Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
01/2001
01/16/2001US6174418 Continuous plating apparatus
01/16/2001US6174417 Electroplating machine
01/10/2001EP1067221A2 Method and apparatus for plating substrate and plating facility
01/10/2001EP1066209A1 Device for treating plate-shaped work pieces, especially printed-circuit boards
01/10/2001CN2414081Y Overhead hanging frame structure adapted to sheet piece surface treatment
01/10/2001CN2414080Y High-speed electroplating equipment
01/04/2001WO2001000905A1 Method of producing copper foil
01/04/2001DE19930708A1 Container for an electrolytic bath
01/03/2001CN1278874A Method for producing very small metal ball
01/03/2001CN1278873A Method for producing abrasive tips for gas turbine blades `
01/02/2001US6168695 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
01/02/2001US6168691 Device for electrochemical treatment of elongate articles
12/2000
12/27/2000EP1063322A2 Anode structure for manufacture of metallic foil
12/27/2000CN1278023A Positve electrode structure for mfg. metal foil
12/26/2000US6165330 Continuous plating apparatus
12/21/2000WO2000077279A1 Method and apparatus for synthesis and characterisation of electrode materials
12/19/2000US6162335 Apparatus for selectively electroplating an airfoil
12/14/2000WO2000075402A1 Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell
12/14/2000WO2000075401A1 Simultaneous electrical and fluid connection for anode
12/13/2000EP1059663A2 Process for producing a semiconductor thin film with a bonding and separating steps, solar cell fabrication and anodizing apparatus
12/13/2000CN2410307Y Flexible tool for electrolytic and electrochemical compound machining
12/13/2000CN2410306Y Improved thin rod type surface treatment hanging device
12/13/2000CN2410305Y Improved lath type surface treatment hanging device
12/13/2000CN2410304Y Improved tension-fixed type hanging rack
12/07/2000WO2000050670A3 Apparatus for electro-dipcoating
12/07/2000DE19921422A1 Contacting system for supplying a current to components in galvanic baths has a side plate arranged on one contact element so that is protrudes over the slide valve in the direction of the contacting region
12/05/2000US6156169 Electroplating anode titanium basket
11/2000
11/29/2000EP1055618A1 Apparatus for the treatment, coating, or the like of small articles, in particular screws
11/29/2000EP0944748A4 Flake-resistant multilayer thin-film electrodes and electrolytic cells incorporating same
11/28/2000US6153065 Internal stress testing device for high speed electroplating
11/28/2000US6153064 Apparatus for in line plating
11/23/2000WO2000070128A1 Plating jig and device for semiconductor wafer
11/22/2000EP1054413A2 Method of chemically decontaminating components of radioactive material handling facility and system for carrying out the same
11/22/2000CN2407017Y Sheet article feeder for continuous electroplating
11/15/2000EP1051886A2 Device for electrolytic treatment of printed circuit boards and conductive films
11/15/2000EP1051543A2 Method for electroplating metal coating(s) on particulates at high coating speed with high current density
11/15/2000CN1273545A Device for retaining components made from ferromagnetic material
11/09/2000WO2000066814A1 Electroplating barrel
11/09/2000WO2000032848A3 An inflatable compliant bladder assembly
11/09/2000WO2000011245A3 Device for partial electrochemical treatment of bar-shaped objects
11/09/2000WO2000006806A3 Device for the electrodeposition and removal of metal
11/09/2000DE19916139C1 Plastic-lined electroplating tank production process comprises creating a reduced pressure between a liner of butt welded plastic plates and a steel casing
11/08/2000EP1050607A2 A method and an equipment for the electrolytic deposition of gold or gold alloys
11/08/2000EP1049819A1 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product
11/01/2000CN2403792Y Apparatus for auxiliary anode spraying zinc liquid electroplating steel conduit inwall
10/2000
10/31/2000CA2211870C Apparatus and method for selective coating of metal parts
10/26/2000DE19918207A1 Lined corrosive liquid container, used as a pickling tank, process bath or dip lacquering tank, has a gas permeable layer between its casing and the lining
10/25/2000CN2402691Y Electro-deposition coating device
10/25/2000CN1057803C Device for electrolytic treatment of board-shaped objects
