| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
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| 03/11/2003 | US6531039 Anode for plating a semiconductor wafer |
| 03/06/2003 | WO2003018878A2 Segmented counterelectrode for an electrolytic treatment system |
| 03/06/2003 | WO2003018875A1 Electrodeposition apparatus and method using magnetic assistance and rotary cathode for ferrous and magnetic particles |
| 03/06/2003 | WO2003018874A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 03/06/2003 | WO2003018165A1 Tubular electrodialysis and electrodeposition membrane electrode device |
| 03/06/2003 | WO2003018164A1 Electrodialysis and electrodeposition membrane electrode device |
| 03/06/2003 | WO2002097165A3 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 03/06/2003 | US20030041968 Substrate processing apparatus |
| 03/06/2003 | CA2449807A1 Segmented counterelectrode for an electrolytic treatment system |
| 03/06/2003 | CA2427055A1 Tubular electrodialysis and eletrodeposition membrane electrode device |
| 03/06/2003 | CA2427018A1 Electrodialysis and electrodeposition membrane electrode device |
| 03/05/2003 | EP1287185A1 Anode assembly for plating and planarizing a conductive layer |
| 03/05/2003 | CN1401137A Electronic device and method of manufacturing the electronic device |
| 03/04/2003 | US6527939 Metal can be deposited in cell operation that does not exhibit an adverse effect on electrode potential |
| 03/04/2003 | US6527935 Process for electroplating pins of an integrated circuit package |
| 03/04/2003 | US6527925 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
| 02/27/2003 | WO2003016182A1 Belt apparatus for carrying elements during treatment |
| 02/27/2003 | WO2003015870A2 Radioactive implantable devices and their production methods |
| 02/27/2003 | US20030038037 Electroplating apparatus and four mask TFT array process with electroplated metal |
| 02/27/2003 | US20030038035 Actively changing the first current distribution to produce a second current distribution different from the first in the electrolytic fluid while the microelectronic workpiece is in contact therewith |
| 02/27/2003 | US20030038034 Rotary flow-through electrodeposition system comprising a cell for holding electrolytic fluid and substrate material particles; an electrode; and magnets for drawing substrate material particles in the cell against the electrode |
| 02/20/2003 | WO2003014426A1 Method for producing electroconductive particles |
| 02/20/2003 | WO2003014424A1 Device and method for galvanic surface treatment of work pieces |
| 02/20/2003 | WO2001081657A3 Elastic contact element |
| 02/20/2003 | DE10209365C1 Process for electrolytically metallizing the walls of holes in e.g. circuit boards, conductor foils and strips comprises inserting the material into a working container, contacting with an electrolyte, and further processing |
| 02/19/2003 | EP1173631B1 Electroplating barrel |
| 02/19/2003 | CN2536602Y Replaceable conductive holder |
| 02/18/2003 | US6521103 Plating clamp assembly |
| 02/18/2003 | US6521102 Perforated anode for uniform deposition of a metal layer |
| 02/18/2003 | CA2047682C Jigging conveyor immersed in a liquid with attenuation of the transmitted vibrations |
| 02/13/2003 | WO2003012176A1 Device for the electrodeposition of aluminium or aluminium alloys from organometallic electrolytes containing aluminium alkyl |
| 02/13/2003 | WO2003012172A2 Method and device for producing a textured metal strip |
| 02/13/2003 | WO2002045476A3 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 02/13/2003 | US20030029732 Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
| 02/13/2003 | US20030029527 Used to form a copper wiring for a semiconductor device |
| 02/13/2003 | CA2454075A1 Device for the electrodeposition of aluminium or aluminium alloys from organometallic electrolytes containing aluminium alkyl |
| 02/12/2003 | CN1396314A Process for preparing PC anode copper |
| 02/11/2003 | US6517698 System and method for providing rotation to plating flow |
| 02/11/2003 | US6517697 Anodizing method |
| 02/06/2003 | WO2003010368A1 Method and apparatus for sealing a substrate surface during an electrochemical deposition process |
| 02/06/2003 | WO2003010367A1 Parallel action holding clamp for electroplating articles |
| 02/06/2003 | WO2003010366A1 Apparatus for plating treatment |
| 02/06/2003 | WO2003010365A1 Plating method and plating apparatus |
| 02/06/2003 | WO2003010357A1 Electroconductive structure and electroplating method using the structure |
| 02/06/2003 | WO2002057514A3 Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate |
| 02/05/2003 | CN2534197Y Automatic charging & discharging machine for circuit board |
| 02/05/2003 | CN1100894C Compound electrode for electrolysis |
| 02/04/2003 | US6514393 Adjustable flange for plating and electropolishing thickness profile control |
| 01/30/2003 | WO2003009343A2 Plating apparatus |
| 01/30/2003 | US20030019756 Reaction is executed in a reaction vessel containing matter in a supercritical or subcritical state and an electrolytic solution; free of generated liquid waste, no need to clean the electrode |
