Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
04/2005
04/06/2005CN1603246A Water treatment apparatus that can reduce water treatment time
04/05/2005US6875331 Anode isolation by diffusion differentials
04/05/2005US6875323 Method of chemically decontaminating components of radioactive material handling facility and system for carrying out the same
04/05/2005US6875322 Electrochemical assisted CMP
03/2005
03/31/2005WO2005029540A2 Substrate carrier for electroplating solar cells
03/31/2005WO2005028718A2 Power supply device in a device for electrochemical treatment
03/31/2005WO2005028717A1 Insoluble anode with an auxiliary electrode
03/31/2005US20050067288 Barrier separates inlet/outlet area, as inlet lines terminate closely beneath liquid surface; plating tool/reactor
03/31/2005US20050067275 Water treatment apparatus that can reduce water treatment time
03/31/2005US20050067274 [electroplating apparatus]
03/30/2005CN2688729Y Anode of nickel net electroplatinizing bath
03/24/2005WO2005026403A1 Method for making a metal decorative effect on the surface of an object
03/24/2005WO2002053806A3 Electrochemical coating device and method
03/24/2005WO2002014584A3 Powered lift for electrochemical process chamber
03/24/2005US20050061665 Substrate carrier for electroplating solar cells
03/24/2005US20050061660 System and method for electrolytic plating
03/24/2005US20050061659 Plating apparatus and plating method
03/24/2005US20050061438 Integrated tool with interchangeable wet processing components for processing microfeature workpieces
03/24/2005CA2532451A1 Device and method for electrolytically treating electrically insulated structures
03/23/2005EP1516357A2 Substrate holder and plating apparatus
03/23/2005EP1516076A1 Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
03/23/2005CN1599693A Method and apparatus for transferring sheet-like objects
03/22/2005US6869510 Methods and apparatus for processing the surface of a microelectronic workpiece
03/17/2005US20050056542 Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
03/17/2005US20050056538 Insoluble anode with an auxiliary electrode
03/16/2005CN1593786A Hanger suspended type carrier
03/16/2005CN1193416C Electronic device and method of manufacturing the electronic device
03/16/2005CN1193118C Surface treating apparatus
03/10/2005WO2005021840A1 Device and method for separating metals and/or metal alloys from metallo-organic electrolytes
03/10/2005WO2003056609A3 Apparatus and method for electroplating a wafer surface
03/10/2005US20050051437 Having porous member (plating solution impregnated member), the plating apparatus being capable of handling and easily controlling composition of plating soution; especially for electroless deposition of copper or silver; for filling fine interconnect pattern in semiconductor substrate
03/10/2005US20050051425 Electroplating apparatus with functions of voltage detection and flow rectification
03/10/2005US20050050767 Wet chemical processing chambers for processing microfeature workpieces
03/09/2005CN1590591A Multi-porous Ni foil for cathode of alkaline battery method for mfg. Ni foil and mfg. device thereof
03/03/2005WO2004003258A3 Method for producing galvanically deposited antennae for rfid labels using an adhesive that is selectively applied
03/03/2005US20050045474 Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof
03/03/2005US20050045473 Device for galvanizing member-shaped substrates
03/03/2005US20050045252 Composite alloy having a three-dimensional periodic hierarchical structure and method of producing the same
03/03/2005DE10249194B4 Verfahren und Vorrichtung zur Durchführung einer anodischen Behandlung A method and apparatus for performing an anodic treatment
03/03/2005DE10212436B4 Vorrichtung zur Behandlung von strangförmigem metallischen Gut und ihre Verwendung Apparatus for treating strand-metallic material and their use
03/02/2005EP1510601A1 Apparatus for electroplating wafers
03/02/2005EP1510600A1 Process and apparatus for the deposition of metal and metal alloys from organometallic electrolytes
03/02/2005EP1510111A1 Method and device for treating flat and flexible work pieces
03/02/2005CN1587445A Electroplating machine capable of automatically accessing hanger
03/02/2005CN1191605C Method and apparatus for holding and positioing semiconductor workpieces during electropolishing and/or electroplating of the workpieces
03/01/2005US6860769 Cathode contact pin for an electroplating process
02/2005
02/24/2005WO2005017971A2 Nanomachined and micromachined electrodes for electrochemical devices
02/24/2005WO2004059045A3 Anode used for electroplating
02/24/2005US20050040049 Electrochemical depositing copper on a semiconductor wafer, chemical mechanical polishing of the conductive surface; deliverying solution to anode cavity, applying a potential
02/23/2005EP1419290B1 Segmented counterelectrode for an electrolytic treatment system
02/23/2005EP1412562B1 Device for the electrodeposition of aluminium or aluminium alloys from organometallic electrolytes containing aluminium alkyl
