Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
06/2004
06/22/2004US6752855 For providing substrate such as a semiconductor wafer solution treatment
06/17/2004WO2004051777A2 Electrochemical cell plate with integral seals
06/17/2004WO2004050961A1 Integrated photoelectrochemical cell and system having a liquid electrolyte
06/17/2004US20040116546 Direct organic fuel cell proton exchange membrane and method of manufacturing the same
06/17/2004US20040115932 Method and apparatus for controlling local current to achieve uniform plating thickness
06/17/2004US20040115340 Depositing particles comprising at least one coating on a substrate; andreflowing the particles to at least partially melt the coating, thereby forming a substantially continuous solidified solder material
06/17/2004US20040112760 Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing
06/17/2004US20040112746 Of ceramics; using metal compound dissolving in solvent ; powder coating
06/16/2004EP1427872A1 Electrode attachment to anode assembly
06/16/2004EP1427656A1 Belt apparatus for carrying elements during treatment
06/16/2004CN1153852C Device and method for controlling electric power line distribution
06/16/2004CN1153851C Device and method for controlling electric power line distribution
06/15/2004US6749391 Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
06/10/2004WO2004048825A1 Gland packing and process for producing the same
06/10/2004WO2004038072A3 Plating uniformity control by contact ring shaping
06/10/2004WO2004026694A3 Storage tank having polymeric hydrogen diffusion barrier and method of preventing hydrogen diffusion
06/10/2004WO2004009875A3 Tilted electrochemical plating cell with constant wafer immersion angle
06/10/2004US20040108215 Electroplating anode assembly
06/10/2004US20040108212 Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
06/10/2004US20040108202 Fluorine separation and generation device
06/09/2004EP1425067A2 Radioactive implantable devices and methods and apparatuses for their production and use
06/09/2004DE20320396U1 Veredelungsanlage zum Veredeln von langgestrecktem Wickelgut Processing plant for finishing long winding
06/09/2004CN1502725A Wafer electroplating device and method
06/09/2004CN1502534A Conveying band for bar shape parts
06/08/2004US6746578 Selective shield/material flow mechanism
06/06/2004CA2448969A1 Electroplating anode assembly
06/03/2004WO2004046418A1 Substrate processing apparatus and method for processing substrate
06/03/2004US20040105773 High differential pressure electrochemical cell
06/03/2004US20040104123 Anode is separated from the alkaline electrode to avoid undesirable secondary reactions in an alkali zinc nickel electroplating bath
06/03/2004US20040104113 External electrode connector
06/03/2004US20040104112 Feed belt for strip-shaped elements
06/03/2004US20040103921 Method for electrochemically treating articles and apparatus and method for cleaning articles
06/02/2004EP1423867A2 Substrate processing apparatus
06/02/2004CN2618928Y 边缘罩 Edge cover
06/02/2004CN2618927Y High speed electroplating process test device
06/01/2004US6743349 Electrochemical machining method and apparatus
05/2004
05/27/2004WO2004044270A1 Anode for electrometallurgical applications
05/27/2004WO2003004199A3 Manufacture of fine-grained electroplating anodes
05/27/2004US20040099534 Overcoating barrier or seed layer with copper, or other metal; connecting electrode to edges of wafer; applying potentials
05/27/2004US20040099533 Microelectronics; positioning contactors; concentric anodes; nozzles; electroplating
05/27/2004US20040099532 Using insulating shield; electrochemical plating bath; uniform current distribution
05/26/2004EP0859877B1 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects
05/26/2004CN2618405Y Board carrying dipplating mechanism of PC board through out hole electroplating device
05/26/2004CN2618311Y 电化学电极弹性导电网 Elastic guide grid electrode electrochemical
05/26/2004CN1500057A Belt appts. for carrying elements during treatment
05/25/2004US6740242 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating
05/20/2004US20040094403 Integrated plating and planarization apparatus having a variable-diameter counterelectrode
05/19/2004EP1420082A1 Electroconductive structure and electroplating method using the structure
05/19/2004EP1419290A2 Segmented counterelectrode for an electrolytic treatment system
05/19/2004CN1498290A Phosphate film processing method and film processing device
05/18/2004US6737360 Controlled potential anodic etching process for the selective removal of conductive thin films
05/18/2004US6736945 Wafer plating apparatus
05/13/2004WO2004015172A3 Electrolysis process and apparatus
