| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
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| 09/06/2002 | WO2002045476A9 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 09/05/2002 | DE10107674A1 Process reactor used in galvanizing processes comprises a container, and an intermediate wall which moves between a resting position partially outside of the container and a functional position partially inside of the container |
| 09/03/2002 | US6444101 Contact ring for electroplating a substrate having an electroconductive portion, comprising an annular insulative body with central opening, a conductive biasing member coupled to the body to exert a biasing force on the substrate |
| 08/29/2002 | US20020119671 Controlled potential anodic etching process for the selective removal of conductive thin films |
| 08/28/2002 | CN2507872Y Anode titanium basket with improved structure |
| 08/28/2002 | CN2507871Y Device for preventing conductive roll from being electroplated |
| 08/22/2002 | US20020112954 Plating rack for plating procedures and processes for making and using same |
| 08/22/2002 | US20020112953 Anode for plating a semiconductor wafer |
| 08/21/2002 | EP1232525A2 Conductive interconnection |
| 08/20/2002 | US6436266 Masking techniques for metal plating |
| 08/15/2002 | WO2002063072A1 Method and apparatus for controlling thickness uniformity of electroplated layer |
| 08/15/2002 | WO2002062940A2 Improved electrophoretic deposition |
| 08/15/2002 | WO2001052307A9 Semiconductor workpiece proximity plating methods and apparatus |
| 08/15/2002 | WO2001042533A9 Electroplating apparatus |
| 08/15/2002 | WO2001029288A9 Conveyorized electroplating device |
| 08/15/2002 | US20020108851 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 08/14/2002 | EP1230446A2 Conveyorized electroplating device |
| 08/14/2002 | EP1230442A2 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 08/14/2002 | EP1230441A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 08/14/2002 | DE10059451C1 Werkstückaufnahme für galvanische Beschichtungen Workpiece holder for electroplated coatings |
| 08/13/2002 | US6432293 A process for copper-plating a wafer which comprises electroplating a semiconductor wafer having sub-micron trenches etched therein with an electrode comprising a corrosion-resistant metal substrate and a coat mainly composed |
| 08/13/2002 | US6432282 Method and apparatus for supplying electricity uniformly to a workpiece |
| 08/08/2002 | US20020104755 Electroplating current supply system |
| 08/08/2002 | US20020104754 Electroplating apparatus for wheel disk |
| 08/08/2002 | DE10043815C2 Verfahren und Vorrichtung zur elektrischen Kontaktierung von zu behandelndem Gut in elektrolytischen Anlagen Method and apparatus for electrically contacting material to be treated in electrolytic plants |
| 08/07/2002 | EP1229154A1 Method and apparatus for electroplating |
| 08/07/2002 | EP1228265A1 Masking techniques for metal plating |
| 08/07/2002 | CN2504286Y Plating drum |
| 08/07/2002 | CN2504285Y Detachable plating drum |
| 08/07/2002 | CN2504284Y Cationic material audo feeder of circuit board plating bath |
| 08/07/2002 | CN2504282Y Palte plating appts. |
| 08/06/2002 | US6428662 Reactor vessel having improved cup, anode and conductor assembly |
| 08/06/2002 | US6428660 Reactor vessel having improved cup, anode and conductor assembly |
| 08/01/2002 | WO2002059398A2 Plating apparatus and method |
| 08/01/2002 | US20020102156 Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces |
| 08/01/2002 | US20020100695 Placing component in a container; sealing an annular surface of component to be anodized; supplying a reaction medium to reaction chamber through a supply passage formed in container to anodize annular cylindrical surface |
| 08/01/2002 | US20020100682 Hydrogen recharging system for fuel cell hydride storage reservoir |
| 07/31/2002 | CN1361055A Conveying belt for conveying semi-conductor lead wire sheets |
| 07/25/2002 | WO2002058114A1 Substrate processing apparatus |
| 07/25/2002 | WO2002057514A2 Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate |
| 07/25/2002 | US20020097562 Electronic device and manufacturing same |
| 07/25/2002 | US20020096435 Causing a first impregnated member containing a plating solution in electrical contact with an anode to face the conductive layer on a substrate and moving it; preferentially forming a thin film in a depression, e.g. groove or hole |
| 07/24/2002 | EP1225254A1 Method and apparatus for an anodic treatment |
| 07/24/2002 | CN1360089A Electroplating device for circuit board |
| 07/23/2002 | US6423636 Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer |
| 07/23/2002 | US6423200 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
| 07/18/2002 | WO2001083858A3 Flexible substrate plating rack |
| 07/18/2002 | DE10100297A1 Vorrichtung und Verahren zur elektrochemischen Beschichtung Apparatus and Vera Hren for electrochemical coating |
| 07/18/2002 | DE10065643A1 Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut Apparatus and method for electrochemical treatment of strip-shaped and board-shaped |
