Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
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05/30/2002 | US20020063062 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer |
05/29/2002 | EP0950130A4 Apparatus and method for electroforming |
05/29/2002 | CN1351531A Method and apparatus for plating and polishing a semiconductor substrate |
05/28/2002 | US6395163 Process for the electrolytic processing especially of flat items and arrangement for implementing the process |
05/21/2002 | US6391180 Surface treatment by immersion in vessels, displacement, conveying |
05/21/2002 | US6391179 Plating and antideposit agents |
05/21/2002 | US6391168 Plating apparatus utilizing an auxiliary electrode |
05/16/2002 | WO2002038834A1 Porous nickel foil for alkaline battery cathode, production method therefor and production device therefor |
05/16/2002 | US20020056636 Interpenetrating network free radical block polymer having hydrophobic and hydrophilic regions; improved thermal and mechanical stability; fuel cells |
05/16/2002 | DE10043816C1 Device for electrochemically metallizing, etching, oxidizing and reducing material in electrolytic apparatus comprises rigid base body, electrical contacts arranged on base body, contact isolator, counter electrode and electrical connection |
05/15/2002 | EP1205411A1 Modular device for surface treatement of individual articles |
05/15/2002 | CN2491461Y Conductive roller polishing appts. |
05/14/2002 | US6388273 Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same |
05/14/2002 | US6387227 Metal plate electrolyzation apparatus and electrode for electrolyzing metal plate |
05/09/2002 | US20020053516 Anode, a shaping plate, a liquid electrolyte, and electrical contact members |
05/09/2002 | US20020053510 Methods and apparatus for processing the surface of a microelectronic workpiece |
05/09/2002 | US20020053509 Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
05/08/2002 | CN1348512A Apparatus and method for strip solder plating |
05/07/2002 | US6383352 Spiral anode for metal plating baths |
05/02/2002 | US20020050458 Production of gas separators for use in fuel cells and equipment used therefor |
05/02/2002 | EP1007766B1 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated |
04/30/2002 | US6379511 Paddle design for plating bath |
04/25/2002 | WO2002033152A1 A reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly |
04/25/2002 | US20020046951 Electrode with an electrode chamber for receiving electrolyte and an article forming the second electrode disposed inwardly and spaced from the first electrode for electrolyte passage between |
04/25/2002 | DE10051830A1 Container used for a galvanic liquid which releases corrosive vapors comprises a separator on the container edge with suction openings, and a filling body chamber with filling bodies arranged above the openings in the separator |
04/24/2002 | CN1346510A Mehtod and apparatus for holding and positioing semiconductor workpieces during electropolishing and/or electroplating of the workpieces |
04/23/2002 | US6375823 Plating method and plating apparatus |
04/18/2002 | WO2002031231A1 Semiconductor production device and production method for semiconductor device |
04/18/2002 | WO2001046996A3 Substrate holder |
04/17/2002 | CN2486563Y Electroplating rack |
04/17/2002 | CN2486562Y Conductor for cathode conductive wheel |
04/16/2002 | US6372101 Apparatus for preventing drag-out |
04/11/2002 | WO2001091163A3 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
04/11/2002 | US20020040853 Method of manufacturing a semiconductor component and plating tool therefor |
04/11/2002 | US20020040849 Cathode cartridge and anode cartridge of testing device for electroplating |
04/11/2002 | DE10043814C1 Continuous electrochemical treatment of circuit boards or other goods, comprises placing electrically-insulating, ion-permeable material between electrodes and objects |
04/10/2002 | EP1195454A2 Cathode cartridge and anode cartridge of testing device for electroplating |
04/10/2002 | EP1195453A2 Bath device for engraver cylinder |
04/10/2002 | EP1194613A1 Workpiece processor having processing chamber with improved processing fluid flow |
04/10/2002 | CN2485316Y Embedded electroplating bath replacing device |
04/04/2002 | WO2001077416A3 Thin copper foil, and process and apparatus for the manufacture thereof |
04/04/2002 | DE10043817A1 Continuous electrochemical plant metallizing, etching, oxidizing and reducing e.g. PCBs, wafers and hybrids, controls electrode approach during conveying |
04/04/2002 | DE10043815A1 Contacting planar goods, e.g. PCBs and printed circuit films for diverse electrolytic treatments, connects goods without relative motion for duration of treatment |
04/03/2002 | EP1193330A2 Plating apparatus and plating method for substrate |
04/03/2002 | EP1192298A2 System for electrochemically processing a workpiece |
04/02/2002 | US6365025 Multilstage, multizonal |
04/02/2002 | US6365020 Wafer plating jig |
04/02/2002 | US6365017 Substrate plating device |
03/27/2002 | CN1341516A Equipment and method for manufacturing lithographic printing plate |
