| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
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| 11/18/2004 | US20040226816 Plating processing device |
| 11/18/2004 | DE202004013480U1 Dental laboratory assembly for the sintered fabrication of a green body dental crown has first and second electrodes |
| 11/18/2004 | DE10210538B4 Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut Horizontal continuous flow system and method for electroplating treatment of treated |
| 11/17/2004 | EP1477585A2 Electrolytic electrode and process of producing the same |
| 11/17/2004 | CN1547759A Substrate processing apparatus |
| 11/17/2004 | CN1546739A 双导轨传动装置 Dual-rail gear |
| 11/17/2004 | CN1546738A Method and apparatus for electroplating |
| 11/17/2004 | CN1546737A One side electroplating method and apparatus therefor |
| 11/16/2004 | US6818115 For circuit boards; provides improved flow of electrolyte through holes of printed circuit boards, which generates improved throwing power of plating inside through holes and blind vias |
| 11/16/2004 | US6818104 Anodizing apparatus |
| 11/11/2004 | US20040222085 Configurations and methods of electrochemical lead recovery from contaminated soil |
| 11/10/2004 | EP1222321B9 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 11/09/2004 | US6814851 Method and apparatus for an anodic treatment |
| 11/09/2004 | US6814841 Controlling aperture valve in response to pressure |
| 11/04/2004 | WO2004094702A2 Multi-chemistry plating system |
| 11/04/2004 | US20040217012 Efficient removal of generated gases; higher current densities; shorter time; homogenous; coating wires on outer side |
| 11/04/2004 | US20040216996 Method and apparatus for an anodic treatment |
| 11/03/2004 | EP1472173A1 Method and apparatus for transferring sheet-like objects |
| 11/03/2004 | EP1169162B1 Method and apparatus for plating and polishing a semiconductor substrate |
| 11/02/2004 | US6811661 Cathode cartridge of testing device for electroplating and testing device for electroplating |
| 10/28/2004 | WO2004072331A3 Apparatus and method for highly controlled electrodeposition |
| 10/28/2004 | WO2002001610A3 Apparatus and method for electro chemical deposition |
| 10/27/2004 | CN1540039A Nickel base alloy composite conductor roll and manufacturing method |
| 10/27/2004 | CN1173078C Process and special apparatus for electrogalvenizing inner and outer walls of steel pipe |
| 10/26/2004 | US6809029 Semiconductor production device and production method for semiconductor device |
| 10/21/2004 | US20040209464 Plating method and plating apparatus |
| 10/21/2004 | US20040206713 Jig and a method and apparatus of applying a surface treatment to a member on the jig |
| 10/21/2004 | US20040206631 Brightener degradation inhibitor compound in copper plating bath |
| 10/21/2004 | US20040206630 Method and device for producing a textured metal strip |
| 10/21/2004 | US20040206623 Slim cell platform plumbing |
| 10/21/2004 | US20040206622 Apparatus for plating treatment |
| 10/20/2004 | EP1274885B1 Electrical contacting element made of an elastic material |
| 10/20/2004 | CN1539030A Plating method and plating apparatus |
| 10/14/2004 | US20040200727 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 10/13/2004 | CN2647874Y Coating assembling connecting electricity apparatus for electrophoresis |
| 10/13/2004 | CN1537180A Method for producing electroconductive particles |
| 10/13/2004 | CN1536101A Electric plating equipment for wafer |
| 10/13/2004 | CN1170964C Apparatus and method for forming thin film of zinc oxide |
| 10/12/2004 | US6802955 Polishing pad, platen comprising first conductive layer in contact with polishing pad for coupling to first potential, second conductive layer for coupling to second potential, insulating layer, electrical contact, electrolyte reservoir |
| 10/12/2004 | US6802950 Apparatus and method for controlling plating uniformity |
| 10/12/2004 | US6802947 Apparatus and method for electro chemical plating using backside electrical contacts |
| 10/12/2004 | US6802946 Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
| 10/07/2004 | WO2004085714A1 Device and the parts thereof for producing electrodeposited dental shaped pieces |
| 10/07/2004 | US20040195111 Performs uniform electrodeposition and electroetching |
| 10/07/2004 | US20040195109 Electrochemical machining method and apparatus |
| 10/07/2004 | US20040195090 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 10/07/2004 | DE10313818A1 Vorrichtung und deren Teile für die galvanische Abscheidung von dentalen Formteilen Apparatus and its parts for the electrodeposition of shaped dental parts, |
| 10/07/2004 | CA2519519A1 Device and the parts thereof for producing electrodeposited dental shaped pieces |
| 10/06/2004 | EP1464734A2 Apparatus and method for manufacturing moulded parts |
| 10/06/2004 | EP1464731A1 Plating apparatus, plating method, and method for manufacturing semiconductor device |