| 07/18/2002 | DE10043817C2 Anordnung und Verfahren für elektrochemisch zu behandelndes Gut Apparatus and method for electrochemically treated Good |
| 07/17/2002 | EP1222323A1 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 07/17/2002 | EP1222321A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 07/17/2002 | EP0968325B1 Surface-treatment plants |
| 07/17/2002 | CN1087792C Cathode and anode reversible ion suppying method |
| 07/11/2002 | WO2002053809A1 Spouted bed apparatus for contacting objects with a fluid |
| 07/11/2002 | WO2002053807A1 Device and method for electrochemically treating a band-shaped product |
| 07/11/2002 | WO2002053806A2 Electrochemical coating device and method |
| 07/11/2002 | US20020088114 Automation apparatus for installing and removing a metal finishing barrel locking cover |
| 07/10/2002 | CN1357648A Electroplating equipment |
| 07/09/2002 | US6416647 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 07/04/2002 | WO2001037359A3 High differential pressure electrochemical cell |
| 07/04/2002 | US20020084192 Depositing a phosphorus doped seed layer on a conductive substrate, and then depositing a conductive metal layer on the phosphorus doped seed layer to form a conductive film. |
| 07/04/2002 | US20020084190 Method and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses |
| 07/03/2002 | CN1356407A Process for plating Cr on iner cavity of cylinder sleeve |
| 07/02/2002 | US6413403 Controlling electrolyte flow and distribution of electric, magnetic or electromagnetic field; depositing, removing, polishing, and/or modifying conductive material; uniformity; chemical mechanical polishing |
| 07/02/2002 | US6413391 Masking techniques for metal plating |
| 07/02/2002 | US6413388 Pad designs and structures for a versatile materials processing apparatus |
| 06/27/2002 | WO2002050887A1 Electronic device and method of manufacturing the electronic device |
| 06/27/2002 | US20020079230 Method and apparatus for controlling thickness uniformity of electroplated layer |
| 06/27/2002 | US20020079229 Anode inserted in a hole of a work, and a member for rotating the work about its center axis and supplying a plating current; plating a ring shaped bonded magnet |
| 06/27/2002 | US20020079215 Workpiece processor having processing chamber with improved processing fluid flow |
| 06/26/2002 | EP1217102A2 Plating apparatus and method of managing plating liquid composition |
| 06/26/2002 | EP1216486A1 Methods and apparatus for treating seed layer in copper interconnections |
| 06/25/2002 | US6409904 Method and apparatus for depositing and controlling the texture of a thin film |
| 06/25/2002 | US6409892 Reactor vessel having improved cup, anode, and conductor assembly |
| 06/25/2002 | US6409039 Metal finishing barrel cover locking system |
| 06/20/2002 | WO2000075401A9 Simultaneous electrical and fluid connection for anode |
| 06/20/2002 | US20020074230 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 06/20/2002 | DE10061226A1 Verfahren und Vorrichtung zur Behandlung von Waren in einem Tauchbad Method and apparatus for the treatment of goods in an immersion bath |
| 06/19/2002 | CN2495661Y Novel structure fixing clamp for electrolytic coating rack |
| 06/19/2002 | CN2495660Y Electroforming cell for continuous prodn. of foamed nickel |
| 06/18/2002 | US6406542 Equipment for treatment of workpieces |
| 06/13/2002 | WO2002045476A2 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| 06/13/2002 | US20020071917 Protective layer is provided on workpieces in horizontal and vertical fashion in galvanizing tank; uniformity |
| 06/13/2002 | US20020070119 Masking techniques for metal plating |
| 06/12/2002 | EP1213373A2 Process and installation for the treatment of articles in a immersion bath |
| 06/12/2002 | EP1213372A2 Process and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses and use of the process |
| 06/12/2002 | EP0970266B1 Device for surface treatment by immersion |
| 06/12/2002 | CN1353779A System for electrochemically processing workpiece |
| 06/12/2002 | CN1353778A Workpiece processor having processing chamber with improved processing fluid flow |
| 06/11/2002 | US6402925 Prevent accumulation by polishing |
| 06/11/2002 | US6402923 Using electrochemical reactors; activating shield |
| 06/06/2002 | US20020066664 Method and apparatus for supplying electricity uniformly to a workpiece |
| 06/06/2002 | US20020066642 Device for the automated handling and interim buffering of manufacturing components |
| 06/06/2002 | DE10049113A1 Badvorrichtung für Tiefdruckzylinder Badvorrichtung for gravure cylinders |
| 06/05/2002 | EP1211201A1 Device for the automatic handling and intermediate buffering of suspended components |
| 06/05/2002 | CN2494344Y Continuous terminal discharging machanism |
| 06/01/2002 | CA2364065A1 Device for the automated handling and interim buffering of manufacturing components |
| 05/30/2002 | US20020064019 Cathode electrode material and rotating cathode drum for electrolytic copper foil production using the same |
| 05/30/2002 | US20020063097 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating |