| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
|---|
| 04/08/2004 | US20040065552 Method for electrochemical fabrication |
| 04/08/2004 | US20040065549 Cleaning apparatus for ECMD anode pad |
| 04/08/2004 | DE10042002B4 Vorrichtung zur galvanischen Abscheidung eines Werkstoffes und deren Verwendung An apparatus for the galvanic deposition of a material and the use thereof |
| 04/06/2004 | US6716334 Electroplating process chamber and method with pre-wetting and rinsing capability |
| 04/06/2004 | US6716333 Spinning rotor |
| 04/01/2004 | WO2004027898A2 Anode compositions having an elastomeric binder and an adhesion promoter |
| 04/01/2004 | WO2004026694A2 Storage tank having polymeric hydrogen diffusion barrier and method of preventing hydrogen diffusion |
| 04/01/2004 | US20040060824 Chemical treatment, plating, and residue elimination method |
| 04/01/2004 | US20040060819 Electrodialysis and electrodeposition membrane electrode device |
| 04/01/2004 | DE10245182A1 Anodizing frame for anodizing processes has a central holding element for contacting with an electrode, and clamping elements fixed on the holding element via a hot-deformed rivet |
| 04/01/2004 | CA2498901A1 Anode compositions having an elastomeric binder and an adhesion promoter |
| 03/31/2004 | CN1143906C Process for depositing layer of material on substrate |
| 03/25/2004 | WO2004024634A2 Mediated electrochemical oxidation of inorganic materials |
| 03/25/2004 | US20040058240 Anode compositions having an elastomeric binder and an adhesion promoter |
| 03/25/2004 | US20040055897 Polymeric hydrogen diffusion barrier, high-pressure storage tank so equipped, method of fabricating a storage tank and method of preventing hydrogen diffusion |
| 03/25/2004 | US20040055894 Process for producing semiconductor member, process for producing solar cell, and anodizing apparatus |
| 03/25/2004 | US20040055893 Utilizes a vacuum chuck-type substrate holder configured to secure a substrate thereto with the back side of the substrate being in contact with the vacuum chuck and the production side being exposed to an electrolyte solution |
| 03/25/2004 | US20040055890 ProvideS a film having a highly uniform thickness by plating; electric current limiting member limits horizontal flow of an electric current in the plating liquid between second electrode and substrate within plating vessel during plating |
| 03/25/2004 | US20040055877 Workpiece processor having processing chamber with improved processing fluid flow |
| 03/25/2004 | US20040055873 Apparatus and method for improved electroforming |
| 03/25/2004 | DE10242772A1 Galvanisierungseinrichtung Electroplating |
| 03/25/2004 | DE10241619A1 Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut Method and apparatus for electrolytic treatment of at least superficially electrically conductive material to be treated |
| 03/24/2004 | CN1483860A Tumble-plating device |
| 03/18/2004 | WO2004022814A2 Device and method for electrolytically treating an at least superficially electrically conducting work piece |
| 03/18/2004 | US20040053509 Fluid treatment system |
| 03/17/2004 | EP1398400A2 Apparatus for galvanisation |
| 03/17/2004 | EP1397828A1 Electrolytic processing device and substrate processing apparatus |
| 03/17/2004 | EP1397530A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 03/16/2004 | US6706166 Method for improving an electrodeposition process through use of a multi-electrode assembly |
| 03/11/2004 | WO2004020320A2 Apparatus for treating strip-shaped parts |
| 03/11/2004 | WO2004014806A3 A combined electrochemical system for scale treatment and eradicating legionella pneumophila bacteria in water supply systems |
| 03/11/2004 | US20040045837 Method for treating the surface of object and apparatus thereof |
| 03/11/2004 | US20040045813 Wafer processing apparatus, wafer stage, and wafer processing method |
| 03/09/2004 | US6702932 Electroplating barrel |
| 03/09/2004 | US6702895 Ribbed electroplating barrel |
| 03/04/2004 | US20040040863 Dissolving, etching, polishing; using electrolytic cells |
| 03/04/2004 | US20040040856 Method for making plastic packages |
| 03/04/2004 | US20040040131 Substrate processing apparatus and substrate processing method |
| 03/03/2004 | EP1392889A1 Anode assembly and process for supplying electrolyte to a planar substrate surface |
| 03/02/2004 | US6699373 Apparatus for processing the surface of a microelectronic workpiece |
| 02/26/2004 | WO2004017384A1 Device for etching semiconductors with a large surface area |
| 02/26/2004 | WO2004016832A1 Electrode for electroplating |
| 02/26/2004 | WO2003023395A9 Enhanced detection of metal plating additives |
| 02/26/2004 | WO2003018878A3 Segmented counterelectrode for an electrolytic treatment system |
| 02/26/2004 | US20040037682 Substrate holder, plating apparatus, and plating method |
| 02/26/2004 | US20040035695 Flow diffuser to be used in electro-chemical plating system |
| 02/26/2004 | US20040035694 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
| 02/26/2004 | US20040035443 Method of chemically decontaminating components of radioactive material handling facility and system for carrying out the same |
| 02/25/2004 | EP1391540A2 Methods and apparatus for improved current density and feature fill control in ECD reactors |
| 02/25/2004 | EP1390967A2 Method of sealing wafer backside for full-face electrochemical plating |
| 02/25/2004 | EP1390567A1 Method, apparatus and system for electro-deposition of a plurality of thin layers on a substrate |
| 02/25/2004 | CN1477238A Electroplanting device |
| 02/25/2004 | CN1139677C Apparatus and method for strip solder plating |