| 10/06/2004 | EP1309740B1 Elastic contact element |
| 10/06/2004 | CN2646159Y Loadsupporting rack |
| 10/06/2004 | CN1535331A Apparatus for plating treatment |
| 10/06/2004 | CN1534101A Processing method of anode phosphorus copper alloy material |
| 10/05/2004 | US6800187 Support that controls plating solution flow dynamics and electric field shape during electroplating; uniformity; bubble free |
| 10/05/2004 | US6800186 Method and apparatus for electrochemical processing |
| 09/30/2004 | WO2004083492A1 Lead frame plating apparatus |
| 09/30/2004 | WO2004033061A3 Fluorine separation and generation device |
| 09/30/2004 | WO2004024634A3 Mediated electrochemical oxidation of inorganic materials |
| 09/30/2004 | US20040188259 Design of deposits to ajust for defects in working surfaces; electrochemistry |
| 09/29/2004 | CN1533586A Plating apparatus |
| 09/29/2004 | CN1533451A Device for electrodepositon of aluminium of aluminium alloys from organic metallic electrolytes containing aluminium alkyl |
| 09/29/2004 | CN1532307A Anodizing processing device |
| 09/29/2004 | CN1169282C Electroplating current supply system |
| 09/29/2004 | CN1168854C System, device and method for electroplating semiconductor wafer |
| 09/28/2004 | US6797133 Mobile zinc cathode stripping system |
| 09/28/2004 | US6797132 Apparatus for plating and polishing a semiconductor workpiece |
| 09/28/2004 | US6797079 Copper, silver alloy |
| 09/23/2004 | WO2004081261A2 Plating apparatus |
| 09/23/2004 | US20040182694 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes |
| 09/22/2004 | EP1458905A2 Electrolzsis cell for restoring the concentration of metal ions in electroplating processes |
| 09/22/2004 | CN1531028A Electroplating method |
| 09/22/2004 | CN1530335A Ozone generator |
| 09/21/2004 | US6793793 High reactability; reduced generation of liquid waste; eliminates electrode cleaning |
| 09/16/2004 | WO2004078411A2 Method and apparatus for local polishing control |
| 09/16/2004 | US20040178065 Electrode semiconductor workpiece holder and processing methods |
| 09/16/2004 | US20040178059 Controlled potential anodic etching process for the selective removal of conductive thin films |
| 09/16/2004 | US20040177498 Electronic device and manufacturing same |
| 09/16/2004 | DE10309401A1 Coating apparatus for e.g. metallic tube, rod, has carrying disk rotated by motor, causing items to in turn rotate with respect to the threaded rod while being immersed into electrolytes contained in a reservoir |
| 09/16/2004 | DE10153171B4 Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen Method and apparatus for electrolytic treatment of parts in continuous flow systems |
| 09/15/2004 | EP1222321B8 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 09/15/2004 | CN1529774A Electrolytic copper plating method phosphorous cooper anode for electrolytic copper plating method said semiconductor wafer having low particle adhension plated with said method and anode |
| 09/15/2004 | CN1529773A Improved electrophoretic deposition |
| 09/15/2004 | CN1529769A Anode Assembly depositing planar metal through enhancing electrolyte mixing and process for supplying electrolyte |
| 09/14/2004 | US6790377 Method for electrochemical fabrication |
| 09/14/2004 | US6790332 Ia/ic ratio is 1-1.5, and wherein a charge ratio qa/qc=taia/tcic of charge qa, transported during an anode pulse of duration ta, to a charge qc, transported during a cathode pulse of duration tc, is 30-45. |
| 09/09/2004 | US20040173461 Method and apparatus for local polishing control |
| 09/09/2004 | US20040173454 Apparatus and method for electro chemical plating using backsid electrical contacte |
| 09/09/2004 | DE10307170A1 Weighing device for use in a paint dipping installation, especially for continuous determination of the difference in weight of un-dipped and dipped auto components comprises a support for a part with weighing cells |
| 09/08/2004 | EP1455006A1 Method and apparatus for galvanizing components |
| 09/08/2004 | EP1292724A4 Zinc-nickel electroplating |
| 09/08/2004 | CN1526855A Continuous fine metal wire nickel plating apparatus |
| 09/07/2004 | US6787008 Hydrogen generating cell with cathode |
| 09/07/2004 | US6787007 Polymeric hydrogen diffusion barrier, high-pressure storage tank so equipped, method of fabricating a storage tank and method of preventing hydrogen diffusion |
| 09/02/2004 | WO2004074555A1 Ni ALLOY ANODE MATERIAL FOR ELECTROLYTIC Ni PLATING |
| 09/02/2004 | WO2004074553A2 Plating using an insoluble anode and seperately supplied plating material |
| 09/02/2004 | US20040168927 Electroconductive structure and electroplating method using the structure |
| 09/01/2004 | EP1452628A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 09/01/2004 | CN1164800C Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 08/31/2004 | US6783611 Used to form a copper wiring for a semiconductor device |