| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
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| 10/25/2001 | WO2001079592A1 Apparatus and method for electrochemical processing of substrates |
| 10/25/2001 | WO2000041475A3 Component support |
| 10/25/2001 | US20010032788 Divided housing |
| 10/24/2001 | EP0895549A4 Electrochemical fluidized bed coating of powders |
| 10/24/2001 | CN2455733Y Electrolyzer for printed circuit board |
| 10/23/2001 | US6306280 Electroenzymatic reactor and method for enzymatic catalysis |
| 10/23/2001 | US6306269 Method and apparatus for efficiently wet plating and processing small parts |
| 10/18/2001 | WO2001077416A2 Thin copper foil, and process and apparatus for the manufacture thereof |
| 10/17/2001 | EP1145292A1 Substrate carrier |
| 10/16/2001 | US6303010 Methods and apparatus for processing the surface of a microelectronic workpiece |
| 10/11/2001 | US20010027975 Metal finishing barrel cover locking system |
| 10/09/2001 | US6299753 A fluid delivery system with particular application to electroplating. |
| 10/09/2001 | US6299745 Flexible substrate plating rack |
| 10/04/2001 | US20010026877 Used in gas turbines blades, jet engines, boilers; durability |
| 10/04/2001 | EP1138807A2 Perforated anode for uniform deposition of a metal layer |
| 10/03/2001 | CN1316023A Method and apparatus for copper plating using electroless plating and electroplating |
| 09/30/2001 | CA2342511A1 Electrode device, particularly for a tinning bath and the like |
| 09/27/2001 | WO2001071066A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 09/27/2001 | US20010024691 Semiconductor substrate processing apparatus and method |
| 09/26/2001 | EP1136117A2 A mixing apparatus |
| 09/26/2001 | CN1314958A 接触元件 Contact element |
| 09/26/2001 | CN1314504A Liquid bath and weir piece |
| 09/26/2001 | CN1314502A Mixing device |
| 09/25/2001 | US6294060 Conveyorized electroplating device |
| 09/20/2001 | WO2001068953A1 Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof |
| 09/20/2001 | WO2001068952A1 Method and apparatus for electroplating |
| 09/20/2001 | WO2001068949A1 Electro-plating apparatus and method |
| 09/20/2001 | CA2403122A1 Electro-plating apparatus and method |
| 09/20/2001 | CA2391038A1 Method and device for regulating the metal ion concentration in an electrolyte fluid as well as application of said method and use of said device |
| 09/19/2001 | EP1133786A2 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 09/19/2001 | EP1133589A2 Enhanced membrane electrode devices useful for electrodeposition coating |
| 09/19/2001 | CN2448853Y Electroplating hanging frame |
| 09/19/2001 | CN2448852Y Breaking-proof protector for driving-rod of side cover of horizontal electroplating bath |
| 09/18/2001 | US6291080 Thin copper foil, and process and apparatus for the manufacture thereof |
| 09/13/2001 | US20010020583 Reactor vessel having improved cup, anode and conductor assembly |
| 09/12/2001 | EP1132502A2 Method and apparatus for supplying electricity uniformly to a workpiece |
| 09/12/2001 | EP1132499A2 Alloy coating, method for forming the same, and member for high temperature apparatuses |
| 09/12/2001 | EP1051543B1 Method for electroplating metal coating(s) on particulates at high coating speed with high current density |
| 09/11/2001 | US6287445 Coating particles in a centrifugal bed |
| 09/11/2001 | US6287444 Method for producing very small metal ball |
| 09/05/2001 | EP1129237A2 Method and apparatus for electrochemical mechanical deposition |
| 09/05/2001 | CN2446135Y Horizontal electroplated drum |
| 09/05/2001 | CN1311830A Alkali zinc nickel bath |
| 08/30/2001 | WO2001063018A1 Pad designs and structures for a versatile materials processing apparatus |
| 08/30/2001 | US20010017266 Process and apparatus for preparing and replenishing an electrolyte in an electrolyte bath |
| 08/30/2001 | US20010017258 Wafer plating apparatus |
| 08/30/2001 | US20010017105 Wafer plating apparatus |
| 08/28/2001 | US6280583 Reactor assembly and method of assembly |
| 08/28/2001 | US6280582 Reactor vessel having improved cup, anode and conductor assembly |
| 08/23/2001 | DE10007676A1 Electrical contact cable used for drums in galvanizing devices comprises a lead made of electroconductive material, an acid or wear resistant plastic casing, and a detector for detecting leakage of electrolyte from the casing |
| 08/22/2001 | CN1309073A Long lead rack conveying mechanism of electric plating device |
| 08/21/2001 | US6277262 Method and apparatus for continuous processing of semiconductor wafers |
| 08/21/2001 | US6277252 Foldable plating apparatus |
