| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
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| 06/14/2001 | WO2001042533A1 Electroplating apparatus |
| 06/13/2001 | DE10013339C1 Process for regulating the concentration of metal ions in an electrolyte liquid comprises feeding part of the liquid through an auxiliary cell consisting of an insoluble auxiliary anode and an auxiliary cathode |
| 06/07/2001 | DE10011865C1 Apparatus for coating objects, e.g. galvanizing screws, comprises guides to convey objects to be coated through drum so that each object is electrically contacted with section of drum not wetted with electrolytic liquid |
| 06/07/2001 | DE10007799C1 Zur Stromzuführung zu elektrolytisch zu behandelnden Werkstücken oder Gegenelektroden dienender Träger und Verfahren zur elektrolytischen Behandlung von Werkstücken For supplying current to electrolytically treated workpieces or counter electrode serving carrier and method for electrolytic treatment of workpieces |
| 06/05/2001 | US6241868 Providing electrical contact between contact plate and contact pads on underside of substrate, wherein both contact plate and contact pads are isolated from electroplating solution |
| 06/05/2001 | US6241860 Electroplating machine |
| 05/31/2001 | WO2001039250A2 Conductive interconnection |
| 05/30/2001 | EP1103639A2 Plating apparatus and method |
| 05/30/2001 | EP1102875A2 Alkali zinc nickel bath |
| 05/29/2001 | US6238529 Device for electrolytic treatment of printed circuit boards and conductive films |
| 05/25/2001 | WO2001037359A2 High differential pressure electrochemical cell |
| 05/23/2001 | EP1101839A2 Methods and apparatus for forming metal layers on substrates |
| 05/23/2001 | EP1100984A1 Installation and method for multilayered immersion coating |
| 05/23/2001 | EP1100983A1 Reactor vessel having improved cup, anode and conductor assembly |
| 05/23/2001 | CN1296088A Steel wire spring clamp head, wire-guiding frame conveying belt and electroplating system |
| 05/17/2001 | WO2001034881A2 Device for electrolytically treating board-shaped workpieces, especially printed circuits |
| 05/16/2001 | EP1099781A2 Conductive biasing member for metal layering |
| 05/16/2001 | EP1099649A2 Container for corrosive liquids |
| 05/16/2001 | EP1099012A1 Method and apparatus for copper plating using electroless plating and electroplating |
| 05/16/2001 | CN1295528A Device for treating plate-shaped work pieces, especially printed-circuit boards |
| 05/15/2001 | US6231731 Electrolyzing electrode and process for the production thereof |
| 05/15/2001 | US6231729 Apparatus for preparing and replenishing an electrolyte in an electrolyte bath |
| 05/15/2001 | CA2224932C Holding clamp for electroplating articles in a bath |
| 05/10/2001 | US20010000891 Method of plating semiconductor wafer and plated semiconductor wafer |
| 05/10/2001 | DE19951325A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitenden Strukturen auf Oberflächen von elektrisch isolierendem Folienmaterial sowie Anwendungen des Verfahrens Method and apparatus for electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of electrically insulating foil material, as well as applications of the method |
| 05/08/2001 | US6228242 Steels |
| 05/08/2001 | US6228233 Inflatable compliant bladder assembly |
| 05/08/2001 | US6228232 Reactor vessel having improved cup anode and conductor assembly |
| 05/08/2001 | US6228231 Electroplating workpiece fixture having liquid gap spacer |
| 05/08/2001 | US6228230 Electroplating apparatus |
| 05/03/2001 | WO2001031095A1 Process and apparatus for the manufacture of high peel-strength copper foil |
| 05/03/2001 | WO2001031094A1 Masking techniques for metal plating |
| 05/03/2001 | DE19951324A1 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Oberflächen von gegeneinander vereinzelten Platten- und Folienmaterialstücken sowie Anwendung des Verfahrens Method and apparatus for electrolytic treatment of electrically conductive surfaces of mutually isolated sheet and film material properties as well as application of the method |
| 05/01/2001 | US6224736 Apparatus and method for forming thin film of zinc oxide |
| 05/01/2001 | US6224721 Electroplating apparatus |
| 05/01/2001 | US6224670 Cup-type plating method and cleaning apparatus used therefor |
| 04/26/2001 | WO2001029290A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 04/26/2001 | WO2001029289A1 Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method |
| 04/26/2001 | WO2001029288A2 Conveyorized electroplating device |
| 04/26/2001 | US20010000396 Apparatus for depositing a metal film, comprising a holder that positions the substrate so seed layer contacts an electrolyte solution, and electric contact which contacts second side or edge of substrate; uniform current density |
| 04/26/2001 | CA2384249A1 Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method |
| 04/26/2001 | CA2384244A1 Method and device for the electrolytic treatment of electrolytically conducting structures which are insulated from each other |
| 04/19/2001 | WO2001027358A1 Carrier serving for supplying current to workpieces or counter-electrodes that are to be treated electrolytically and a method for electrolytically treating workpieces |
| 04/19/2001 | DE19930306A1 Apparatus for the galvanic deposition and removal of metals comprises a conveying device which has a transporting belt with cover bars by which the galvanized material is fixed to the belt |
| 04/17/2001 | US6217736 Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment |
| 04/17/2001 | US6217729 Anode formulation and methods of manufacture |
| 04/11/2001 | EP1089843A2 Coated metal powder and method for producing the same |
