Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
05/2002
05/30/2002US20020063062 Depositing a copper seed layer over dielectric layer and into etched features of dielectric layer having a barrier layer; treating copper seed layer to remove oxidized layer from over copper seed layer; electroplating copper fill layer
05/29/2002EP0950130A4 Apparatus and method for electroforming
05/29/2002CN1351531A Method and apparatus for plating and polishing a semiconductor substrate
05/28/2002US6395163 Process for the electrolytic processing especially of flat items and arrangement for implementing the process
05/21/2002US6391180 Surface treatment by immersion in vessels, displacement, conveying
05/21/2002US6391179 Plating and antideposit agents
05/21/2002US6391168 Plating apparatus utilizing an auxiliary electrode
05/16/2002WO2002038834A1 Porous nickel foil for alkaline battery cathode, production method therefor and production device therefor
05/16/2002US20020056636 Interpenetrating network free radical block polymer having hydrophobic and hydrophilic regions; improved thermal and mechanical stability; fuel cells
05/16/2002DE10043816C1 Device for electrochemically metallizing, etching, oxidizing and reducing material in electrolytic apparatus comprises rigid base body, electrical contacts arranged on base body, contact isolator, counter electrode and electrical connection
05/15/2002EP1205411A1 Modular device for surface treatement of individual articles
05/15/2002CN2491461Y Conductive roller polishing appts.
05/14/2002US6388273 Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same
05/14/2002US6387227 Metal plate electrolyzation apparatus and electrode for electrolyzing metal plate
05/09/2002US20020053516 Anode, a shaping plate, a liquid electrolyte, and electrical contact members
05/09/2002US20020053510 Methods and apparatus for processing the surface of a microelectronic workpiece
05/09/2002US20020053509 Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
05/08/2002CN1348512A Apparatus and method for strip solder plating
05/07/2002US6383352 Spiral anode for metal plating baths
05/02/2002US20020050458 Production of gas separators for use in fuel cells and equipment used therefor
05/02/2002EP1007766B1 Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated
04/2002
04/30/2002US6379511 Paddle design for plating bath
04/25/2002WO2002033152A1 A reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
04/25/2002US20020046951 Electrode with an electrode chamber for receiving electrolyte and an article forming the second electrode disposed inwardly and spaced from the first electrode for electrolyte passage between
04/25/2002DE10051830A1 Container used for a galvanic liquid which releases corrosive vapors comprises a separator on the container edge with suction openings, and a filling body chamber with filling bodies arranged above the openings in the separator
04/24/2002CN1346510A Mehtod and apparatus for holding and positioing semiconductor workpieces during electropolishing and/or electroplating of the workpieces
04/23/2002US6375823 Plating method and plating apparatus
04/18/2002WO2002031231A1 Semiconductor production device and production method for semiconductor device
04/18/2002WO2001046996A3 Substrate holder
04/17/2002CN2486563Y Electroplating rack
04/17/2002CN2486562Y Conductor for cathode conductive wheel
04/16/2002US6372101 Apparatus for preventing drag-out
04/11/2002WO2001091163A3 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
04/11/2002US20020040853 Method of manufacturing a semiconductor component and plating tool therefor
04/11/2002US20020040849 Cathode cartridge and anode cartridge of testing device for electroplating
04/11/2002DE10043814C1 Continuous electrochemical treatment of circuit boards or other goods, comprises placing electrically-insulating, ion-permeable material between electrodes and objects
04/10/2002EP1195454A2 Cathode cartridge and anode cartridge of testing device for electroplating
04/10/2002EP1195453A2 Bath device for engraver cylinder
04/10/2002EP1194613A1 Workpiece processor having processing chamber with improved processing fluid flow
04/10/2002CN2485316Y Embedded electroplating bath replacing device
04/04/2002WO2001077416A3 Thin copper foil, and process and apparatus for the manufacture thereof
04/04/2002DE10043817A1 Continuous electrochemical plant metallizing, etching, oxidizing and reducing e.g. PCBs, wafers and hybrids, controls electrode approach during conveying
04/04/2002DE10043815A1 Contacting planar goods, e.g. PCBs and printed circuit films for diverse electrolytic treatments, connects goods without relative motion for duration of treatment
04/03/2002EP1193330A2 Plating apparatus and plating method for substrate
04/03/2002EP1192298A2 System for electrochemically processing a workpiece
04/02/2002US6365025 Multilstage, multizonal
