP0795200B1 Mounting electronic components to a circuit board |
10/23/2007 | US7285191 Phosphate film processing method and phosphate film processing device |
10/18/2007 | WO2007116775A1 Washing apparatus, apparatus for manufacturing plating-filmed web, washing process, and process for manufacturing plating-filmed web |
10/18/2007 | US20070240993 Electrochemical deposition method, electrochemical deposition apparatus, and microstructure |
10/18/2007 | DE102006018076A1 Production of molded parts used in dentistry comprises using galvanic deposition based on a temporarily changing progression of the voltage or current strength which can be partially adjusted |
10/17/2007 | CN100343423C Electrolytic copper plating method phosphorous cooper anode for electrolytic copper plating method said semiconductor wafer having low particle adhension plated with said method and anode |
10/16/2007 | US7282124 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
10/11/2007 | US20070235341 Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method |
10/10/2007 | CN100342062C Electroplate device, electroplate method and method for manufacturing semiconductor device |
10/09/2007 | US7279084 In an electroplating cell, providing an anode chamber with at least two concentric anodes, generating a computer generated model with a simulation computer program; and selecting at least one current ratio from the model |
10/09/2007 | US7279079 Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method |
10/04/2007 | US20070228110 Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out |
10/04/2007 | DE102007013763A1 Elektroplattierungsverfahren Electroplating |
10/03/2007 | EP1839013A2 Anodizing system with a coating thickness monitor and an anodized product |
10/03/2007 | EP1250288B1 A method for treatment of hexavalent chromium compounds in waste water originating from processing of metals |
09/27/2007 | US20070221502 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
09/25/2007 | US7274463 Anodizing system with a coating thickness monitor and an anodized product |
09/25/2007 | US7273540 Electrolytic plating using a solution of water, a sulfonic acid, and tin, copper, and silver ions, and an organic complexing agent; separating a solution around a soluble anode from the plating solution on a cathode side by a non-ionic micro-porous membrane |
09/25/2007 | US7273539 Applying a potential between the two electrodes forming a film of copper, silver or gold; and boron, aluminum, gallium, indium or thallium; and selenium; regenerating the selenium by introducing oxides of Indium hydroxide, indium oxide, copper oxide or copper hydroxide |
09/25/2007 | US7273535 Insoluble anode with an auxiliary electrode |
09/19/2007 | EP1784527A4 Chromium plating method |
09/19/2007 | CN100338263C Combination liquid dispenser and electrochemical cell |
09/19/2007 | CN100337932C Advanced electrodeionization for fluid recycling |
09/18/2007 | US7271888 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures |
09/18/2007 | US7270733 Providing a multi-component electrolyte solution, obtaining a sample set, wherein each sample of sample set comprises an electrolyte solution, obtaining an electroanalytical response for sample, obtaining a training set, analyzing training set using decomposition and multivariate regression, validating |
09/13/2007 | WO2007103304A2 A mobile apparatus capable of surface measurements of a coating thickness |
09/13/2007 | WO2007102605A1 Plating method, electroconductive film, process for producing the electroconductive film, and light-transparent electromagnetic wave shielding film |
09/12/2007 | EP1831435A2 Method for continuously operating acid or alkaline zinc or zinc alloy baths |
09/12/2007 | CN100337111C Improved method for analysis of three organic additives in an acid copper plating bath |
09/11/2007 | US7267749 Workpiece processor having processing chamber with improved processing fluid flow |
09/05/2007 | EP1828441A1 Electrodeposition coating installation |
09/05/2007 | CN200943108Y Liquid make-up feeding device |
09/04/2007 | US7264704 Simplification, efficiency |
09/04/2007 | US7264698 Apparatus and methods for electrochemical processing of microelectronic workpieces |
08/30/2007 | US20070202246 Designing a plated pattern in printed wiring board |
08/29/2007 | EP1826294A1 Process for electroplating metallic and metal matrix composite foils and microcomponents |
08/29/2007 | CN200940168Y Electroplating wastewater trough side recovery equipment |
08/29/2007 | CN101024890A Wire material electroplating or pretreating heating technology |
08/29/2007 | CN101024205A Methods for removing metals from plating operation |
08/22/2007 | CN2937161Y Electroplating liquid circulation device for electroplating production |
08/22/2007 | CN1333442C Plating system with remote secondary anode for semiconductor manufacturing |
08/22/2007 | CN101023204A Plating apparatus |
08/22/2007 | CN101021388A Double-source induced-draught cooling method and its device |
08/15/2007 | CN2934274Y Electric plating automatic adding device |
08/15/2007 | CN101016647A Controlling device for electrodeposition process |