10/19/2000WO2000061837A1 Workpiece processor having processing chamber with improved processing fluid flow
10/19/2000WO2000061498A2 System for electrochemically processing a workpiece
10/19/2000WO2000022194A3 Method of, and apparatus for, electro-plating a structure
10/18/2000CN2401570Y Sehet component holder for continuous electroplating
10/17/2000US6132570 Method and apparatus for continuous processing of semiconductor wafers
10/12/2000WO2000060141A1 Three layer anode and methods of manufacture
10/12/2000WO2000059682A1 Method and apparatus for plating and polishing a semiconductor substrate
10/12/2000WO2000026443A3 Method and apparatus for electrochemical mechanical deposition
10/12/2000DE19914867A1 Electrochemical writing process, for flat or curved electrically conductive e.g. metallic surfaces, uses flat character segment electrodes individually connected to a switch unit for controlled current supply
10/11/2000EP1042541A1 Method for producing abrasive tips for gas turbine blades
10/11/2000CN1269848A Electrochemical dissolution of nuclear fuel pins
10/10/2000US6129820 Electroplating installation, electrode and support device for this installation and electroplating process
10/04/2000CN2399403Y Alloyed launder
10/03/2000US6126808 A reaction chamber holding an electrolyte for surface treating the head of aluminum pistons used in combustion engines
10/03/2000US6126798 Electroplating anode including membrane partition system and method of preventing passivation of same
10/03/2000US6126795 For biocatalytic oxidation and reduction to transform substrates with high regio-and/or stereo-selectivity
09/2000
09/28/2000WO2000056453A1 Method for producing a catalyst by means of electrodeposition
09/28/2000DE19912897A1 Katalysator und Verfahren zur Herstellung eines Katalysators Catalyst and process for the preparation of a catalyst
09/28/2000CA2367893A1 Method for producing a catalyst by means of electrodeposition
09/21/2000WO2000055888A1 Device for treating substrates
09/21/2000WO2000054889A1 Jig cleaning
09/21/2000DE19911084A1 Vorrichtung zum Behandeln von Substraten Apparatus for processing substrates
09/20/2000CN1267341A Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated
09/14/2000WO2000053829A1 Apparatus and method for strip solder plating
09/14/2000DE19901624A1 Bauteilträger Component carrier
09/05/2000US6113759 Anode design for semiconductor deposition having novel electrical contact assembly
09/05/2000US6113755 Apparatus for producing an electrode foil for use in aluminum electrolytic capacitors
08/2000
08/31/2000WO2000050670A2 Apparatus for electro-dipcoating
08/31/2000WO2000026445A3 Enhanced membrane electrode devices useful for electrodeposition coating
08/30/2000EP1031647A2 Apparatus and method for plating a wafer
08/24/2000WO2000049206A1 Continuous band plating device
08/24/2000WO1998049374A3 Device for electrolytic treatment of printed circuit boards and conductive films
08/23/2000EP1029954A1 Substrate plating device
08/22/2000US6106687 Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate
08/22/2000US6106680 Apparatus for forming a copper interconnect
08/17/2000WO2000032835A8 Electro-chemical deposition system
08/16/2000EP1028180A1 Method for producing very small metal ball
08/16/2000EP1027481A1 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
08/16/2000EP1027480A1 Electrodes for semiconductor electroplating apparatus and their application
08/15/2000US6103085 Semiconductor wafers
08/15/2000US6103076 Auxiliary anode element suitable for use in electroplating a bent tubular workpiece
08/10/2000WO2000011679A3 Contact element
08/09/2000EP1026288A1 Freely detachable insoluble anode
08/08/2000US6099709 Method of producing an electrode foil for use in aluminum electrolytic capacitors
08/08/2000US6099702 Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
08/03/2000DE19901765A1 Assembly to carry a gravure printing cylinder in an electroplating bath has moving clamping pads for the roller ends with holders and centering hollow cones to grip the axis ends with current flow contact and sealing
08/02/2000CN2389902Y Anode titanium basket for electroplating
07/2000
07/26/2000CN1054894C Anode clamp
07/25/2000US6093291 Electroplating apparatus
07/20/2000WO2000041475A2 Component support
07/19/2000EP1019566A1 Electrochemical dissolution of nuclear fuel pins
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