| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
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| 01/20/2005 | US20050014368 Substrate holder and plating apparatus |
| 01/19/2005 | EP1497483A1 Platinum electrode and method for manufacturing the same |
| 01/19/2005 | CN1185372C Conveyer for electroplating system |
| 01/19/2005 | CA2474830A1 Device for galvanizing member-shaped substrates |
| 01/18/2005 | US6844274 Substrate holder, plating apparatus, and plating method |
| 01/18/2005 | US6843897 Anode slime reduction method while maintaining low current |
| 01/13/2005 | WO2005003411A1 Tin alloy electroplating system |
| 01/13/2005 | US20050006244 Electrode assembly for electrochemical processing of workpiece |
| 01/13/2005 | US20050006243 Positioning object in concave zone of carrier tape; plating, washing; electrolytic cell |
| 01/13/2005 | US20050005963 Photoelectrolysis of water using proton exchange membranes |
| 01/13/2005 | DE20122301U1 Device for chemical and electrolytic surface treatment of rod-like components has rotating chambers arranged along a longitudinal axis |
| 01/12/2005 | EP1496142A2 Electroplating method and electroplating apparatus |
| 01/12/2005 | EP1495162A1 Web processing method and apparatus |
| 01/12/2005 | CN2670382Y Thin-plate electroplating pylons |
| 01/06/2005 | WO2005001896A2 Wet chemical processing chambers for processing microfeature workpieces |
| 01/06/2005 | WO2004031454A3 Cathode design for use in electrodeposition cell |
| 01/06/2005 | US20050003637 Damascene fabrication with electrochemical layer removal |
| 01/06/2005 | US20050000821 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
| 01/06/2005 | US20050000820 Apparatus and method for processing a substrate |
| 01/06/2005 | US20050000804 Rapid thermal cycling device |
| 01/06/2005 | US20050000800 Gas liquid phase separator with improved pressure control |
| 01/06/2005 | US20050000797 Mobile zinc cathode stripping system |
| 01/05/2005 | EP1493847A2 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product |
| 01/05/2005 | EP1492907A1 Electropolishing and/or electroplating apparatus and methods |
| 01/05/2005 | CN1561409A Segmented counterelectrode for an electrolytic treatment system |
| 01/04/2005 | US6837979 Plating conductive layer by applying a plating solution using an anode having a pad attached, when anode and substrate are energized with electric power; altering texture of top portion of conductive layer when pad makes contact with top portion |
| 12/30/2004 | US20040267351 Positioning a design on gig to form stent, immersion in liqud baths with electrolytes, electropolishing or electrodepositing |
| 12/30/2004 | US20040262164 Method and apparatus for managing plating interruptions |
| 12/30/2004 | US20040262150 Plating device |
| 12/30/2004 | DE10322321A1 Electrolytic arrangement and method for manufacturing moldings, especially for dental use as crowns or bridges, whereby a special raising and lowering assembly is provided for the anode and cathode |
| 12/29/2004 | CN1558967A Electrode attachment to anode assembly |
| 12/28/2004 | US6835294 Dummy electrolysis corrects reduction in via-holes filling |
| 12/23/2004 | WO2004110698A2 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes |
| 12/23/2004 | US20040256240 System and process to control electroplating a metal onto a substrate |
| 12/23/2004 | US20040256238 Capable of increasing the in-plane uniformity of film thickness by making a more uniform electric field distribution over the entire surface to be processed, even if the substrate has a large area, and more uniformly controlling the speed |
| 12/23/2004 | US20040256224 First electrode wafer of an interlayer dielectric having a feature, an underlayer on the layer, a barrier layer on the underlayer and a conductive layer in the feature and a second electrode; both electrodes immersed in an electrolyte and have a potential difference between them |
| 12/23/2004 | US20040256222 Apparatus and method for highly controlled electrodeposition |
