Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798)
10/2007
10/30/2007US7288178 Electrochemistry extrusion; three-dimensional structure; conformable contact masking
10/30/2007US7288177 Selective shield/material flow mechanism
10/30/2007US7288170 Generation. conditioning , reuse of metal containing electrolytes; surface treatment; ion exchanging
10/25/2007WO2007120357A2 Electrochemical processing with dynamic process control
10/24/2007EP0795200B1 Mounting electronic components to a circuit board
10/23/2007US7285191 Phosphate film processing method and phosphate film processing device
10/18/2007WO2007116775A1 Washing apparatus, apparatus for manufacturing plating-filmed web, washing process, and process for manufacturing plating-filmed web
10/18/2007US20070240993 Electrochemical deposition method, electrochemical deposition apparatus, and microstructure
10/18/2007DE102006018076A1 Production of molded parts used in dentistry comprises using galvanic deposition based on a temporarily changing progression of the voltage or current strength which can be partially adjusted
10/17/2007CN100343423C Electrolytic copper plating method phosphorous cooper anode for electrolytic copper plating method said semiconductor wafer having low particle adhension plated with said method and anode
10/16/2007US7282124 Device providing electrical contact to the surface of a semiconductor workpiece during processing
10/11/2007US20070235341 Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method
10/10/2007CN100342062C Electroplate device, electroplate method and method for manufacturing semiconductor device
10/09/2007US7279084 In an electroplating cell, providing an anode chamber with at least two concentric anodes, generating a computer generated model with a simulation computer program; and selecting at least one current ratio from the model
10/09/2007US7279079 Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method
10/04/2007US20070228110 Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
10/04/2007DE102007013763A1 Elektroplattierungsverfahren Electroplating
10/03/2007EP1839013A2 Anodizing system with a coating thickness monitor and an anodized product
10/03/2007EP1250288B1 A method for treatment of hexavalent chromium compounds in waste water originating from processing of metals
09/2007
09/27/2007US20070221502 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
09/25/2007US7274463 Anodizing system with a coating thickness monitor and an anodized product
09/25/2007US7273540 Electrolytic plating using a solution of water, a sulfonic acid, and tin, copper, and silver ions, and an organic complexing agent; separating a solution around a soluble anode from the plating solution on a cathode side by a non-ionic micro-porous membrane
09/25/2007US7273539 Applying a potential between the two electrodes forming a film of copper, silver or gold; and boron, aluminum, gallium, indium or thallium; and selenium; regenerating the selenium by introducing oxides of Indium hydroxide, indium oxide, copper oxide or copper hydroxide
09/25/2007US7273535 Insoluble anode with an auxiliary electrode
09/19/2007EP1784527A4 Chromium plating method
09/19/2007CN100338263C Combination liquid dispenser and electrochemical cell
09/19/2007CN100337932C Advanced electrodeionization for fluid recycling
09/18/2007US7271888 Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
09/18/2007US7270733 Providing a multi-component electrolyte solution, obtaining a sample set, wherein each sample of sample set comprises an electrolyte solution, obtaining an electroanalytical response for sample, obtaining a training set, analyzing training set using decomposition and multivariate regression, validating
09/13/2007WO2007103304A2 A mobile apparatus capable of surface measurements of a coating thickness
09/13/2007WO2007102605A1 Plating method, electroconductive film, process for producing the electroconductive film, and light-transparent electromagnetic wave shielding film
09/12/2007EP1831435A2 Method for continuously operating acid or alkaline zinc or zinc alloy baths
09/12/2007CN100337111C Improved method for analysis of three organic additives in an acid copper plating bath
09/11/2007US7267749 Workpiece processor having processing chamber with improved processing fluid flow
09/05/2007EP1828441A1 Electrodeposition coating installation
09/05/2007CN200943108Y Liquid make-up feeding device
09/04/2007US7264704 Simplification, efficiency
09/04/2007US7264698 Apparatus and methods for electrochemical processing of microelectronic workpieces
08/2007
08/30/2007US20070202246 Designing a plated pattern in printed wiring board
08/29/2007EP1826294A1 Process for electroplating metallic and metal matrix composite foils and microcomponents
08/29/2007CN200940168Y Electroplating wastewater trough side recovery equipment
08/29/2007CN101024890A Wire material electroplating or pretreating heating technology
08/29/2007CN101024205A Methods for removing metals from plating operation
08/22/2007CN2937161Y Electroplating liquid circulation device for electroplating production
08/22/2007CN1333442C Plating system with remote secondary anode for semiconductor manufacturing
08/22/2007CN101023204A Plating apparatus
08/22/2007CN101021388A Double-source induced-draught cooling method and its device