08/15/2007 | CN101016645A Plating apparatus, plating cup and cathode ring |
08/15/2007 | CN101016644A Internal heat spreader plating methods and systems |
08/15/2007 | CN101015875A Brazing procedure of aluminium electric-magnetic wires and Guinea gold |
08/09/2007 | WO2007088008A2 Method and device for coating substrate surfaces |
08/09/2007 | US20070181431 Methods and Apparatus for Monitoring Deposition Quality During Conformable Contact Mask Plating Operations |
08/09/2007 | US20070181430 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating; etching; electropolishing |
08/08/2007 | EP1816237A1 Process and apparatus for the coating of surfaces of substrate |
08/08/2007 | EP1476590B1 Method for preventing deterioration of a plating solution when the operation of the plating equipment is interrupted |
08/02/2007 | US20070176619 Probe For Semiconductor Devices |
08/02/2007 | US20070175762 Thickness distribution control for electroplating |
08/01/2007 | EP1813697A2 Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance |
08/01/2007 | CN1329946C Method of forming semiconductor apparatus |
08/01/2007 | CN101008097A Process for removing harmful matter hexavalent chromium of electroplating layer |
07/26/2007 | WO2007082528A1 Method for producing an alloy having a predetermined composition with three or more components |
07/25/2007 | EP1811063A1 Tin-zinc alloy electroplating method |
07/25/2007 | CN101004402A Method for monitoring porefilling capability of copper electroplating solution |
07/25/2007 | CN101004401A Method for analyzing accelerating agent of electro coppering, and deposited electrolyte |
07/19/2007 | WO2007082275A2 Thickness distribution control for electroplating |
07/19/2007 | DE102005062134A1 Galvanically coating components comprises using an arrangement with a pretreatment section, a galvanic section , and a post treatment section |
07/18/2007 | CN1327039C Technology for treating electroplating effluent by biochemical process |
07/18/2007 | CN101001982A Tin-zinc alloy electroplating method |
07/17/2007 | US7244347 Method and system to provide electrical contacts for electrotreating processes |
07/12/2007 | US20070158202 Plating apparatus and method for controlling plating solution |
07/12/2007 | US20070158201 Electrochemical processing with dynamic process control |
07/12/2007 | DE19735244B4 Verfahren und Vorrichtung zum Verchromen von Werkstücken Method and apparatus for chroming of workpieces |
07/11/2007 | CN1325699C Method and conveyorized system for electorlytically processing work pieces |
07/10/2007 | US7241372 rotating substrate holding member to remove plating liquid; and sucking liquid remaining on the substrate-contacting portion or in its vicinity, while the holding member is rotated |
07/05/2007 | DE102005062728A1 Verfahren und Anordnung zur Bestimmung der Stromdichtenverteilung in einem Elektrolytbad Method and arrangement for determining the current density distribution in an electrolytic bath |
07/04/2007 | EP1803837A1 Process and apparatus for cleaning of processing solutions |
07/04/2007 | CN1993502A Method of electric tinning |
07/04/2007 | CN1993500A Chromium plating method |
07/03/2007 | US7238265 Electroplating apparatus with functions of voltage detection and flow rectification |
06/28/2007 | WO2005111275A3 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions |
06/28/2007 | US20070144894 Robot system and method for cathode stripping in electrometallurgical and industrial processes |
06/26/2007 | CA2286326C Article, method, and apparatus for electrochemical fabrication |
06/14/2007 | US20070135022 Apparatus for reduction of defects in wet procssed layers |
06/14/2007 | US20070131542 Apparatus and methods for electrochemical processing of microelectronic workpieces |
06/13/2007 | CN1321226C Plating machine and process for producing film carrier tapes for mounting electronic parts |
06/12/2007 | US7229916 Method of manufacturing a semiconductor device |
06/12/2007 | US7229543 Apparatus for controlling and/or measuring additive concentration in an electroplating bath |
06/07/2007 | US20070125656 Controlling the thickness of wafers during the electroplating process |
06/07/2007 | US20070125641 Method for defining status index in copper electrolysis |
06/06/2007 | EP1793017A1 Plating apparatus and plating liquid removing method |
06/06/2007 | EP1721021B1 Recycling of hot-dip zinc galvanizing bath |
06/06/2007 | CN1974879A Method and device for the purification of process solutions |
06/06/2007 | CN1974878A Process of recovering hexavalent chromium from chromium plating rinsing solution |
06/06/2007 | CN1974877A Waste chromium plating solution treating process |
06/06/2007 | CN1974871A Double titanium-base anode voltage controlling system for continuous strip steel galvanizing electrobath |
06/06/2007 | CN1974849A Combined treating process of sludge from Cu and Sn electroplating and circuit board etching solution |
06/05/2007 | US7226634 Dividing into mesh-like plating zones; measuring; calibration; determination of film thickness |
06/05/2007 | US7225538 Resilient contact structures formed and then attached to a substrate |