Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
01/2004
01/15/2004DE10228400A1 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards
01/14/2004CN2599018Y Improved continuous terminal electroplating
01/13/2004US6676822 Method for electro chemical mechanical deposition
01/13/2004US6675984 Metal finishing barrel cover locking system
01/08/2004WO2004003663A2 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
01/08/2004WO2004003258A2 Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied
01/07/2004EP1377361A1 Tubular electrodialysis and electrodeposition membrane electrode device
01/07/2004CN2597490Y Special clamp device for electroplating technique of gear internal hole surface
01/06/2004US6673218 Cathode cartridge for electropating tester
01/02/2004EP1375043A1 Process for charge wise coating of saw wire
01/01/2004US20040001922 Method for the batch coating of saw wire
01/01/2004US20040000487 Adjust pattern configuration of passageway; fluid flow of electrolyte
12/2003
12/31/2003WO2004001813A2 Substrate holder and plating apparatus
12/31/2003WO2004001178A2 Method and apparatus for downhole pipe or casing repair
12/31/2003WO2004001100A1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
12/24/2003WO2002070144A8 Internal heat spreader plating methods and devices
12/24/2003CN1463467A Electrolytic processing device and substrate processing appts.
12/23/2003US6666961 High differential pressure electrochemical cell
12/23/2003US6666960 Electroplating current supply system
12/23/2003US6666959 Semiconductor workpiece proximity plating methods and apparatus
12/18/2003WO2003105546A1 Method and device for treating flat and flexible work pieces
12/18/2003WO2003105200A1 Substrate processing apparatus and substrate processing method
12/18/2003US20030230481 Flake-resistant multilayer thin-film electrodes and electrolytic cells incorporating same
12/16/2003US6664169 Process for producing semiconductor member, process for producing solar cell, and anodizing apparatus
12/11/2003WO2003103025A2 Method and apparatus of sealing wafer backside for full-face electrochemical plating
12/11/2003WO2002075792A3 Method of sealing wafer backside for full-face electronchemical plating
12/11/2003US20030226764 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
12/10/2003EP1369099A2 Improvements in stent manufacture
12/10/2003CN1461358A Porous nickel foil for alkaline battery cathode, production method and device therefor
12/09/2003US6660139 Plating apparatus and method
12/09/2003US6660137 System for electrochemically processing a workpiece
12/04/2003WO2003099519A1 Polishing pad for electrochemical-mechanical polishing and methods to manufacture it
12/04/2003US20030221968 Electrochemical fabrication method and apparatus for producing three-dimensional structures having improved surface finish
12/04/2003US20030221957 Anode impedance control through electrolyte flow control
12/04/2003US20030221956 Anode slime reduction method while maintaining low current
12/04/2003US20030221953 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
12/03/2003CN2589490Y Pitch adjustable galvanizing cup of anode, cathode and even flow plate in disk stage packaging
12/03/2003CN1460134A Copper-plating solution, plating method and plating apparatus
12/03/2003CN1459519A Conveyer for electroplating system
12/02/2003US6656275 Partial plating system
11/2003
11/27/2003US20030217932 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/27/2003US20030217927 Long-life workpiece surface influencing device structure and manufacturing method
11/27/2003US20030217916 Electroplating reactor
11/26/2003CN2587889Y Electric deposition equipment for making high-porosity metal strip material
11/25/2003US6652731 Comprises 2,3,4-trihydroxybenzaldehyde for inhibiting consumption of plating additives; integrated circuits
11/25/2003US6652657 Method for electrochemically treating articles and apparatus and method for cleaning articles
11/20/2003WO2003023825A3 Substrate processing apparatus
11/20/2003WO2002072924A3 Device and method for regenerating solutions containing chromic acid in electrolytic chroming baths
11/13/2003WO2003092891A1 Device and method for increasing mass transport at liquid-solid diffusion boundary layer
11/13/2003US20030211674 Electrode for electroplating planar structures
11/13/2003US20030209445 Forming electrical contactors; uniform electrodeposition; integrated circuits
11/13/2003US20030209443 Substrate support with fluid retention band
11/13/2003US20030209429 Method and apparatus for processing a substrate with minimal edge exclusion
11/13/2003US20030209425 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/13/2003DE10019713C2 Vorrichtung und Verfahren zur elektrischen Kontaktierung von elektrolytisch zu behandelndem Gut in Durchlaufanlagen Apparatus and method for electrically contacting electrolytic material to be treated in continuous flow systems
11/12/2003EP1360348A1 Method and apparatus for controlling thickness uniformity of electroplated layer
11/12/2003CN1455947A Substrate processing apparatus
11/12/2003CN1455027A Combined-box plating apparatus of crystallizer copper plate for continuous caster
11/06/2003WO2003091165A1 Mediated electrochemical oxidation process used as a hydrogen fuel generator
11/06/2003US20030205480 Anodizing method and apparatus and semiconductor substrate manufacturing method
11/06/2003US20030205477 Periodically alternating between an electrodeposition process and electropolishing process with respect to the second electrode.