| 01/30/2003 | US20030019744 Substrate holder |
| 01/30/2003 | US20030019741 Method and apparatus for sealing a substrate surface during an electrochemical deposition process |
| 01/29/2003 | EP1279751A1 Apparatus for galvanic deposition of aluminium or aluminium alloys from metallorganic aluminium alkyl containing electrolytes |
| 01/29/2003 | EP1278899A1 Method and device for the electrolytic coating of a metal strip |
| 01/23/2003 | WO2003006718A1 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
| 01/23/2003 | US20030015435 An electro-etching process for a semiconductor wafer |
| 01/23/2003 | US20030015433 Electrolytic copper plating method |
| 01/22/2003 | CN2532089Y Improved structure for continuous electroplating tank |
| 01/22/2003 | CN2532088Y Structure of continuous electroplating tank |
| 01/22/2003 | CN2532087Y Improved clamping tool structure for electroplating |
| 01/22/2003 | CN2532086Y Improved reaction device for continuous electroplating tank |
| 01/22/2003 | CN1392294A Plating method of electrocytic copper |
| 01/21/2003 | US6508926 Method and device for partial electrochemical treatment of bar-shaped objects |
| 01/16/2003 | WO2003004199A2 Manufacture of fine-grained electroplating anodes |
| 01/16/2003 | US20030012885 Horizontally transporting vertically oriented wafers into a process cell; carrier is rotated from a horizontal orientation to a vertical orientation; cathode assembly secures the wafer and couples the wafer to a power source |
| 01/16/2003 | US20030010644 Apparatus and process for producing zinc oxide film |
| 01/16/2003 | US20030010641 An annular conductive support of the substrate having a pin receiving pocket for an electrical contact pin having the part in the pocket brazed; the contact pin adapted to bias electrically the substrate; filling integrated circuits |
| 01/16/2003 | US20030010640 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
| 01/16/2003 | DE20208876U1 Electrically conducting stand used in electrolytic coating of metallic objects comprises a support device supporting the objects and a stand head having a current-carrying contact part for clamping on a current carrier |
| 01/15/2003 | EP1274885A1 Electrical contacting element made of an elastic material |
| 01/15/2003 | EP0998596B1 Electric dip coating |
| 01/09/2003 | WO2003002784A2 Electrolysis cell for restoring the concentration of metal ions in electroplating processes |
| 01/09/2003 | US20030008602 Method and apparatus of sealing wafer backside for full-face electrochemical plating |
| 01/09/2003 | US20030008473 Anodizing method and apparatus and semiconductor substrate manufacturing method |
| 01/09/2003 | US20030006135 Plating apparatus and plating method, and method of manufacturing semiconductor device |
| 01/08/2003 | EP1272692A1 Electro-plating apparatus and method |
| 01/08/2003 | CN1390268A Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 01/08/2003 | CN1098375C Device for processing flat workpieces in particular printed circuit boards |
| 01/07/2003 | US6503376 Electroplating apparatus |
| 01/07/2003 | US6503375 Electroplating apparatus using a perforated phosphorus doped consumable anode |
| 01/03/2003 | WO2003000395A1 Vibratingly stirring apparatus, and device and method for processing using the stirring apparatus |
| 01/02/2003 | US20030000893 For providing substrate such as a semiconductor wafer solution treatment |
| 01/02/2003 | US20030000843 Immersing a planar substrate in an electrolyte that contains the catalytically active metallic; applying an electrical voltage; depositing a layer of catalytically active metallic material by electrochemical deposition on the planar substrate |
| 01/02/2003 | US20030000842 Regulating the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system in an oxidized and in a reduced form |
| 01/02/2003 | US20030000841 For deposition of a metal layer onto a wafer or other substrate |
| 01/02/2003 | US20030000840 Electroplating apparatus and method |
| 01/02/2003 | US20030000604 Manufacture of fine-grained electroplating anodes |
| 01/02/2003 | EP1268881A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 01/01/2003 | CN1388840A Cathode electrode material and rotating cathode drum for producing electrolytic copper foil using the cathode electrode material |
| 01/01/2003 | CN1388273A Surface treating apparatus |
| 12/31/2002 | US6500325 Method of plating semiconductor wafer and plated semiconductor wafer |
| 12/31/2002 | US6500324 Process for depositing a layer of material on a substrate |
| 12/31/2002 | US6500320 Fastening apparatus |
| 12/31/2002 | US6500318 Apparatus for recovering metal from solution |
| 12/27/2002 | WO2002103771A1 Electrolytic processing device and substrate processing apparatus |
| 12/27/2002 | WO2001042533A8 Electroplating apparatus |
| 12/26/2002 | US20020195352 Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements |
| 12/26/2002 | US20020195347 Process for depositing a layer of material on a substrate and a plating system |
| 12/26/2002 | US20020195333 Spouted bed apparatus for contacting objects with a fluid |
| 12/25/2002 | CN2527574Y Hanging device for electro plating |