Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
08/2005
08/03/2005CN1650679A Method and device for treating flat and flexible work pieces
08/02/2005US6923898 Anode inserted in a hole of a work, and a member for rotating the work about its center axis and supplying a plating current; plating a ring shaped bonded magnet
07/2005
07/28/2005US20050161343 Apparatus and method for brine separation and reuse
07/28/2005US20050161342 Mediated electrochemical oxidation process used as a hydrogen fuel generator
07/28/2005US20050161336 immersion of microelectronics in liquid solutions flowing through reactor vessels, then controlling the voltage applied the electrodes such that individual electrodes establish an electrical field in the solution and adjusting the electrical field in the solution over time to promote uniform deposition
07/28/2005US20050161320 Electroplating apparatus with segmented anode array
07/28/2005US20050160977 Method and apparatus for fluid processing a workpiece
07/28/2005DE19621242B4 Verfahren und Einrichtung zur Rückgewinnung von durch Tauchtrommeln ausgeschleppten Behandlungslösungen Method and apparatus for recovering the dragged by immersion drums treatment solutions
07/27/2005CN2712947Y Plating bath with double anode
07/27/2005CN1646733A Web processing method and apparatus
07/27/2005CN1646264A Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
07/26/2005US6921551 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits
07/26/2005US6921467 Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
07/21/2005WO2005066393A1 Method and apparatus for forming oxide coating
07/21/2005WO2005065082A2 Carbon-coated silicon particle power as the anode material for lithium ion batteries and the method of making the same
07/21/2005WO2005017971A3 Nanomachined and micromachined electrodes for electrochemical devices
07/21/2005WO2004078411A3 Method and apparatus for local polishing control
07/21/2005US20050158478 Substrate processing apparatus and substrate processing method
07/21/2005US20050155866 additive consumption inhibiting alcohol and brightener degradation inhibitor compound in copper plating bath; increases the life of the plating bath and improves the efficiency of the plating
07/21/2005US20050155865 Electrolytic processing apparatus and method
07/21/2005US20050155864 Automatic process control; facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
07/21/2005CA2548988A1 Carbon-coated silicon particle powder as the anode material for lithium ion batteries and the method of making the same
07/20/2005CN2711185Y Apparatus for local gold-plating hardware products specially
07/20/2005CN1643186A Conveyorized plating line and method for electrolytically metal plating a workpiece
07/19/2005US6919010 Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
07/14/2005WO2005064043A2 Improved metal strip electroplating
07/14/2005WO2004081261B1 Plating apparatus
07/14/2005WO2004022814A3 Device and method for electrolytically treating an at least superficially electrically conducting work piece
07/14/2005CA2551273A1 Improved metal strip electroplating
07/13/2005EP1553211A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
07/13/2005EP1552041A2 Coatings for the inhibition of undesirable oxidation in an electrochemical cell
07/13/2005EP1552040A1 Electrolytic cell leak limiter
07/13/2005EP1115915B1 Electrochemical treatment assembly and process of feeding current to a printed board material
07/13/2005CN1637173A Anode unit for continuous electroplating of belt poor conductor
07/13/2005CN1637172A Anode unit for continuous electroplating of linear poor conductor
07/13/2005CN1637171A Plating apparatus and method
07/13/2005CN1637169A Electroplating method for a semiconductor device
07/12/2005US6916443 High differential pressure electrochemical cell
07/12/2005US6916413 Electro-plating apparatus and method
07/12/2005US6916412 Divided housing
07/07/2005WO2005060379A2 Chambers, systems, and methods for electrochemically processing microfeature workpieces
07/07/2005US20050148197 Substrate proximity processing structures and methods for using and making the same
07/07/2005US20050145501 Utilizing a high-volume, high-energy electro-deposition plating for coating soft metal or alloys( tin, pb, au, ag, ni, cu or indium) to resilience metal seal (stainless steel ); enhanced leakage control of the seals; continuously moving the seals in series through an electro-plating stage
07/07/2005US20050145500 Plating apparatus, plating method, and manufacturing method of semiconductor device
07/07/2005US20050145486 Clipping device of an electroplating base plate
07/07/2005US20050145482 Apparatus and method for processing substrate
07/07/2005US20050145265 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
07/05/2005US6913681 Plating method and plating apparatus
07/05/2005US6913676 Device for supplying at least two liquid media to consumers of a fuel cell system
06/2005
06/30/2005WO2005059206A2 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces
06/30/2005US20050142402 High differential pressure electrochemical cell
06/30/2005US20050139118 Brightener degradation inhibitor compound in copper plating bath
06/30/2005DE10355802A1 Reactor for electrochemical machining or coating of a workpiece involving production of a voltage between the workpiece and electrode generally useful electrochemical machining or coating of metal workpieces
06/30/2005DE10355571A1 Device for electrolytic coating useful for electrolytic coating of metal ropes in which the object to be coated is passed vertically through at least two parallel electrodes
