| Patents for C25D 21 - Processes for servicing or operating cells for electrolytic coating (5,798) |
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| 05/15/2008 | US20080110856 Manufacture of devices having complex structures by selective electroplating of layers that include both structural materials (metals) and support (sacrificial) materials; removal(etching, melting, or electrolytically dissolving) of the support defines a microscopicelement for an electrical device |
| 05/15/2008 | US20080110751 Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece |
| 05/14/2008 | CN101177789A Device for processing foreign ion in chromium plating liquid |
| 05/13/2008 | US7371312 Using cell voltage as a monitor for deposition coverage |
| 05/13/2008 | US7371311 Modified electroplating solution components in a low-acid electrolyte solution |
| 05/08/2008 | US20080105555 Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device |
| 05/07/2008 | CN100386475C Water comprehensive utilization technology for cleaning electroplating nickel |
| 05/07/2008 | CN100386474C Fountain bed with fluid contacting with substance |
| 05/06/2008 | US7368043 Configurations and methods of electrochemical lead recovery from contaminated soil |
| 05/06/2008 | CA2205439C Method and device for galvanising plate-shaped products in horizontal continuous plants |
| 05/01/2008 | US20080102251 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits; chemical mechanical polishing |
| 05/01/2008 | US20080099338 Depositing a first pattern onto a substrate using the first mask to forming a first layer, removing the first mask, depositing a second material, building additional layers adjacent to and adhered to previously formed layers; removing undesired elements of material via etching or electropolishing |
| 04/29/2008 | US7364664 Blocks off a portion of flow of liquid used in a flow process (e.g., plating solution for formimg a bump electrode), by using a partition plate whose lower end is in close contact with a bottom of a plating tank and whose upper end is at a position lower than a liquid surface |
| 04/24/2008 | WO2008047509A1 Plating apparatus |
| 04/23/2008 | EP1252374B1 Process for the extended use of electrolytes |
| 04/22/2008 | US7361225 Liquid tank |
| 04/17/2008 | WO2007088008A3 Method and device for coating substrate surfaces |
| 04/16/2008 | CN100382235C Electroplating and/or electropolishing stand and method for electroplating and/or electropolishing wafers |
| 04/16/2008 | CN100381617C Conveyorized horizontal processing line and method of wet-processing a workpiece |
| 04/10/2008 | DE19717489B4 Anordnung zur elektrogalvanischen Metallbeschichtung eines Bandes Arrangement for electro-galvanic metal coating of a band |
| 04/03/2008 | WO2008022316A3 Method and system for depositing alloy composition |
| 04/02/2008 | CN100378253C Electroplating device, electroplating cup and cathode ring |
| 04/01/2008 | US7352196 Probe card assembly and kit |
| 04/01/2008 | US7351321 Electroplating metal onto substrate in pattern corresponding to complement of conformable mask; forming multilayer, three-dimensional structure |
| 03/26/2008 | CN101148775A Explosion-resisting method and device for electro-galvanizing zinc dissolving station |
| 03/25/2008 | US7349755 Electrocoat management system |
| 03/25/2008 | US7347702 Contact carriers (tiles) for populating larger substrates with spring contacts |
| 03/18/2008 | CA2411562C Method and apparatus for treating an aqueous electroplating bath solution |
| 03/11/2008 | US7341634 Apparatus for and method of processing substrate |
| 03/05/2008 | EP1558794A4 Measurement of the concentration of a reducing agent in an electroless plating bath |
| 03/04/2008 | US7338586 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 02/28/2008 | WO2008023778A1 Plating solution regenerating apparatus and method of regenerating plating solution |
| 02/28/2008 | US20080047829 Plating Apparatus |
| 02/27/2008 | EP1516076B1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| 02/27/2008 | CN100371504C Method for removing chromic anhydride after muffler being chromeplated |
| 02/21/2008 | DE202007015737U1 Anordnung zur Echtzeitmessung der Stromdichte in einem Elektrolytbad Arrangement for real-time measurement of the current density in an electrolytic bath |
| 02/21/2008 | DE102006037926A1 Monitor for the function of a three-phase alternating current drive, especially for an electroplating drum, has sensors at the phase conductors to detect an asymmetry in their current flows |
| 02/20/2008 | CN201024222Y Electric plating solution rinsing regenerated and reutilized device |
| 02/19/2008 | US7332066 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus |
| 02/14/2008 | US20080035475 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating |
| 02/13/2008 | EP1887108A1 Gravure cylinder-use copper plating method and device |
| 02/12/2008 | US7329335 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
| 02/07/2008 | WO2008014987A2 Method for deposition of chromium layers as hard- chrome plating, electroplating bath and hard- chrome surfaces |
| 02/06/2008 | EP1884278A1 Apparatus and method for rinsing of liquid from work pieces |
| 01/31/2008 | US20080023335 Method of fabricating semiconductor device, and plating apparatus |
| 01/30/2008 | CN101114590A Method of fabricating semiconductor device, and plating apparatus |
| 01/29/2008 | US7323096 Electrochemical treatment on an object to be treated, capable of avoiding contact between the object and the atmosphere, uniformly activating the surface of the object with precision, obtaining a good precipitation of metal ion Oon surface |
| 01/29/2008 | US7323095 Integrated multi-step gap fill and all feature planarization for conductive materials |