| 12/23/2004 | US20040256221 Electrolytic solution supply and recovery facility and liquid component replenishment apparatus |
| 12/23/2004 | US20040256220 Plating barrel, barrel plating apparatus and drain equipment |
| 12/23/2004 | US20040256219 Device for the electrodeposition of aluminum or aluminum alloys from organometallic electrolytes containing alkyl |
| 12/23/2004 | DE202004016062U1 Device for placing, and holding for dipping flat metal body, especially a copper plate with a cooling element useful in electroplating operations and avoiding plating bath contamination with dirt or corrosion particles |
| 12/23/2004 | DE10349392B3 Demetallizing contact devices in galvanizing plants used in production of circuit boards or foils comprises chemically etching auxiliary electrode during electrolytic metallization and simultaneously demetallizing |
| 12/22/2004 | EP1489203A1 ELECTROLYTIC COPPER PLATING METHOD, PHOSPHORUS−CONTAINING ANODE FOR ELECTROLYTIC COPPER PLATING, AND SEMICONDUCTOR WAFER PLATED USING THEM AND HAVING FEW PARTICLES ADHERING TO IT |
| 12/22/2004 | EP1489202A1 Plating barrel, barrel plating apparatus and drain equipment |
| 12/22/2004 | EP1488025A1 Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 12/22/2004 | CN1556875A Electroforming system and electroforming method |
| 12/22/2004 | CN1181229C Electrochemical processing device and method for transferring current to printed circuitboard material |
| 12/16/2004 | WO2004108995A1 Zinc and zinc-alloy electroplating |
| 12/15/2004 | EP1486589A1 Membrane electrode assemblies and electropaint systems incorporating same |
| 12/15/2004 | CN1554805A Electroplating method and electroplating device special for such electroplating method |
| 12/15/2004 | CN1179799C Surface treatment device |
| 12/14/2004 | US6831002 Manufacturing method of semiconductor device |
| 12/14/2004 | US6830827 Alloy coating, method for forming the same, and member for high temperature apparatuses |
| 12/14/2004 | US6830673 Anode assembly and method of reducing sludge formation during electroplating |
| 12/14/2004 | US6830667 Cathode cartridge and anode cartridge of testing device for electroplating |
| 12/09/2004 | US20040245113 Electrochemical cell containing anolyte and catholyte compartments separated by a selective membrane that prevents ionic metals from migrating from the catholyte compartment to the anolyte compartment; latent whiskering is minimized and/or eliminated |
| 12/09/2004 | US20040245112 Apparatus and method for plating a substrate |
| 12/09/2004 | US20040245111 Plating tank for wire patterns on film carrier; prevent bubble adhesion |
| 12/09/2004 | US20040245106 Compact construction; baths; agitation means; liquid supply tunnels; discharging; plating |
| 12/09/2004 | US20040245094 Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
| 12/09/2004 | US20040245093 Method and conveyorized system for electorlytically processing work pieces |
| 12/08/2004 | EP1484431A2 Liquid tank |
| 12/08/2004 | EP1483430A1 Non-cyanide copper plating process for zinc and zinc alloys |
| 12/08/2004 | EP1222323A4 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 12/07/2004 | US6827834 Process for copper plating a zinc or zinc alloy article comprising the steps of: a. immersing said zinc or zinc alloy article in an aqueous nickel solution, said nickel solution comprising a source of nickel, a source of pyrophosphate, and |
| 12/07/2004 | US6827827 Metal plating apparatus and process |
| 12/02/2004 | WO2004103898A1 Compositions, devices and methods for stabilizing and increasing the efficacy of halogen dioxide solutions |
| 12/02/2004 | WO2004052547A3 Coated and magnetic particles and applications thereof |
| 12/02/2004 | US20040237896 Plating apparatus |
| 12/02/2004 | DE10323660A1 Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisierung für Leiterplatten Device for treating objects, particularly plating for circuit boards |
| 12/02/2004 | CA2522576A1 Compositions, devices and methods for stabilizing and increasing the efficacy of halogen dioxide solutions |
| 12/01/2004 | EP1481116A1 Conveyorized horizontal processing line and method of wet-processing a workpiece |
