Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
10/2005
10/06/2005US20050218003 Electropolishing and/or electroplating apparatus and methods
10/06/2005US20050218002 Electroplating using an apparatus with a selective shield/material flow assembly between the anode and the cathode and forming adjustable openings having adjustable sizes for selectively and controllably adjusting the amount of electric flux passing through the assembly and distribution on the workpiece
10/06/2005US20050217990 Fabrication and use of semipermeable membranes and gels for the control of electrolysis
10/06/2005US20050217989 Spouted bed apparatus with annular region for electroplating small objects
10/05/2005EP1583138A1 Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
10/05/2005EP1583135A1 Proximity head heating method and apparatus
10/05/2005EP1581673A2 Anode used for electroplating
10/05/2005EP1579038A3 Method and device for producing a textured metal strip
10/05/2005CN1679156A Tilted electrochemical plating cell with constant wafer immersion angle
10/05/2005CN1221685C Device for electroplating steel band metal coating
09/2005
09/29/2005WO2005091340A1 Single workpiece processing chamber
09/29/2005WO2005090647A1 Process and apparatus for the electrogalvanic coating of metal items
09/29/2005US20050211569 electrode with a metal catalyst and Raney metal or alloy catalyst supports; electrolytic cells, ammonia fuel cells, ammonia sensors; removing ammonia contaminants from contaminated effluents or for the production of hydrogen, for hydrogen fuel cell
09/29/2005US20050211560 applying cothodic potentials to electroconductive layers formed on substrate having depression patterns, then dipping in a solution that is in contact with an anode, to form films; electrochemistry; electrodepostion
09/29/2005US20050211551 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/29/2005US20050211290 Integrated photoelectrochemical cell and system having a liquid electrolyte
09/28/2005EP1579038A2 Method and device for producing a textured metal strip
09/28/2005EP1579037A2 Method and apparatus for electrolyzing water
09/28/2005CN2729097Y Automatic-locking regulation mechanism of two-position mounted small-slope guide plate panel
09/28/2005CN2729096Y Combined correction device of force automatic correction and one-way component force aligning symmetrical component
09/28/2005CN1673419A Electroplating apparatus for rectangle material and conveying method for rectangle material
09/28/2005CN1220798C Pad designs and structures for universal material working equipment
09/28/2005CN1220796C Process for plating Cr on inner cavity of cylinder sleeve
09/22/2005WO2005086696A2 Inert anode electrical connection
09/22/2005US20050205429 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating
09/22/2005US20050205419 Apparatus and methods for electrochemical processsing of microelectronic workpieces
09/22/2005US20050205409 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/22/2005DE202005011141U1 Galvanic bath with electrolyte injector for surface treatment of suspended workpieces with guide plates, upper lower, and side plates and anode plates useful in electrodeposition of metals
09/21/2005EP1577421A1 Substrate processing apparatus and method for processing substrate
09/20/2005CA2252923C Method and installation for the electrolytic coating with a metal layer of the surface of a cylinder for the continuous casting of thin metal strips
09/15/2005US20050202269 Composite magnetic particles and foils
09/15/2005US20050201918 Gas diffusion electrode and catalyst for electrochemical oxygen reduction and method of dispersing the catalyst
09/15/2005US20050199508 Inert anode electrical connection
09/15/2005US20050199503 Single workpiece processing chamber
09/14/2005EP1573094A2 Device and method for electrolytically treating an at least superficially electrically conducting work piece
09/14/2005EP1572592A2 A combined electrochemical system for scale treatment and eradicating legionella pneumophila bacteria in water supply systems
09/14/2005CN1668785A Device and method for monitoring an electrolytic process
09/14/2005CN1667879A Electronic connector terminal, a method for plating, and a terminal stack
09/13/2005US6942780 Method and apparatus for processing a substrate with minimal edge exclusion
09/13/2005US6942767 Chemical reactor system
09/13/2005US6942765 Submicron and nano size particle encapsulation by electrochemical process and apparatus
09/09/2005WO2005065082A3 Carbon-coated silicon particle power as the anode material for lithium ion batteries and the method of making the same
09/09/2005WO2005064043A3 Improved metal strip electroplating
09/09/2005WO2005017971A9 Nanomachined and micromachined electrodes for electrochemical devices
09/08/2005US20050194263 Electrochemical water purification system and method
09/08/2005US20050194257 Plating of the inner surfaces of the objects occurs by flowing an electroplating solution from the reservoir through the stack conduit in the presence of a current
09/08/2005US20050194249 Electrolytic cell leak limiter
09/08/2005US20050194248 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/07/2005CN2723467Y Electroplating frame reinforced connector
09/07/2005CN2723466Y Flying torget structure for electroplating frame
09/07/2005CN1665592A Device and method for increasing mass transport at liquid-solid diffusion boundary layer
09/07/2005CN1217833C Conveying belt for conveying semi-conductor lead wire sheets
09/06/2005US6939455 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
