| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
|---|
| 12/24/2002 | US6497801 Electroplating apparatus with segmented anode array |
| 12/24/2002 | US6497800 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
| 12/19/2002 | US20020189934 Electric feeding method and apparatus for a continuous plating apparatus |
| 12/18/2002 | CN1385557A Copper phosphide anode for electroplating |
| 12/17/2002 | US6495211 Process for producing a substrate and plating apparatus |
| 12/17/2002 | US6495018 A single delivery channel is formed by, and between, inner wall 2 and baffle 3. electrolyte 5 is pumped up the interior of channel 1 and is directed onto substrate 4 being a cathode maintained at -10 volts. the upper part of the inner wall 2 of |
| 12/17/2002 | US6495005 Electroplating apparatus |
| 12/12/2002 | WO2002068727A3 Copper-plating solution, plating method and plating apparatus |
| 12/12/2002 | US20020185065 Electrolyte-spraying casing for an electroplating apparatus |
| 12/12/2002 | US20020184964 Spinning rotor |
| 12/11/2002 | EP1264918A1 Electrolytic copper plating method |
| 12/11/2002 | EP1264010A1 Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof |
| 12/11/2002 | CN2525104Y Improved structure of anode device |
| 12/11/2002 | CN1095882C Electrolytic treating device for plate-like workpieces, in particular print circuit boards |
| 12/05/2002 | WO2002097171A2 Plant for the surface treatment of metallic end-products, in particular aluminum, by means of a plasma effect generated in the so-called helmotz layer of a dielectric solvent, changed into a conductor by its solution with an acid in an electrochemical cell |
| 12/05/2002 | WO2002097170A2 Mobile zinc cathode stripping system |
| 12/05/2002 | WO2002097165A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 12/05/2002 | US20020179450 Selective shield/material flow mechanism |
| 12/05/2002 | US20020179438 Plating clamp assembly |
| 12/05/2002 | US20020179437 Conducting roller assembly for an electroplating apparatus |
| 12/05/2002 | US20020179436 Distributed power supplies for microelectronic workpiece processing tools |
| 12/05/2002 | US20020179431 Mobile zinc cathode stripping system |
| 12/05/2002 | US20020179430 Submicron and nano size particle encapsulation by electrochemical process and apparatus |
| 12/04/2002 | CN1382833A Electroplating method with rotating hanger |
| 11/28/2002 | US20020175071 Copper interconnect seed layer treatment methods and apparatuses for treating the same |
| 11/28/2002 | DE10145554C1 Device for transporting and wet chemical treating and/or electrolytically treating flat and very thin material comprises support arms, a guide, supporting elements, tensioning stands with hanging elements and fixing rods |
| 11/28/2002 | DE10124251A1 Device for holding a workpiece such as rollers in the paper industry or temper rollers in the manufacture of sheet metal has a retainer for an adapter arranged on the workpiece to hold the workpiece |
| 11/27/2002 | EP1259661A1 Pad designs and structures for a versatile materials processing apparatus |
| 11/27/2002 | CN2522432Y Copper wire silver-electroplating tank |
| 11/27/2002 | CN1382233A Conveyorized electroplating device |
| 11/27/2002 | CN1382232A Method and device for electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 11/27/2002 | CN1382231A Method and device for electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on surface of electrically insulating film materials and use of |
| 11/26/2002 | US6485620 Device for electroplating on translating metal sheets, especially for printed circuits, by closure of an electric circuit between the sheets and a liquid reactant product |
| 11/21/2002 | WO2002092883A1 Method, apparatus and system for electro-deposition of a plurality of thin layers on a substrate |
| 11/21/2002 | DE10124468A1 Device for receiving galvanized material has vessels and/or supporting elements made from steel and have an acid-resistant, heat-resistant non-metallized coating on the surfaces in contact with the treating medium |
| 11/19/2002 | US6482298 Apparatus for electroplating alloy films |
| 11/14/2002 | US20020166575 Solution processing apparatus and solution processing method |
| 11/14/2002 | DE10121937A1 Tensioning device used for engraved cylinders comprises holders with recesses for receiving one end of a cylinder arranged on a common axis |
| 11/13/2002 | EP1256639A1 Multiple bath electrodeposition |
| 11/13/2002 | CN1379829A Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and method for electrolytically treating workpieces |
| 11/13/2002 | CN1094156C 有调整装置的电沉积槽 Adjust electrodeposition bath apparatus |
| 11/12/2002 | US6478936 Anode assembly for plating and planarizing a conductive layer |
| 11/07/2002 | WO2002088431A1 Anode assembly and process for supplying electrolyte to a planar substrate surface |
| 11/07/2002 | US20020162750 Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs |
| 11/06/2002 | CN2519808Y Structure improvement for inclained arm type electroplating tank |
| 11/05/2002 | US6475369 Method for electrochemical fabrication |
| 11/05/2002 | US6475357 Inflatable compliant bladder assembly |
| 10/31/2002 | US20020157960 Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