03/26/2002 | US6362100 Methods and apparatus for forming a copper interconnect |
03/26/2002 | US6361676 Technique for manufacturing electronic parts |
03/26/2002 | US6361675 Method of manufacturing a semiconductor component and plating tool therefor |
03/26/2002 | US6361674 Powered lift for ECP chamber |
03/21/2002 | US20020034651 A substrate made of an aluminum/silicon carbide composite alloy comprises aluminum-silicon carbide alloy parts and non alloy silicon carbide parat dispersed therin; oxygen freesintering aluminum and silcon carbide powder compact |
03/21/2002 | US20020033339 Uniform thickness |
03/20/2002 | EP1115912B1 Device for partial electrochemical treatment of bar-shaped objects |
03/20/2002 | CN1341277A Apparatus for plating semiconductor substrate, method for plating semiconductor substrate |
03/20/2002 | CN1341167A Component support |
03/20/2002 | CN1341166A Semiconductor wafer electroplating and electrolyzing apparatus and method |
03/14/2002 | US20020032499 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
03/14/2002 | US20020029973 Coated anode apparatus and associated method |
03/14/2002 | US20020029962 Conductive biasing member for metal layering |
03/14/2002 | DE10042002A1 Device for galvanically depositing magnetic metallic alloys comprises a process cell containing a cathode, anode and electrolyte, a spectral photometer |
03/13/2002 | CN1339621A Holding device |
03/07/2002 | WO2001094656A3 Plating apparatus with individually controllable anode segments and associated method |
03/07/2002 | WO2001029288B1 Conveyorized electroplating device |
03/07/2002 | US20020027080 Plating apparatus and method |
03/07/2002 | US20020027071 Inflatable compliant bladder assembly |
03/07/2002 | US20020026898 Equipment for treatment of workpieces |
03/07/2002 | DE10041839A1 Process for coating steel pipelines comprises electrolytically applying anode spheres made of a material having a high specific electrical resistance to a flexible wire used as the anode |
03/07/2002 | DE10030339C1 Befestigungsvorrichtung Fastening device |
02/28/2002 | WO2002016673A1 Electrochemical treating method such as electroplating and electrochemical reaction device therefor |
02/28/2002 | US20020023844 A one-step, process for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, employs two super anodes on a rotating drum cathode to deposit treatment |
02/27/2002 | EP1182279A1 A holding device |
02/27/2002 | CN2479031Y Electrolytic coating barrel with quick-dismounting conductive assembly |
02/27/2002 | CN2479030Y Electrolytic coating barrel with integral formed conductive copperplate |
02/21/2002 | WO2002014585A1 Cathode electrode material and rotating cathode drum for producing electrolytic copper foil using the cathode electrode material |
02/21/2002 | WO2002014584A2 Powered lift for electrochemical process chamber |
02/21/2002 | US20020020630 Electrochemical machining method and apparatus |
02/21/2002 | US20020020627 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor |
02/21/2002 | US20020020621 Semiconductor workpiece proximity plating apparatus |
02/21/2002 | US20020020620 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with |
02/20/2002 | EP1180769A2 Information recording apparatus, information recording method and information recording medium |
02/19/2002 | US6348138 Electroplating device for electroplating a work by rotation |
02/14/2002 | US20020017465 Filling copper into recesses for interconnects formed on a semiconductor and removing a plating liquid remaining on the substrate-contacting portion with suction |
02/14/2002 | US20020017456 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
02/13/2002 | EP1179618A2 Plating apparatus and plating liquid removing method |
02/13/2002 | EP1179617A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
02/13/2002 | EP1179616A2 Method and apparatuses for electrochemically treating an article |
02/13/2002 | EP1179615A2 Method for electrochemically treating articles and apparatus and method for cleaning articles |
02/13/2002 | CN1335419A Electroplating method using with combination of electroplating liquid vibrating flow and pulse type electroplating current |
02/07/2002 | WO2001029288A3 Conveyorized electroplating device |
02/07/2002 | US20020014289 Physical vapor deposition targets |
02/07/2002 | US20020014255 Disposing an array of dedicated cells which includes an array of electrochemical processing cells; moving tubings relative to the array of dedicated cells, disposing electrolytic fluid in electrode chamber, performing electrolysis |
02/07/2002 | DE10017120C1 Surface exposure device for supporting annular object in material or energy particle stream uses fixing hoop for suspension of object attached to rotatable bolt |
02/06/2002 | EP1177325A2 Component support |
02/06/2002 | CN2475742Y Continuously filled consumable anode |
01/31/2002 | WO2002008499A1 A jig and a method and apparatus of applying a surface treatment to a member on the jig |
01/31/2002 | WO2001050505A3 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
01/31/2002 | US20020011417 Method and apparatus for plating and polishing a semiconductor substrate |