Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
06/2005
06/08/2005CN1624207A Apparatus and method for plating a substrate, and method and apparatus for electrolytic treatment
06/02/2005US20050118447 Stiffener, a method of manufacturing a stiffener, and a semiconductor device with a stiffener
06/02/2005DE10345379B3 Vorratstank für Prozessflüssigkeiten mit einer reduzierten Menge an Blasen und Verfahren zum Betreiben desselben Of the same storage tank for process liquids with a reduced amount of bubbles and method for operating
06/01/2005EP1534880A2 Electrochemical coating device and method
06/01/2005EP1264010B1 Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof
06/01/2005CN2703006Y Edge sheet for electroplating rotary drum
06/01/2005CN1621573A Electroplating clamp for electronic parts and electrolytic plating device
06/01/2005CN1621572A Electroplating clamp and electrolytic plating device for electronic parts
05/2005
05/31/2005US6899926 Alloy coating, method for forming the same, and member for high temperature apparatuses
05/31/2005US6899920 Abrasive particles embedded in metal matrix
05/31/2005US6899803 Electrochemically reversible redox system in which excess quantities of the oxidized substances are reduced at the auxiliary cathode, reducing formation of ions of the metal to be deposited
05/31/2005US6899797 Apparatus for continuous processing of semiconductor wafers
05/26/2005WO2004081261A3 Plating apparatus
05/26/2005US20050109633 System for electrochemically processing a workpiece
05/26/2005US20050109629 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material
05/26/2005US20050109628 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material
05/26/2005US20050109625 Reactor for electrochemically processing at least one surface of a microelectronic workpiece; positioning contactors; concentric anodes; nozzles; electroplating; uniform deposition of the electroplated material
05/26/2005US20050109622 Method for controlling electrodeposition of an entity and devices incorporating the immobilized entity
05/26/2005US20050109615 Stabilizers for titanium diboride-containing cathode structures
05/26/2005US20050109613 Ozone production device
05/26/2005US20050109612 Electroplating apparatus with segmented anode array
05/26/2005US20050109611 Electroplating apparatus with segmented anode array
05/26/2005US20050109610 Electrolytic water generation apparatus having stable performance of electrolytic water generation
05/26/2005US20050109088 Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces
05/25/2005EP1532668A1 Substrate processing apparatus and substrate processing method
05/24/2005US6896784 Method for controlling local current to achieve uniform plating thickness
05/24/2005CA2141604C Process for the electrolytic processing especially of flat items and arrangement for implementing the process
05/18/2005EP1531195A1 Work holder frame particularly for electroplating machines
05/18/2005CN2700344Y Electroplating hanger
05/17/2005US6893549 Cleaning apparatus for ECMD anode pad
05/12/2005WO2005042809A2 Support for workpiece to be electrolytically coated
05/12/2005WO2005042808A1 Spiral electrodeionization device and components thereof
05/12/2005WO2005042804A2 Method and apparatus for fluid processing a workpiece
05/12/2005WO2005035836B1 Volume measurement apparatus and method
05/12/2005US20050101138 System and method for applying constant pressure during electroplating and electropolishing
05/11/2005EP0887441B1 Compound electrode for electrolysis
05/11/2005CN2698817Y Clamping device for electroplating base plate hanger
05/11/2005CN1615379A Electrode and apparatus for plating
05/11/2005CN1614100A Device for galvanizing member-shaped substrates
05/11/2005CN1613787A Electrolyzed water generator
05/11/2005CN1201036C Copper phosphide anode for electroplating
05/10/2005US6890415 Reactor vessel having improved cup, anode and conductor assembly
05/10/2005US6890413 Method and apparatus for controlling local current to achieve uniform plating thickness
05/10/2005US6890412 Electrodeposition apparatus and method using magnetic assistance and rotary cathode for ferrous and magnetic particles
05/05/2005US20050092616 Baths, methods, and tools for superconformal deposition of conductive materials other than copper
05/05/2005US20050092614 Distributing forces for electrodeposition
05/05/2005US20050092613 Two-bath electrolysis
05/05/2005US20050092602 Electrochemical plating cell having a membrane stack
05/05/2005US20050092601 Electrochemical plating cell having a diffusion member
05/05/2005US20050092600 Substrate holder, plating apparatus, and plating method
05/04/2005EP1527216A2 Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied
05/04/2005EP1527215A2 Apparatus and method for electroplating a wafer surface
05/04/2005EP1230446B1 Conveyorized electroplating device
05/04/2005DE10361880B3 Unit for wet chemical or electrolytic treatment of flat articles, especially metal foil, circuit foils or circuit boards, transports articles between rollers in mountings in side walls
05/04/2005CN2697112Y Holder for electroplating substrate