| 10/30/2002 | EP1252650A1 Substrate processing apparatus |
| 10/30/2002 | CN1376625A Surface treatment device |
| 10/30/2002 | CN1376624A Surface treatment device |
| 10/30/2002 | CN1376542A Surface treatment device |
| 10/30/2002 | CN1093572C Technology for producing Cu-P anode |
| 10/29/2002 | US6471846 Electric feeding method and apparatus for a continuous plating apparatus |
| 10/24/2002 | WO2002084771A1 Hydrogen recharging system for fuel cell hydride storage reservoir |
| 10/24/2002 | WO2002084714A2 Method and apparatus for electrochemically depositing a material onto a workpiece surface |
| 10/24/2002 | WO2002083995A1 Method of and apparatus for controlling fluid flow |
| 10/24/2002 | US20020153256 Method and apparatus for depositing and controlling the texture of a thin film |
| 10/22/2002 | US6468410 Method for synthesis and characterization of electrode materials |
| 10/17/2002 | WO2002081783A1 Workpiece wet processing |
| 10/17/2002 | US20020148732 Method and apparatus for electrochemically depositing a material onto a workpiece surface |
| 10/16/2002 | EP1249518A1 Use of substantially oxygen-free, dendritic and uncoated copper for galvanic plating of printing cylinders |
| 10/16/2002 | CN1092720C Anodizing apparatus, method and semiconductor substrate producing process |
| 10/16/2002 | CN1092718C Electrochemical process |
| 10/10/2002 | US20020144900 Anodizing foil in first electrolyte solution, passing foil through oven, anodizing foil in second anodizing solution wherein first and second electrolyte solutions each comprise glycerine, ammonium phosphate, and de-ionized water |
| 10/10/2002 | US20020144894 Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
| 10/03/2002 | WO2002077328A1 Phosphate film processing method and phosphate film processing device |
| 10/03/2002 | US20020139684 Pump for supplying plating fluid from the reservoir tank to the closed plating cup cyclically changes the pressure or flow rate of the plating fluid to prevent air bubbles in the blind holes of the plating member |
| 10/03/2002 | US20020139678 Automatic process control, more particularly, controlling a material deposition process; electroplating; constructing a Jacobian sensitivity matrix of the effects on plated material thickness at each of a plurality of workpiece position |
| 10/03/2002 | US20020139663 Chemical treatment system |
| 10/02/2002 | EP1245038A2 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
| 10/02/2002 | CN1372019A Device and method for controlling electric power line distribution |
| 10/02/2002 | CN1372018A Device and method for controlling electric power line distribution |
| 09/26/2002 | WO2002075792A2 Method of sealing wafer backside for full-face electronchemical plating |
| 09/26/2002 | US20020137442 Jig cleaning |
| 09/26/2002 | US20020134673 Anodizing barrel with pump attached |
| 09/26/2002 | DE10111727A1 Vorrichtung und Verfahren zur Regenerierung chromsäurehaltiger Lösungen in elektrolytischen Verchromungsbädern Apparatus and method for regeneration of chromic acid solutions in electrolytic chromium plating baths |
| 09/25/2002 | EP1243672A1 Plating device and plating method |
| 09/24/2002 | US6454927 Electrodeposition |
| 09/24/2002 | US6454926 Uniform copper layer |
| 09/24/2002 | US6454917 High throughput and high performance copper electroplating tool |
| 09/24/2002 | US6454258 Device for treating plate-shaped work pieces, especially printed-circuit boards |
| 09/19/2002 | WO2002072924A2 Device and method for regenerating solutions containing chromic acid in electrolytic chroming baths |
| 09/19/2002 | US20020130034 Pad designs and structures for a versatile materials processing apparatus |
| 09/18/2002 | EP1240680A2 High differential pressure electrochemical cell |
| 09/18/2002 | EP1240663A2 Substrate holder |
| 09/18/2002 | EP0909346B1 Method and installation for the electrolytic coating with a metal layer of the surface of a cylinder for the continuous casting of thin metal strips |
| 09/18/2002 | CN2511690Y Gilding decorative shelf |
| 09/18/2002 | CN1369954A Electroplating current supply system |
| 09/17/2002 | US6451194 Feeding a powdered electrolytic salt into a electrolytic bath, which is drawn by a vacuum created by a powder wetting device which supplies the salt directly into electrolytic solution which replenishes electrolyte consmed during plating |
| 09/17/2002 | US6449833 Automation apparatus for installing and removing a metal finishing barrel locking cover |
| 09/12/2002 | WO2002070791A1 Fluid treatment system |
| 09/12/2002 | WO2002070144A1 Internal heat spreader plating methods and devices |
| 09/12/2002 | US20020127956 Method of sealing wafer backside for full-face electrochemical plating |
| 09/12/2002 | US20020127829 Solution processing apparatus and solution processing method |
| 09/12/2002 | US20020125141 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| 09/12/2002 | CA2433031A1 Internal heat spreader plating methods and devices |
| 09/11/2002 | CN1369024A Lift and rotate assembly for use in workpiece procesing station and method of attaching the same |
| 09/06/2002 | WO2002068730A1 Plating device and plating method |
| 09/06/2002 | WO2002068727A2 Copper-plating solution, plating method and plating apparatus |