11/06/2003US20030205462 Electrode characterized by highly adhering superficial catalytic layer
11/05/2003EP1358366A2 Improved electrophoretic deposition
11/05/2003CN2584617Y Duoble-deck combined electroplating rack
11/05/2003CN1454266A Anode assembly for plating and planarizing a conductive layer
11/05/2003CN1454265A Fountain bed with fluid contacting with substance
11/05/2003CN1453398A Hollow ball for barrel plating
11/05/2003CN1126829C Electroplating apparatus
10/2003
10/30/2003US20030201187 Gas liquid phase separator with improved pressure control
10/30/2003US20030201170 Apparatus and method for electropolishing a substrate in an electroplating cell
10/29/2003CN1451788A Cathode chuck of electroplating tester
10/28/2003US6638840 Electrode for electroplating planar structures
10/23/2003WO2003087437A1 Web processing method and apparatus
10/23/2003WO2003087436A1 Electropolishing and/or electroplating apparatus and methods
10/23/2003US20030196904 System and method for electrolytic plating
10/23/2003US20030196892 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
10/23/2003CA2479794A1 Electropolishing and/or electroplating apparatus and methods
10/22/2003EP1354078A1 Spouted bed apparatus for contacting objects with a fluid
10/21/2003US6635232 Dissolving ozone gas into acid solution having specified pH and consisting of water and nitric or sulfuric acid, contacting contaminated object with heated ozone solution to oxidatively dissolve oxide film containing radionuclides
10/16/2003WO2003072853A3 Apparatus with processing stations for manually and automatically processing microelectronic workpieces
10/16/2003US20030192782 Cathode cartridge for electroplating tester
10/15/2003CN2579913Y Floating type anode cover plate
10/15/2003CN1124369C Anodizing processing apparatus and method associated with the same
10/14/2003US6632335 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor
10/14/2003US6632334 Distributed power supplies for microelectronic workpiece processing tools
10/14/2003US6632011 Mixing apparatus
10/09/2003WO2003083185A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
10/09/2003WO2003083184A1 Finishing installation and method for finishing elongated winding material
10/09/2003WO2003038159A3 Method and conveyorized system for electrolytically processing work pieces
10/09/2003US20030188975 Copper anode for semiconductor interconnects
10/09/2003US20030188965 Web processing method and apparatus
10/09/2003CA2469880A1 Conveyorized plating line and method for electrolytically metal plating a workpiece
10/08/2003EP1349629A1 Electrodialysis and electrodeposition membrane electrode device
10/08/2003CN1446946A Technique method for electroplating inner surfaces of gear wheel holes and dedicated equipments
10/07/2003US6630060 Device for carrying out an electro-chemical treatment
10/07/2003US6630059 Workpeice proximity plating apparatus
10/02/2003US20030183532 Process for copper plating a zinc or zinc alloy article comprising the steps of: a. immersing said zinc or zinc alloy article in an aqueous nickel solution, said nickel solution comprising a source of nickel, a source of pyrophosphate, and
10/01/2003EP1348044A1 Device and method for electrochemically treating a band-shaped product
09/2003
09/30/2003US6627055 Manufacture of fine-grained electroplating anodes
09/25/2003WO2003078698A1 Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it
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