05/04/2005CN1612953A Device for the transport and wet-chemical or electrolytic treatment of very thin and planar items to be treated
05/03/2005US6887363 Grounding system for rotating fixtures in electrically conductive mediums
05/03/2005US6887113 Contact element for use in electroplating
04/2005
04/28/2005WO2005038096A1 Electrode device with integrated electrolyte supply for the surface treatment of metals
04/28/2005WO2004051777A3 Electrochemical cell plate with integral seals
04/28/2005WO2004003663A3 Apparatus and method for treating a substrate electrochemically while reducing metal corrosion
04/28/2005WO2003034478A3 Apparatus and method for electro chemical plating using backside electrical contacts
04/28/2005US20050089645 Flexible member can be used to provide a uniform force to securely retain the workpiece to be positioned in a process module resulting in uniform coatings; for fluid processing (e.g. electrodeposition) of substrates e.g. semiconductor wafers
04/28/2005US20050087439 Chambers, systems, and methods for electrochemically processing microfeature workpieces
04/27/2005EP1525609A1 Device for etching semiconductors with a large surface area
04/27/2005CN2695456Y Automatic tumble-plating machine
04/27/2005CN2695455Y Structure of electroplating equipment conducting system
04/27/2005CN2695454Y Device for improving sedimentation uniforming in electrocasting technology
04/27/2005CN1610769A 电镀装置 Plating equipment
04/21/2005WO2005035836A1 Volume measurement apparatus and method
04/21/2005WO2005035444A2 Electro-catalysts for the oxidation of ammonia in alkaline media
04/21/2005US20050084987 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
04/21/2005US20050083048 Plating system with integrated substrate inspection
04/21/2005US20050082171 cobalt and iron alloy without a substantial drop of saturation flux density from its theoretical value; anode and cathode compartments separated by a diaphragm or salt bridge to permit electric charge transfer, but inhibit penetration of iron ions
04/21/2005US20050082163 Plating apparatus and method
04/21/2005DE10340888B3 Stromversorgungseinrichtung in einer Vorrichtung zur elektrochemischen Behandlung Power supply device in an apparatus for the electrochemical treatment
04/20/2005EP1524338A1 Plating device
04/20/2005EP1523589A2 Electrolytic reactor
04/20/2005CN1198003C Electrochemical catalyst electrode resulting in high endurance of the combination between coating and metal base
04/14/2005WO2005033798A2 Electrochemical micromanufacturing system and method
04/14/2005WO2005033379A1 Microreactors and methods for generating hydrogen peroxide
04/14/2005WO2005033377A2 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
04/14/2005WO2005033371A2 Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation
04/14/2005US20050079089 Alloy coating, method for forming the same, and member for high temperature apparatuses
04/14/2005US20050077185 Conveyorized plating line and method for electrolytically metal plating a workpiece
04/14/2005US20050077183 Anodic oxidation apparatus, anodic oxidation method, and panel for display device
04/14/2005US20050077182 Automatic determine the volume of electroplating solution in the vessel with ultrasonic signal: precisely determine the volume prior feeding into an electrochemical processing system; use in depositing conductive materials on integrated circuit substrates
04/14/2005US20050077173 Plating apparatus for substrate
04/14/2005US20050076837 Conveyorized horizontal processing line and method of wet-processing a workpiece
04/14/2005DE10342200A1 Arrangement for electrochemically depositing a coating material on an electrically contacted substrate immersed in an electrolyte containing coating material comprises a substrate arranged between an anode and a cathode
04/14/2005DE10224817B4 Verfahren und Vorrichtung zum vertikalen Eintauchen von folienartigem Behandlungsgut in Bädern von Galvanisier- und Ätzanlagen Method and apparatus for vertical dipping sheet-treated in baths of electroplating and etching equipment
04/13/2005EP1521868A2 Device and method for monitoring an electrolytic process
04/13/2005EP1521865A1 Electrolytic process and apparatus
04/13/2005CN1196815C Method and equipment for preparing and supplying electrolyte in electro-chemical processing device
04/13/2005CN1196813C Electrode with high-adhesiveness surface catalytic layer
04/07/2005US20050072682 Covering with low cost, high corrosion and abrasion resistant multilayer; metal electroplating and electrostatically spraying and curing organic powder sealant
04/07/2005US20050072680 Rotating about axis passing through surface to be plated and moving wafer such that its axis rotates about second axis of rotation
04/07/2005US20050072358 Substrate processing apparatus and substrate processing method
04/07/2005DE19541231B4 Einrichtung zur elektrolytischen Oberflächenbehandlung schüttfähiger Massenteile in einer Tauchtrommel und Verfahren zum Betrieb dieser Einrichtung Apparatus for electrolytic surface treatment pourable mass parts in a submerged drum and method of operation of this facility
04/06/2005CN1603472A Manufacturing method of catelectrode
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