| 08/16/2001 | US20010014409 Article, method, and apparatus for electrochemical fabrication |
| 08/16/2001 | EP1124257A2 Phosphorous doped copper film |
| 08/14/2001 | US6274022 Method for producing electro- or electroless-deposited film with a controlled crystal orientation |
| 08/14/2001 | US6274010 Electroplating apparatus |
| 08/09/2001 | US20010011636 Recovering metal from solution |
| 08/08/2001 | EP1122339A2 Megasonic plating using a submerged transducers-array |
| 08/07/2001 | US6270648 Having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two ?super anodes? on a rotating drum cathode to deposit the treatment |
| 08/07/2001 | US6270647 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 08/07/2001 | US6270646 Compressible porous member having a conductive surface covering substrate to be plated; conductive surface may be polyaniline material |
| 08/02/2001 | WO2000033356A9 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 07/31/2001 | US6267860 Electroconductive support; resistor |
| 07/31/2001 | US6267856 Parallel action holding clamp for electroplating articles |
| 07/25/2001 | CN2440047Y Antileakage device for plate electroplating-machine |
| 07/24/2001 | US6265020 Applying solution to printed circuit; inversion |
| 07/24/2001 | US6264809 Enhanced membrane electrode devices useful for electrodeposition coating |
| 07/19/2001 | WO2001052307A2 Semiconductor workpiece proximity plating methods and apparatus |
| 07/18/2001 | EP1115915A2 Contact element |
| 07/18/2001 | EP1115912A2 Device for partial electrochemical treatment of bar-shaped objects |
| 07/17/2001 | US6261437 Device comprising holder configured to support and hold metallic conductor wire at contact points in predetermined position during anodizing, including cam guides each having guide slots, said wire being spirally wound in guide slots |
| 07/17/2001 | US6261433 Electro-chemical deposition system and method of electroplating on substrates |
| 07/17/2001 | US6261425 Electroplating machine |
| 07/12/2001 | WO2001050505A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 07/12/2001 | WO2000033356A3 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
| 07/12/2001 | DE19962170A1 Substrahthalter Substrahthalter |
| 07/12/2001 | DE10059597A1 Process for opening and closing a drum opening comprises sliding a lid over the drum opening to close the drum, inserting into the lid insertion strip and the lid holding strip and locking against the drum body |
| 07/11/2001 | CN2438728Y Vibrating surface processing apparatus |
| 07/10/2001 | US6258240 Anodizing apparatus and method |
| 07/05/2001 | WO2001048800A1 Semiconductor wafer processing apparatus and processing method |
| 07/05/2001 | WO2001048275A1 Plating device and plating method |
| 07/05/2001 | WO2001048274A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
| 07/04/2001 | EP1113093A1 Plating jig and device for semiconductor wafer |
| 07/04/2001 | CN2437696Y Bath for selection plating production line of IC lead frame |
| 07/03/2001 | US6254759 Method and apparatus for anodizing objects |
| 07/03/2001 | US6254757 Method for electrochemical fluidized bed coating of powders |
| 07/03/2001 | US6254755 Electroplating process for oldham ring and scroll member type compressor comprising the same |
| 06/28/2001 | WO2001046996A2 Substrate holder |
| 06/28/2001 | WO2000003072A9 Method and apparatus for copper plating using electroless plating and electroplating |
| 06/28/2001 | US20010004965 Useful for electroplating a pin grid array package having multiple pins, which are electrically connected with less physical contact; reduces damage to the pin caused by removal of the pin from the apparatus after electroplating |
| 06/28/2001 | DE10063624A1 Electroplating system has anodes in the plating bath together with electrically conductive rollers as cathodes to move the workpieces forwards or backwards through the bath |
| 06/27/2001 | CN1300882A Apparatus and method for electroplating treatment |
| 06/26/2001 | US6251254 Electrode for chromium plating |
| 06/26/2001 | US6251251 Anode isolator including at least one curvilinear surface that faces the anode and a surface that faces the cathode |
| 06/26/2001 | US6251236 Cathode contact ring for electrochemical deposition |
| 06/26/2001 | US6251234 Electroplating machine |
| 06/22/2001 | CA2329553A1 An electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths |
| 06/21/2001 | WO1998007898A8 Flake-resistant multilayer thin-film electrodes and electrolytic cells incorporating same |
| 06/20/2001 | CN2435408Y Structure-improved electrolytic coating barrel |