05/13/2004US20040089555 Continuous metal plating and supplemental processing in one housing; substrate stage between cassette stage and pre-treatment unit; cleaning with pure water; drying
05/13/2004US20040089552 Electrochemical treating substrate by irradiating with light; lamp, stage, cathode, frame and seal
05/13/2004DE10249572A1 Device for galvanically coating, especially chromating, a workpiece comprises a coating chamber for receiving the workpiece, and an annular anode which interacts with the workpiece acting as a cathode
05/12/2004CN1495296A Electroplating method and device for wire stock, and electroplate wire stock
05/11/2004US6733650 Apparatus and process for producing zinc oxide film
05/06/2004WO2004038072A2 Plating uniformity control by contact ring shaping
05/06/2004WO2004038071A2 Coatings for the inhibition of undesirable oxidation in an electrochemical cell
05/06/2004WO2004009877A3 Electrolytic reactor
05/06/2004US20040084319 Method for electrochemical fabrication
05/06/2004US20040084315 Plating apparatus and plating method
05/06/2004CA2501229A1 Coatings for the inhibition of undesirable oxidation in an electrochemical cell
05/05/2004CN1494462A Internal heat spreader plating methods and devices
05/05/2004CN1148471C Electroplating machine
04/2004
04/29/2004WO2004035872A1 Electrolytic cell leak limiter
04/29/2004WO2003103025A3 Method and apparatus of sealing wafer backside for full-face electrochemical plating
04/29/2004US20040082289 Conductive polishing article for electrochemical mechanical polishing
04/29/2004US20040079644 Uniform thickness; applying electricity
04/29/2004US20040079633 Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
04/29/2004DE10248965A1 Contact system for an electroplating bath, can be a roller which is conductive for each contact point, with alternating switching as a cathode and anode
04/28/2004EP1412562A1 Device for the electrodeposition of aluminium or aluminium alloys from organometallic electrolytes containing aluminium alkyl
04/28/2004EP1412561A1 Workpiece wet processing
04/28/2004CN1492082A Metal surface treating device
04/27/2004US6726826 Method of manufacturing a semiconductor component
04/27/2004US6726823 Assembly for holding wafer comprising wafer chuck having bottom section and spring member configured to apply electric charge to wafer disposed between bottom section and wafer, and actuator assembly configured to move wafer chuck
04/22/2004WO2004033764A1 Liquid treatment apparatus and method of liquid treatment
04/22/2004WO2004033061A2 Fluorine separation and generation device
04/22/2004WO2002059398A3 Plating apparatus and method
04/22/2004US20040075087 Frame for holding sheet material taut
04/22/2004US20040074778 Plating bath and method for depositing a metal layer on a substrate
04/22/2004US20040074776 Method and device for the electrolytic coating of a metal strip
04/22/2004US20040074763 Plating device and plating method
04/22/2004US20040074762 Method and apparatus for sealing electrical contacts during an electrochemical deposition process
04/22/2004US20040074761 An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating
04/21/2004CN1146522C Surface treatment device
04/15/2004WO2004031454A2 Cathode design for use in electrodeposition cell
04/15/2004US20040069647 Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method
04/15/2004US20040069646 Electrolytic treatment, such as plating or etching; providing a high resistance structure having an electrical conductivity lower than that of the electrolytic solution in the solution filled between a substrate in contact with an electrode
04/15/2004US20040069642 Frame assembly and method for coating a strand of workpieces
04/15/2004US20040069640 Tubular electrodialysis and electrodeposition membrane electrode device
04/15/2004DE4421010B4 Verfahren zur Abreinigung von Gegenständen im Rahmen einer galvanotechnischen Behandlung von Gegenständen in einer galvanotechnischen Anlage und Anlagen für die Durchführung der Verfahren Method for cleaning of goods under a electroplating treatment of objects in an electroplating plant and equipment to carry out the method
04/14/2004EP1407810A1 VIBRATINGLY STIRRING APPARATUS, AND DEVICE AND METHOD FOR PROCESSING USING THE STIRRING APPARATUS
04/14/2004CN1489798A Hydrogen recharging system for fuel cell hydride storage reservoir
04/08/2004WO2004029335A1 Electrode element and method for manufacturing same
04/08/2004WO2004001178A3 Method and apparatus for downhole pipe or casing repair
04/08/2004WO2003018165A8 Tubular electrodialysis and electrodeposition membrane electrode device
04/08/2004US20040065557 Electrodeposition; removal from support using pivoting frame
04/08/2004US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues
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