06/30/2005DE102004025827B3 Electrical contacting device for circuit board or conductor foil passed through electrolytic cell using contacts alternating with transport rollers along each side edge
06/29/2005CN1633525A Conveyorized horizontal processing line and method of wet-processing a workpiece
06/29/2005CN1632914A Electroplating and/or electropolishing stand and method for electroplating and/or electropolishing wafers
06/29/2005CN1632178A Method and apparatus for rapid preparation of anodic oxidation film on aluminium alloy products
06/28/2005US6911138 Plating bath contains tin (II) sulfamate, acting as a tin (II) salt; as a complexing agent citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these, or gluconic lactone; and a brightener
06/28/2005US6911137 Strip forms cathode and is moved in its longitudinal direction relative to anode, an electrolyte flowing between strip and anode, flow of electrolyte influenced by holding body between strip and anode
06/28/2005US6911127 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
06/28/2005US6911068 Plating bath and method for depositing a metal layer on a substrate
06/28/2005US6910926 Electronic connector terminal
06/23/2005US20050136330 Silicon particles coated with carbon residue forming material to form coated silicon particles, coating particles of carbonaceous material with carbon residue forming material to form coated carbonaceous particles, embedding coated sililcon onto coated carbonanecous particles, stabilizing by oxidation
06/23/2005US20050133377 Streamlined Electrolyzer
06/23/2005US20050133375 Structured metal layer is electrodeposited on cathode, on surface of which conducting and nonconducting regions are defined; copper adherence to high grade steel
06/23/2005US20050133364 Electrolyte support member for high differential pressure electrochemical cell
06/22/2005EP1544932A2 Electrolyte support member for high differential pressure electrochemical cell
06/22/2005EP1481114A4 Apparatus and methods for electrochemical processing of microelectronic workpieces
06/22/2005CN2705473Y Electroplating V-shape base for increasing conductivity
06/22/2005CN1630739A Apparatus and method for electroplating a wafer surface
06/22/2005CN1630567A Manufacture of fine-grained electroplating anodes
06/21/2005US6908540 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
06/16/2005WO2005054838A2 Method for controlling electrodeposition of an entity and devices incorporating the immobilized entity
06/16/2005WO2001090434A3 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
06/16/2005US20050126928 Method and apparatus for electrolyzing water
06/16/2005US20050126919 Plating method, plating apparatus and a method of forming fine circuit wiring
06/16/2005US20050126918 Surface treatment process for enhancing a release rate of metal ions from a sacrificial electrode and a related sacrificial electrode
06/16/2005DE202005005830U1 Treatment drum for small parts with provision of liquid treatment for cleaning and/or coating in a treatment machine useful for cleaning and coating small parts by electrodeposition or paint application
06/16/2005CA2549835A1 Method for controlling electrodeposition of an entity and devices incorporating the immobilized entity
06/15/2005EP1541720A2 An electroplating machine
06/15/2005EP1541719A2 An electroplating machine
06/15/2005EP1540044A2 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
06/15/2005CN1626700A Surface treatment method for raising rate of releasing metal from sacrifice electrode and sacrifice electrode
06/14/2005US6906427 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
06/09/2005WO2005052221A1 Device for oxidising internal surfaces of hollow parts
06/09/2005WO2005052218A1 Stabilizers for titanium diboride-containing cathode structures
06/09/2005WO2005028718A3 Power supply device in a device for electrochemical treatment
06/09/2005US20050124262 Processing pad assembly with zone control
06/09/2005US20050121332 Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation
06/09/2005US20050121331 Depositing a tin-bismuth alloy skin layer on surfaces of a body, placing a solid tin metal and a solid bismuth metal in plating solution, electroconnecting anode; electrochemically alloying; increase in plating cycles, manufactured at a low cost, mounting reliability of a semiconductor
06/09/2005US20050121329 Variable pressure application system for engaging the substrate through contact ring; transmitting central pressure to center region of substrate and less peripheral pressure to edge of substrate; electroplating system for forming a metal layer with reduced metal layer on edge of wafer; easy cleaning
06/09/2005US20050121326 Chambers, systems, and methods for electrochemically processing microfeature workpieces
06/09/2005US20050121319 Board for use to support anodes and cathodes within adjacent electrolytic cells
06/09/2005US20050121317 Chambers, systems, and methods for electrochemically processing microfeature workpieces
06/09/2005DE10352708A1 Galvanizing device comprises a process bath container, electrodes arranged in the container, a unit for continuously filtering the bath, and a circulating unit for producing circulating currents between the electrodes
06/09/2005DE10242772B4 Galvanisierungseinrichtung Electroplating
06/08/2005EP1537257A2 Electrolysis process and apparatus
06/08/2005CN1625611A Method and apparatus for controlling deposition on predetermined portions of a workpiece
06/08/2005CN1624208A Electroplate device, electroplate method and method for manufacturing semiconductor device
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