08/15/2007CN2934274Y Electric plating automatic adding device
08/15/2007CN101016647A Controlling device for electrodeposition process
08/15/2007CN101016645A Plating apparatus, plating cup and cathode ring
08/15/2007CN101016644A Internal heat spreader plating methods and systems
08/15/2007CN101015875A Brazing procedure of aluminium electric-magnetic wires and Guinea gold
08/09/2007WO2007088008A2 Method and device for coating substrate surfaces
08/09/2007US20070181431 Methods and Apparatus for Monitoring Deposition Quality During Conformable Contact Mask Plating Operations
08/09/2007US20070181430 Contact substrate with conformation masking pattern on substrate; multilayer; three-dimensional structure; cyclic process; electroplating; etching; electropolishing
08/08/2007EP1816237A1 Process and apparatus for the coating of surfaces of substrate
08/08/2007EP1476590B1 Method for preventing deterioration of a plating solution when the operation of the plating equipment is interrupted
08/02/2007US20070176619 Probe For Semiconductor Devices
08/02/2007US20070175762 Thickness distribution control for electroplating
08/01/2007EP1813697A2 Low cost, environmentally favorable, chromium plate replacement coating for improved wear performance
08/01/2007CN1329946C Method of forming semiconductor apparatus
08/01/2007CN101008097A Process for removing harmful matter hexavalent chromium of electroplating layer
07/2007
07/26/2007WO2007082528A1 Method for producing an alloy having a predetermined composition with three or more components
07/25/2007EP1811063A1 Tin-zinc alloy electroplating method
07/25/2007CN101004402A Method for monitoring porefilling capability of copper electroplating solution
07/25/2007CN101004401A Method for analyzing accelerating agent of electro coppering, and deposited electrolyte
07/19/2007WO2007082275A2 Thickness distribution control for electroplating
07/19/2007DE102005062134A1 Galvanically coating components comprises using an arrangement with a pretreatment section, a galvanic section , and a post treatment section
07/18/2007CN1327039C Technology for treating electroplating effluent by biochemical process
07/18/2007CN101001982A Tin-zinc alloy electroplating method
07/17/2007US7244347 Method and system to provide electrical contacts for electrotreating processes
07/12/2007US20070158202 Plating apparatus and method for controlling plating solution
07/12/2007US20070158201 Electrochemical processing with dynamic process control
07/12/2007DE19735244B4 Verfahren und Vorrichtung zum Verchromen von Werkstücken Method and apparatus for chroming of workpieces
07/11/2007CN1325699C Method and conveyorized system for electorlytically processing work pieces
07/10/2007US7241372 rotating substrate holding member to remove plating liquid; and sucking liquid remaining on the substrate-contacting portion or in its vicinity, while the holding member is rotated
07/05/2007DE102005062728A1 Verfahren und Anordnung zur Bestimmung der Stromdichtenverteilung in einem Elektrolytbad Method and arrangement for determining the current density distribution in an electrolytic bath
07/04/2007EP1803837A1 Process and apparatus for cleaning of processing solutions
07/04/2007CN1993502A Method of electric tinning
07/04/2007CN1993500A Chromium plating method
07/03/2007US7238265 Electroplating apparatus with functions of voltage detection and flow rectification
06/2007
06/28/2007WO2005111275A3 Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
06/28/2007US20070144894 Robot system and method for cathode stripping in electrometallurgical and industrial processes
06/26/2007CA2286326C Article, method, and apparatus for electrochemical fabrication
06/14/2007US20070135022 Apparatus for reduction of defects in wet procssed layers
06/14/2007US20070131542 Apparatus and methods for electrochemical processing of microelectronic workpieces
06/13/2007CN1321226C Plating machine and process for producing film carrier tapes for mounting electronic parts
06/12/2007US7229916 Method of manufacturing a semiconductor device
06/12/2007US7229543 Apparatus for controlling and/or measuring additive concentration in an electroplating bath
06/07/2007US20070125656 Controlling the thickness of wafers during the electroplating process
06/07/2007US20070125641 Method for defining status index in copper electrolysis
06/06/2007EP1793017A1 Plating apparatus and plating liquid removing method
06/06/2007EP1721021B1 Recycling of hot-dip zinc galvanizing bath
06/06/2007CN1974879A Method and device for the purification of process solutions
06/06/2007CN1974878A Process of recovering hexavalent chromium from chromium plating rinsing solution
06/06/2007CN1974877A Waste chromium plating solution treating process
06/06/2007CN1974871A Double titanium-base anode voltage controlling system for continuous strip steel galvanizing electrobath
06/06/2007CN1974849A Combined treating process of sludge from Cu and Sn electroplating and circuit board etching solution
06/05/2007US7226634 Dividing into mesh-like plating zones; measuring; calibration; determination of film thickness
06/05/2007US7225538 Resilient contact structures formed and then attached to a substrate
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