| 01/29/2008 | US7323094 For electroplating metal-containing layers on semiconductor substrates |
| 01/23/2008 | EP1881091A1 Process and apparatus for controlling the plating result on a substrate surface |
| 01/23/2008 | CN101109099A Control method based on industry ethernet plating production process |
| 01/16/2008 | CN101104947A Electric plating power supply controller with network transmission and control function |
| 01/16/2008 | CN100362142C Method for recovering and treating chromium from waste chromium electrodeposition solution |
| 01/10/2008 | WO2004074553A3 Plating using an insoluble anode and seperately supplied plating material |
| 01/10/2008 | US20080006307 Substrate proximity processing structures |
| 01/10/2008 | US20080005878 Process for the production of electrolyte capacitors |
| 01/10/2008 | DE102006030680A1 Improving the desludging and precipitating characteristics of unwanted substances, ions or sludges during treatment of metallic work-pieces comprises separating the sludge by filtration, sedimentation or other sludge separation equipments |
| 01/09/2008 | CN201003078Y Copper powder reclamation and drainage water purification and circulation device |
| 01/09/2008 | CN201003077Y Electromoulding supercharger |
| 01/09/2008 | CN101100762A Regeneration treating agent for chloride zinc coating solution and solution regeneration treating method |
| 01/08/2008 | CA2219916C Preparation of pre-coated aluminum alloy articles |
| 01/03/2008 | WO2007120357A3 Electrochemical processing with dynamic process control |
| 01/03/2008 | US20080000777 Electroplating using an apparatus having a preferential barrier between electrodes, comprising adjustable apertures used for controlling the amount of electric flux and the distribution of coatings on substrates such as electronics and semiconductor chips |
| 01/02/2008 | CN100358644C Metal wire on-line purger |
| 01/02/2008 | CN100358642C Preparation of aluminium alloy part with precoating |
| 12/26/2007 | CN101092662A Technique and equipment for treating electroplating sludge |
| 12/25/2007 | US7311811 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
| 12/21/2007 | WO2007146609A2 Wireless monitoring of two or more electrolytic cells using one monitoring device |
| 12/19/2007 | EP1694885A4 Multi-chemistry plating system |
| 12/19/2007 | CN100355947C Tumble-plating device |
| 12/18/2007 | US7309413 Providing electrical contact to the surface of a semiconductor workpiece during processing |
| 12/13/2007 | US20070285114 Socket For Making With Electronic Component, Particularly Semiconductor Device With Spring Packaging, For Fixturing, Testing, Burning-In Or Operating Such A Component |
| 12/12/2007 | CN101087902A Electrodip coating equipment |
| 12/05/2007 | CN200985366Y Device for filtering forming liquid |
| 11/29/2007 | WO2007001334A3 Activation of aluminum for electrodeposition or electroless deposition |
| 11/29/2007 | US20070272441 Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device |
| 11/28/2007 | EP1860212A1 Base material processing apparatus and base material processing method |
| 11/28/2007 | EP1419378A4 Improved method for analysis of three organic additives in an acid copper plating bath |
| 11/28/2007 | CN100351434C Electroplating device and method thereof |
| 11/27/2007 | CA2340907C Sink roll blade apparatus used in continuous molten metal plating apparatus and method for preventing occurrence of dents |
| 11/22/2007 | WO2002063069A3 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| 11/22/2007 | DE102004021214B4 Verfahren und Vorrichtung zur Inertisierung der Umgebung eines laufenden Bandmaterials nach einer Tauchbehandlung Method and apparatus for inerting the environment of a running strip material after an immersion treatment |
| 11/21/2007 | CN100350078C Method for copperizing continuously |
| 11/15/2007 | US20070261963 Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions |
| 11/14/2007 | EP1853520A1 Method for adsorption of metal and an adsorption material directed thereto and method for re-use of the adsorption material |
| 11/14/2007 | CN101070604A Electroplating method |
| 11/14/2007 | CN100348781C Continuous cyclone clarification treatment device for electroplating waste water |
| 11/13/2007 | US7294244 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 11/13/2007 | US7293571 Substrate proximity processing housing and insert for generating a fluid meniscus |
| 11/08/2007 | WO2007103304A3 A mobile apparatus capable of surface measurements of a coating thickness |
| 11/08/2007 | WO2006066689A3 Method for continuously operating acid or alkaline zinc or zinc alloy baths |
| 11/08/2007 | US20070256940 Device and Method for Removing Foreign Matter from Process Solutions |
| 11/07/2007 | CN101067211A Electrolytic copper foil surface process or column driving control method |
| 11/06/2007 | US7291253 Detection of an unstable additive breakdown product in a plating bath |
| 10/31/2007 | EP1849891A1 Galvanic plant with conveying device for the movement of the rack |
| 10/31/2007 | EP1849890A1 Galvanic plant with conveying device for the movement of the rack |
| 10/31/2007 | DE102004061255B4 Verfahren für den kontinuierlichen Betrieb von sauren oder alkalischen Zink- oder Zinklegierungsbädern und Vorrichtung zur Durchführung desselben The same procedure used for the continuous operation of acidic or alkaline zinc or zinc alloy bath and apparatus for performing |
| 10/31/2007 | CN100346007C Device and method for monitoring an electrolytic process |
| 10/31/2007 | CN100346005C Heating temperature control and stirring equipment for electric plating and chemical plating |
| 10/31/2007 | CN100346004C Method and apparatus for controlling deposition on predetermined portions of a workpiece |