02/23/2005CN1190524C Electrical contacting element and method for objects to be electrolyted
02/17/2005US20050037620 Method for achieving wafer contact for electro-processing
02/17/2005US20050036872 Method and apparatus for transferring sheet-like objects
02/17/2005US20050035046 Wet chemical processing chambers for processing microfeature workpieces
02/17/2005US20050034977 Electrochemical deposition chambers for depositing materials onto microfeature workpieces
02/17/2005US20050034976 Method and apparatus for plating and polishing semiconductor substrate
02/17/2005US20050034849 Method and apparatus for severing organic molecules by ultrasound
02/17/2005DE10029837B4 Verfahren zur Herstellung von einseitig platinierten Platten und Streckmetallgittern aus Refraktärmetallen Process for the preparation of platinum-plated plates on one side and expanded metal grids made from refractory metals
02/16/2005EP1506056A1 Device and method for increasing mass transport at liquid-solid diffusion boundary layer
02/16/2005CN1582346A Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
02/15/2005US6855239 When current flows through an inductive element, an electromagnetic field induces an electromotive force to generate a surface current and when in presence of an electrolyte, the surface of the substrate is plated
02/15/2005US6855235 Anode impedance control through electrolyte flow control
02/15/2005US6855103 Radioactive implantable devices and methods and apparatuses for their production and use
02/15/2005US6855037 Method of sealing wafer backside for full-face electrochemical plating
02/10/2005WO2004101865A3 Device for treating objects, in particular for plating printed circuit boards
02/10/2005WO2004055923A3 Direct organic fuel cell proton exchange membrane and method of manufacturing the same
02/10/2005WO2002084714A3 Method and apparatus for electrochemically depositing a material onto a workpiece surface
02/10/2005US20050031269 Electroforming system and electroforming method
02/10/2005DE10333068A1 Device including sealing rings, a screw cap, an elastic element, a siphon, and O-rings useful for electroplating conductive and metallized nonconductive plates
02/09/2005CN1578853A Method and conveyorized system for electorlytically processing work pieces
02/09/2005CN1578852A Clamping workpiece slings for electroplating apparatus
02/09/2005CN1576400A Electroplating apparatus and method for electronic parts, and the same electronic parts
02/09/2005CN1576399A Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product
02/09/2005CN1188898C Method for producing semiconductor parts and method for producing solar cell
02/09/2005CN1188088C Method for producing prosthetic moulded parts for dental use
02/08/2005US6852207 Using galvanic deposition by pulse-plating, characterized in that gold or a gold alloy is deposited from a gold sulphite bath at a pulse current density of between 0.2 A/dm2 and 50 A/dm2
02/03/2005US20050025654 Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
02/03/2005US20050023149 Uses an insoluble anode and which can perform plating of a substrate stably while preventing oxygen gas, generated due to the use of the insoluble anode, from causing defects in the substrate
02/02/2005CN2675686Y Electroplating roller
02/02/2005CN1572916A Plating barrel, barrel plating apparatus and drain equipment
02/02/2005CN1572915A Cartridge plating device and design method
02/02/2005CN1572914A Liquid tank
02/02/2005CN1572911A Apparatus and method for plating a substrate
02/02/2005CN1572910A Plating machine and process for producing film carrier tapes for mounting electronic parts
02/02/2005CN1187481C Electrolyzing apparatus
02/02/2005CN1187479C Electroplating device and process for electroplating parts using said device and annular adhesive magnet
02/02/2005CN1187247C Web conveying apparatus, and apparatus and method for electroplating using web conveying apparatus
02/02/2005CN1187244C Surface treatment device
01/2005
01/27/2005WO2005008806A2 Photoelectrolysis of water using proton exchange membranes
01/27/2005WO2005007933A1 Electrochemical processing cell
01/27/2005WO2004027898A3 Anode compositions having an elastomeric binder and an adhesion promoter
01/27/2005US20050016681 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
01/26/2005EP1499759A2 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
01/26/2005CN1571865A System and method for electrolytic plating
01/26/2005CN1570218A Method for making titanium cathode roller member
01/25/2005US6846392 Hydrophobic and hydrophilic membranes to vent trapped gases in a plating cell
01/25/2005CA2136703C Apparatus for dissolving zinc by means of acid-containing liquid electrolytes
01/20/2005WO2004099469A3 High resolution electrolytic lithography, apparatus therefor and resulting products
01/20/2005WO2004038071A3 Coatings for the inhibition of undesirable oxidation in an electrochemical cell
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