09/06/2005US6939448 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
09/06/2005US6939206 Method and apparatus of sealing wafer backside for full-face electrochemical plating
09/01/2005US20050189237 Apparatus of intermediate chamber formed by contacting two rigid plates held together, an anode, a cathode and a membrane, electrolyzing the water by charging the anode plate with direct current producing acidic electrolytic water
09/01/2005US20050189229 Method and apparatus for electroplating a semiconductor wafer
09/01/2005US20050189228 Electroplating apparatus
09/01/2005US20050189227 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
09/01/2005US20050189214 Apparatus and methods for electrochemical processing of microelectronic workpieces
09/01/2005US20050189213 Method and apparatus for copper plating using electroless plating and electroplating
08/2005
08/31/2005CN1662679A Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
08/31/2005CN1217034C Workpiece processor having processing chamber with improved processing fluid flow
08/30/2005US6936142 Spouted bed apparatus for contacting objects with a fluid
08/25/2005WO2005076977A2 Plating apparatus and method
08/25/2005US20050184369 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
08/25/2005US20050183963 thiol or disulfide with a sulfo, carboxyl, quaternary ammonium or amino ion exchange group is chemically bonded to surface of gold, silver, platinum, copper, gallium arsenide, cadmium sulfide or indium oxide; stable processing performance and flexibly, cope with small electrodes and various shapes
08/25/2005US20050183952 Electrode
08/24/2005CN2719870Y Continuous electroplating line electroplating tank main-secondary tank structure
08/24/2005CN1659686A 衬底处理设备和衬底处理方法 The substrate processing apparatus and a substrate processing method
08/24/2005CN1659315A Apparatus and methods for electrochemical processing of microelectronic workpieces
08/23/2005US6932884 Substrate processing apparatus
08/23/2005CA2121937C Membrane and electrode structure
08/18/2005WO2003012172A3 Method and device for producing a textured metal strip
08/18/2005US20050178667 Actively changing the first current distribution to produce a second current distribution different from the first in the electrolytic fluid while the microelectronic workpiece is in contact therewith
08/18/2005US20050178666 to effectively provide a surface having a desired pattern; masking; electrochemical deposition; conductive base structure comprises a fabric layer; woven conductive fiber material or a woven dielectric fiber at least partially covered with a conductive material
08/18/2005US20050178665 Electroplating tool
08/18/2005DE10228400B4 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten Device for electroplating of electronic circuit boards
08/17/2005CN1215202C Porous nickel foil for alkaline battery cathode, production method and device therefor
08/11/2005WO2005073438A1 Zinc or zinc alloy deposition installation
08/11/2005WO2005072098A2 Electrode tool for electrochemical machining and method for manufacturing same
08/11/2005WO2005008806A3 Photoelectrolysis of water using proton exchange membranes
08/11/2005US20050173250 Preventing voids during metal electrodeposition on integrated circuits; simultaneously regulating voltage between anode and cathode to reference electrode
08/11/2005US20050173243 Device and method for increasing mass transport at liquid-solid diffusion boundary layer
08/11/2005US20050173242 Electrochemical device and method for scale deposition and removal
08/11/2005US20050173241 In an electroplating cell, providing an anode chamber with at least two concentric anodes, generating a computer generated model with a simulation computer program; and selecting at least one current ratio from the model
08/10/2005CN2716295Y Immersion pre-processing electrolytic cell for continuous plating line electrode roller
08/10/2005CN1653211A Electropolishing and/or electroplating apparatus and methods
08/10/2005CN1214133C Method and apparatus for electrochemical mechanical deposition
08/09/2005US6926817 Solution processing apparatus and solution processing method
08/09/2005US6926813 Electrical contacting element made of an elastic material
08/09/2005US6926812 Electric feeding method and apparatus for a continuous plating apparatus
08/04/2005WO2002097171A3 Plant for the surface treatment of metallic end-products, in particular aluminum, by means of a plasma effect generated in the so-called helmotz layer of a dielectric solvent, changed into a conductor by its solution with an acid in an electrochemical cell
08/04/2005US20050167284 immersing printed circuits, substrates, metal maskings, semiconductor wafers or magnetic heads having patterned conductive layers, in neutral solutions, then applying a voltage to induce current between the conductive layer and a counter electrode at a specified current density, rinsing and drying
08/04/2005US20050167275 Method and apparatus for fluid processing a workpiece
08/04/2005US20050167274 Automatic process control; using facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
08/04/2005US20050167273 Automatic process control; using facility for automatically selecting and refining electrical parameters for processing a microelectronic workpiece
08/04/2005US20050167265 System for electrochemically processing a workpiece
08/04/2005DE19633797B4 Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen Device for electroplating of electronic circuit boards or the like
08/03/2005EP1559163A2 Fluorine separation and generation device
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