| 04/11/2001 | CN1291243A Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| 04/11/2001 | CN1290771A Electroplating device and process for electroplating parts using said device |
| 04/11/2001 | CN1064279C Method for making large seamless Ti tube and seamless Ti tube composite cathode roller from said material |
| 04/10/2001 | US6214193 Semiconductor wafers |
| 04/05/2001 | WO2001024257A1 Methods and apparatus for treating seed layer in copper interconnctions |
| 04/03/2001 | US6210554 Supplying plating solution onto plating surface of wafer so solution flows from center of plating surface of wafer toward periphery; generating electric field between wafer and annular anode to obtain non-uniformly distributed coating that |
| 04/03/2001 | US6210550 Anode with improved coating for oxygen evolution in electrolytes containing manganese |
| 03/29/2001 | DE19932524C1 Verfahren und Vorrichtung zur elektrochemischen Behandlung Method and apparatus for electrochemical treatment |
| 03/28/2001 | EP1087039A1 Plating jig of wafer |
| 03/28/2001 | CN2425092Y Elastic conducting device |
| 03/28/2001 | CN1288980A Vibrating surface treating equipment |
| 03/28/2001 | CN1288979A Technology process and equiment for depositing permalloy film electrically |
| 03/21/2001 | EP1085110A1 Conveyor system for components during the course of processes and hook-like profile, load suspension arrangement, lift hook and identification hook for such a conveyor |
| 03/20/2001 | US6202655 Anodizing apparatus and apparatus and method associated with the same |
| 03/20/2001 | CA2317353A1 Transport system for components during process sequences as well as hook profile, load-receiving device, hoist hook and identification hook for such a transport system |
| 03/15/2001 | WO2001018282A2 Method and arrangement for chemically treating the surfaces of bulk material |
| 03/15/2001 | DE19943732A1 Verfahren zur Anordnung zur chemischen Oberflächenbehandlung von Schüttgut Proceedings for an order for the chemical surface treatment of bulk |
| 03/14/2001 | EP1083245A2 Fluid delivery systems for electronic device manufacture |
| 03/07/2001 | EP1081253A2 Double pressure vessel chemical dispenser unit |
| 03/07/2001 | CN2422293Y Connector between electrode and power line for electroplating |
| 03/06/2001 | US6197175 Electrical contacting system for an electrophoretic dip painting plant for motor vehicle bodies |
| 03/06/2001 | US6197171 Pin contact mechanism for plating pin grid arrays |
| 02/27/2001 | US6194086 Nickel and cobalt superalloy substrate; low pressure plasma spraying of abrasives |
| 02/27/2001 | US6193863 Product conveyance mechanism for electroplating apparatus |
| 02/27/2001 | US6193862 Edge protector strips for electrolytic-cell electrodes |
| 02/27/2001 | US6193860 Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents |
| 02/27/2001 | US6193858 Spouted bed apparatus for contacting objects with a fluid |
| 02/22/2001 | WO2001013416A1 Method and apparatus for depositing and controlling the texture of a thin film |
| 02/20/2001 | US6190530 Tank filled with electroplating solution |
| 02/15/2001 | DE19935245A1 Insulated cathode cable has an intermediate piece connected to the end region of the conductor and the contact bulb |
| 02/13/2001 | USRE37050 Clamp for use with electroplating apparatus and method of using the same |
| 02/13/2001 | US6187152 Multiple station processing chamber and method for depositing and/or removing material on a substrate |
| 02/13/2001 | US6186316 Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems |
| 02/07/2001 | CN2418136Y Composite conductive roller for electroplating tin |
| 02/06/2001 | US6184613 Electrode assembly, cathode device and plating apparatus including a gap configured to eliminate a concentration of a line of electrical force at a boundary between a cathode and plate forming surface of an object |
| 02/06/2001 | US6183874 Aluminum silicon carbide composite alloys |
| 02/06/2001 | US6183610 Apparatus for composite plating the inner surface of a cylindrical body |
| 02/06/2001 | US6183607 Anode structure for manufacture of metallic foil |
| 02/01/2001 | DE19934604A1 Vorrichtung zur Halterung von Werkstücken A device for holding workpieces |
| 01/31/2001 | EP1071836A2 Anodising jig |
| 01/31/2001 | CN2417182Y Electroplating equipment |
| 01/31/2001 | CN1281908A Collecting roller and its manufacturing method |
| 01/30/2001 | US6181057 Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member |
| 01/27/2001 | CA2278862A1 A system for galvanic treatment or finishing of pieces, and corresponding method |
| 01/25/2001 | WO2000061498A3 System for electrochemically processing a workpiece |
| 01/24/2001 | EP1070772A2 Electroplating device, and process for electroplating work using the device |
| 01/24/2001 | EP1070549A2 Apparatus for holding a workpiece |
| 01/23/2001 | US6176995 Improving the transfer of materials at the surface of the material for treatment consists in generating a large flow of electrolyte at the treatment point by means of rotating electrodes which move synchronously |
| 01/23/2001 | US6176992 Method and apparatus for electro-chemical mechanical deposition |
| 01/23/2001 | US6176985 Laminated electroplating rack and connection system for optimized plating |
| 01/18/2001 | WO2001004387A1 Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
| 01/17/2001 | CN1280383A Method for producing semiconductor unit, method for producing solar cell and anodizing process equipment |
| 01/16/2001 | US6174425 Electroplating process makes electrical current density across a semiconductor device substrate surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. |