Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
06/2003
06/11/2003EP1102875B1 Alkali zinc nickel bath
06/10/2003US6576110 Use with metal film plating; having a planar electric field generating portion coated with an inert material such as tantalum that is impervious to electrolyte solution and an electrolyte solution chemical reaction portion
06/05/2003US20030102226 Electrolytic cells; bath mixture containing alcohols; stability
06/05/2003US20030102210 Electroplating apparatus with segmented anode array
06/04/2003EP1259661A4 Pad designs and structures for a versatile materials processing apparatus
06/03/2003US6572755 Pressing workpiece against polishing surface while causing relative motion between workpiece and polishing surface, supplying an electrolyte solution to polishing surface, applying a voltage between both surfaces
06/03/2003US6572742 Apparatus for electrochemical fabrication using a conformable mask
05/2003
05/30/2003WO2003044246A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
05/30/2003WO2003009343A3 Plating apparatus
05/28/2003EP1314799A1 Electrochemical treating method such as electroplating and electrochemical reaction device therefor
05/28/2003EP1066209B1 Device for treating plate-shaped work pieces, especially printed-circuit boards
05/28/2003CN1421053A High differential pressure electrochemical cell
05/28/2003CN1420212A Small plated body electroplating device
05/27/2003US6569302 Substrate carrier
05/27/2003US6569299 Membrane partition system for plating of wafers
05/27/2003US6569297 Workpiece processor having processing chamber with improved processing fluid flow
05/22/2003WO2003042434A1 Method and device for surface treatment of treated object
05/22/2003WO2003015870A3 Radioactive implantable devices and their production methods
05/22/2003US20030094373 Comprises grooved cathode for uniformly concentrating electric fields; microelectronics
05/22/2003US20030094363 Grounding system for rotating fixtures in electrically conductive mediums
05/21/2003CN1109134C Electrolytic processing apparatus
05/20/2003US6565729 Using alkaline electrolyte bath; uniform overcoatings
05/20/2003US6565722 Installation and method for multilayered immersion coating
05/15/2003WO2003040438A1 Clip-type work hanger for electroplating device
05/15/2003WO2003031693A8 Electroforming system and electroforming method
05/15/2003US20030089608 Substrate processing apparatus
05/14/2003EP1309740A2 Elastic contact element
05/14/2003CN1418265A Method and device for regulation of concentration of metal ions in electrolyte and use thereof
05/14/2003CN1418264A Device providing electrical contact to surface of semiconductor workpiece during metal plating
05/13/2003US6562223 Using electrolyte solutions; for aluminum
05/13/2003US6562217 That efficiently permit a plated layer of uniform thickness to be formed over each of the particles without aggregating the particles in a plating liquid; electronic circuits
05/08/2003WO2003038160A1 Hydrogen generating cell with cathode subassembly construction
05/08/2003WO2003038159A2 Method and conveyorized system for electrolytically processing work pieces
05/08/2003US20030085134 Method and apparatus for an anodic treatment
05/08/2003US20030085132 Plating bath and method for depositing a metal layer on a substrate
05/08/2003US20030085119 Semiconductor wafer plating cathode assembly
05/08/2003CA2454267A1 Method and conveyorized system for electrolytically processing work pieces
05/07/2003EP1308541A1 Plating bath and method for depositing a metal layer on a substrate
05/07/2003EP1308539A1 Cathode electrode material and rotating cathode drum for producing electrolytic copper foil using the cathode electrode material
05/07/2003CN2549019Y Stock-belt style metal shell of connector
05/06/2003US6558750 Method of processing and plating planar articles
05/06/2003US6558524 Barrel plating method and apparatus
05/06/2003US6558518 Method and apparatus for plating substrate and plating facility
05/01/2003WO2003035943A1 Electrolytic copper plating method, electrolytic copper plating-use phosphorus-containing copper anode and semiconductor wafer with little particles deposition plated by using them
05/01/2003US20030082415 Hydrogen generating cell with cathode
05/01/2003US20030079995 Retaining object between cathode and anode in electrochemical reactor to present surface of object for electrochemical reaction; applying electric field by flowing current through electrolyte; dynamically inflating or deflating the bladder
05/01/2003US20030079683 Chemical vapor deposition; silicon carbide films; dielectrics
04/2003
04/29/2003US6554988 Electric dip coating
04/29/2003US6554976 Electroplating apparatus
04/24/2003WO2003034478A2 Apparatus and method for electro chemical plating using backside electrical contacts