| 12/01/2004 | EP1481114A2 Apparatus and methods for electrochemical processing of microelectronic workpieces |
| 12/01/2004 | EP1480784A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 12/01/2004 | EP1230441B1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 12/01/2004 | CN2659902Y Plate bottom screen with guider |
| 12/01/2004 | CN1551931A Method and apparatus for controlling thickness uniformity of electroplated layers |
| 12/01/2004 | CN1550576A Electrolytic electrode and process of producing the same |
| 11/30/2004 | US6824657 Component support |
| 11/25/2004 | WO2004101865A2 Device for treating objects, in particular for plating printed circuit boards |
| 11/25/2004 | WO2003025255A3 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 11/25/2004 | WO2003025254A3 Device for the transport and wet-chemical or electrolytic treatment of very thin and planar items to be treated |
| 11/25/2004 | US20040235219 Plating apparatus, plating method, and method for manufacturing semiconductor device |
| 11/25/2004 | US20040234683 forming plating layers having uniform thickness and smoothness on surfaces of resin fines selected from network structure polymers, thermosetting resins or elastic bodies, having conductive base layers using electrolytic cells having a rotatable barrel in the bath, while vibrating the barrel; alloys |
| 11/25/2004 | US20040232096 Using an elongate carrier having support members which support articles during the coating process, each having an opening leading to a recess extending from the opening in a direction parallel to a longitudinal axis; made by laser cutting a metal sheet material to obtain a desired profile. |
| 11/25/2004 | US20040232008 Anode layer, cathode layer, and intermediate electrolyte layer conductive to protons and impermeable to hydrogen; catalytic metal in or adjacent to the anode layer catalyzes an electrochemical reaction that converts any hydrogen that diffuses through the electrolyte layer to protons and electrons |
| 11/25/2004 | US20040232005 For treating electric circuit boards and other circuit carriers, particularly those that demand very thin base layers; counterelectrodes are each subdivided into at least two electrode segments: a contact-near electrode segment and a contact-remote electrode, each fed by a separate current source |
| 11/25/2004 | US20040231994 Includes an anode, a mask with openings supported between the anode and the wafer surface defining active regions by which a rate of conductive material deposition onto the surface can be varied, a conductive mesh below the upper mask surface, and an electrolyte |
| 11/25/2004 | US20040231992 Membrane electrode assemblies and electropaint systems incorporating same |
| 11/25/2004 | US20040231978 Electrode attachment to anode assembly |
| 11/25/2004 | US20040231977 Organic acids and/or inorganic acids and/or their salts; increased concentration of a halogen dioxide solution by at least 5%; Interfacial Tension Lowering system containing ITF-lowering surfactants, solvents or polymers; electrolytic halogen dioxide generating system |
| 11/25/2004 | DE10307170B4 Gewichtskraftbestimmung in Tauchlackierstraßen Weight determination in force Tauchlackierstraßen |
| 11/24/2004 | CN1550033A Substrate holder and plating apparatus |
| 11/24/2004 | CN1549876A Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion |
| 11/23/2004 | US6821408 Method and apparatus for an anodic treatment |
| 11/18/2004 | WO2004099469A2 High resolution electrolytic lithography, apparatus therefor and resulting products |
| 11/18/2004 | US20040226826 Electrolytic cells; immersion bath; wire mesh screen; variations in pattern density on substrate surface |
| 11/18/2004 | US20040226825 electrodeposition of nickel; controlling thickness, flexibility, hardness; drum with apertures filled with dielectric resin |
| 11/18/2004 | US20040226823 Installation for the cataphoretic dip coating of articles |
| 11/18/2004 | US20040226817 Electrolytic electrode and process of producing the same |