| 02/24/2004 | US6695962 Used to deposit, polish, or electro-polish metal films on a substrate, or to remove such metal films from such a substrate |
| 02/24/2004 | US6695961 Three elongate electric current conductors, disposed parallel to one another |
| 02/24/2004 | US6695957 Simultaneous electrical and fluid connection for anode |
| 02/19/2004 | WO2004015172A2 Electrolysis process and apparatus |
| 02/19/2004 | WO2004014806A2 A combined electrochemical system for scale treatment and eradicating legionella pneumophila bacteria in water supply systems |
| 02/19/2004 | US20040031693 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus |
| 02/19/2004 | US20040031692 Coatings for the inhibition of undesirable oxidation in an electrochemical cell |
| 02/19/2004 | US20040031690 Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| 02/12/2004 | US20040026256 Electroplating integrated circuits using holder; prevent deposits on conveyor belt |
| 02/12/2004 | DE10235117B3 Anlage zur kataphoretischen Tauchlackierung von Gegenständen Plant for cataphoretic dip coating of objects |
| 02/12/2004 | DE10235020A1 Device for etching large surface semiconductor wafers in a trough-shaped receiver containing a liquid electrolyte used in semiconductor manufacture comprises a testing head provided with a device for holding at least one wafer |
| 02/11/2004 | EP1388596A2 Installation for the cataphoretic painting of objects |
| 02/11/2004 | CN1138022C Equipment and technology for electroplating steel pipe inner wall by using auxiliary anode and spray-plating zinc solution |
| 02/10/2004 | US6689216 Filling copper into recesses for interconnects formed on a semiconductor and removing a plating liquid remaining on the substrate-contacting portion with suction |
| 02/05/2004 | WO2004011698A1 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| 02/05/2004 | US20040022940 Can reinforce the thin portion of the seed layer and ensures complete filling with copper of the fine recesses, and which is so stable that its performance is not lowered after a long-term continuous use thereof. |
| 02/05/2004 | US20040020781 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 02/05/2004 | DE19837126B4 Verfahren und Vorrichtung zur elektrischen oder elektrochemischen Manipulation von Proben Method and apparatus for electrical or electrochemical manipulation of samples |
| 02/05/2004 | DE10234136A1 Process for the electrochemical micro-processing of a workpiece comprises changing the current field formed by electrodes in an electrolytic liquid by changing the current |
| 02/05/2004 | DE10234122A1 Device for electrochemically processing a workpiece for electrophoretic or galvanic deposition comprises separately arranged electrodes which are impinged with a current produced by a current source |
| 02/05/2004 | DE10232612A1 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses Apparatus and method for monitoring an electrolytic process |
| 02/04/2004 | EP1386984A1 Cathode cartridge for electroplating tester |
| 02/04/2004 | EP1222321B1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 01/29/2004 | WO2004009879A1 Plating device |
| 01/29/2004 | WO2004009877A2 Electrolytic reactor |
| 01/29/2004 | WO2004009875A2 Tilted electrochemical plating cell with constant wafer immersion angle |
| 01/29/2004 | WO2004009874A1 Electrolytic process and apparatus |
| 01/29/2004 | US20040016648 For immersing a substrate for plating operations |
| 01/29/2004 | US20040016645 Providing the component; placing the component in an electrolyte solution; and applying a plurality of pulses to the solution and component, wherein pulses have a pattern comprised of differentmagnitude portions |
| 01/29/2004 | US20040016637 Multi-chemistry plating system |
| 01/29/2004 | DE10229166A1 Verfahren zur Herstellung galvanisch abgeschiedener Antennen für RF-ID-Etiketten mittels selektiv eingebrachtem Kleber A process for producing electrodeposited antennas for RF-ID tags by means of selectively incorporated of adhesive |
| 01/29/2004 | DE10229001A1 Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche A method and system for controlling the distribution of ions during the galvanic depositing a metal on a workpiece surface |
| 01/29/2004 | CA2486681A1 Electrolytic process and apparatus |
| 01/28/2004 | EP1384798A1 Frame for holding sheet material taut |
| 01/27/2004 | US6681920 Manufacturing components are suspended from hooks on racks. the racks connect neighboring racks front to back forming a stable block of racks for transport. |
| 01/22/2004 | WO2004007811A2 Device and method for monitoring an electrolytic process |
| 01/22/2004 | US20040011655 For performing plating on a long conductive substrate |
| 01/22/2004 | DE10228843A1 Verfahren zur chargenweisen Beschichtung von Sägedraht A method for the batchwise coating of saw wire |
| 01/21/2004 | EP1381474A1 Internal heat spreader plating methods and devices |
| 01/21/2004 | CN2600454Y Diamond internal blade plating forming device |
| 01/21/2004 | CN2600453Y Foam Ni(Cu) and nickel net (felt) producing equipment |
| 01/21/2004 | CN1468982A Gold-plating apparatus and gold-plating method |
| 01/15/2004 | US20040007474 Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode |
| 01/15/2004 | US20040007473 Electrolyte/organic additive separation in electroplating processes |
| 01/15/2004 | US20040007467 A vessel surface is shaped to provide a uniform current density at a microfeature semiconductor workpiece; electrodeposition, electroplating |
| 01/15/2004 | US20040007460 Clamping device having barbed pin |
| 01/15/2004 | US20040007459 Anode isolation by diffusion differentials |