04/24/2003WO2003033774A1 Submerged transfer plating device with plating fluid jetting tube
04/24/2003WO2003033770A2 System and method for electrolytic plating
04/24/2003US20030075451 Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereof
04/24/2003US20030075449 Method for controlling field flow decouple plating and a device thereof
04/23/2003CN1106244C Device for retaining components made from ferromagnetic material
04/17/2003WO2003031693A1 Electroforming system and electroforming method
04/17/2003WO2003018874A3 Apparatus and methods for electrochemical processing of microelectronic workpieces
04/17/2003US20030070932 Plating apparatus and plating method
04/17/2003US20030070930 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact
04/17/2003US20030070918 Apparatus and methods for electrochemical processing of microelectronic workpieces
04/17/2003CA2458465A1 Electroforming apparatus and electroforming method
04/16/2003CN1411054A Semiconductor integrated circuit, method and apparatus for mfg. same
04/15/2003US6547945 Electrode with an electrode chamber for receiving electrolyte and an article forming the second electrode disposed inwardly and spaced from the first electrode for electrolyte passage between
04/15/2003US6547937 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
04/10/2003WO2003028897A1 Improvements relating to coating processes and carriers
04/10/2003US20030066756 Plating bath and method for depositing a metal layer on a substrate
04/10/2003US20030066750 Electrolytic combustion
04/09/2003EP1300488A2 Plating path and method for depositing a metal layer on a substrate
04/09/2003EP1300487A1 Plating bath and method for depositing a metal layer on a substrate
04/09/2003EP1300486A1 Plating bath and method for depositing a metal layer on a substrate
04/09/2003EP1299578A1 A jig and a method and apparatus of applying a surface treatment to a member on the jig
04/08/2003US6545579 Device for retaining components made from a ferromagnetic material
04/08/2003US6544391 Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
04/03/2003US20030065242 Radioactive implantable devices and methods and apparatuses for their production and use
04/03/2003US20030062258 Electroplating apparatus with segmented anode array
04/01/2003US6540899 Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces
04/01/2003US6540889 Conducting roller assembly for an electroplating apparatus
04/01/2003CA2281231C Method for producing electro- or electroless-deposited film with a controlled crystal orientation
03/2003
03/27/2003WO2003025259A1 Electrode attachment to anode assembly
03/27/2003WO2003025255A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
03/27/2003WO2003025254A2 Device for the transport and wet-chemical or electrolytic treatment of very thin and planar items to be treated
03/27/2003US20030057098 Tilt mechanism for tilting the head portion so that the substrate held by the head portion is inclined relative to a horizontal plane; prevents air bubbles from remaining on the surface to be plated.
03/26/2003EP1295312A2 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
03/26/2003CN1405363A Method for simultaneously colouring multi stainless steel plate and its corollary equipment
03/26/2003CN1405359A Method for electroplating electrode of ceramic wafer electronic component
03/25/2003US6537430 System for galvanic treatment or finishing of pieces, and corresponding method
03/20/2003WO2003023825A2 Substrate processing apparatus
03/20/2003WO2003023395A1 Enhanced detection of metal plating additives
03/20/2003WO2002070144A9 Internal heat spreader plating methods and devices
03/20/2003US20030052014 Plating bath contains tin (II) sulfamate, acting as a tin (II) salt; as a complexing agent citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these, or gluconic lactone; and a brightener
03/20/2003US20030052009 Method and apparatus for the bulk coating of components
03/20/2003US20030051999 Elastic contact element
03/20/2003US20030051995 Plating device and plating method
03/19/2003EP1292724A1 Zinc-nickel electroplating
03/18/2003US6534190 Heat sink material in a semiconductor device comprising silicon carbide in aluminum or aluminum alloy matrix and a coating layer
03/18/2003US6534116 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
03/14/2003CA2403412A1 Method and apparatus for the bulk coating of components
03/13/2003US20030049850 Enhanced detection of metal plating additives
03/13/2003US20030047448 Anode chamber and cathode chamber are separate by ionically connected chambers thereby keeping the anolyte substantially free of the plating additives reducing the likelihood of generating electrolyte species that inhibit bottom-up plating
03/12/2003CN1401823A Process and special apparatus for electrogalvenizing inner and outer walls of steel pipe
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