04/02/2002US6365020 Wafer plating jig
04/02/2002US6365017 Substrate plating device
03/2002
03/27/2002CN1341516A Equipment and method for manufacturing lithographic printing plate
03/26/2002US6362100 Methods and apparatus for forming a copper interconnect
03/26/2002US6361676 Technique for manufacturing electronic parts
03/26/2002US6361675 Method of manufacturing a semiconductor component and plating tool therefor
03/26/2002US6361674 Powered lift for ECP chamber
03/21/2002US20020034651 A substrate made of an aluminum/silicon carbide composite alloy comprises aluminum-silicon carbide alloy parts and non alloy silicon carbide parat dispersed therin; oxygen freesintering aluminum and silcon carbide powder compact
03/21/2002US20020033339 Uniform thickness
03/20/2002EP1115912B1 Device for partial electrochemical treatment of bar-shaped objects
03/20/2002CN1341277A Apparatus for plating semiconductor substrate, method for plating semiconductor substrate
03/20/2002CN1341167A Component support
03/20/2002CN1341166A Semiconductor wafer electroplating and electrolyzing apparatus and method
03/14/2002US20020032499 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
03/14/2002US20020029973 Coated anode apparatus and associated method
03/14/2002US20020029962 Conductive biasing member for metal layering
03/14/2002DE10042002A1 Device for galvanically depositing magnetic metallic alloys comprises a process cell containing a cathode, anode and electrolyte, a spectral photometer
03/13/2002CN1339621A Holding device
03/07/2002WO2001094656A3 Plating apparatus with individually controllable anode segments and associated method
03/07/2002WO2001029288B1 Conveyorized electroplating device
03/07/2002US20020027080 Plating apparatus and method
03/07/2002US20020027071 Inflatable compliant bladder assembly
03/07/2002US20020026898 Equipment for treatment of workpieces
03/07/2002DE10041839A1 Process for coating steel pipelines comprises electrolytically applying anode spheres made of a material having a high specific electrical resistance to a flexible wire used as the anode
03/07/2002DE10030339C1 Befestigungsvorrichtung Fastening device
02/2002
02/28/2002WO2002016673A1 Electrochemical treating method such as electroplating and electrochemical reaction device therefor
02/28/2002US20020023844 A one-step, process for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, employs two super anodes on a rotating drum cathode to deposit treatment
02/27/2002EP1182279A1 A holding device
02/27/2002CN2479031Y Electrolytic coating barrel with quick-dismounting conductive assembly
02/27/2002CN2479030Y Electrolytic coating barrel with integral formed conductive copperplate
02/21/2002WO2002014585A1 Cathode electrode material and rotating cathode drum for producing electrolytic copper foil using the cathode electrode material
02/21/2002WO2002014584A2 Powered lift for electrochemical process chamber
02/21/2002US20020020630 Electrochemical machining method and apparatus
02/21/2002US20020020627 Filling a metal such as copper in fine interconnection pattern recesses on a semiconductor
02/21/2002US20020020621 Semiconductor workpiece proximity plating apparatus
02/21/2002US20020020620 Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with
02/20/2002EP1180769A2 Information recording apparatus, information recording method and information recording medium
02/19/2002US6348138 Electroplating device for electroplating a work by rotation
02/14/2002US20020017465 Filling copper into recesses for interconnects formed on a semiconductor and removing a plating liquid remaining on the substrate-contacting portion with suction
02/14/2002US20020017456 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
02/13/2002EP1179618A2 Plating apparatus and plating liquid removing method
02/13/2002EP1179617A1 Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof
02/13/2002EP1179616A2 Method and apparatuses for electrochemically treating an article
02/13/2002EP1179615A2 Method for electrochemically treating articles and apparatus and method for cleaning articles
02/13/2002CN1335419A Electroplating method using with combination of electroplating liquid vibrating flow and pulse type electroplating current
02/07/2002WO2001029288A3 Conveyorized electroplating device
02/07/2002US20020014289 Physical vapor deposition targets
02/07/2002US20020014255 Disposing an array of dedicated cells which includes an array of electrochemical processing cells; moving tubings relative to the array of dedicated cells, disposing electrolytic fluid in electrode chamber, performing electrolysis
02/07/2002DE10017120C1 Surface exposure device for supporting annular object in material or energy particle stream uses fixing hoop for suspension of object attached to rotatable bolt
02/06/2002EP1177325A2 Component support
02/06/2002CN2475742Y Continuously filled consumable anode
01/2002
01/31/2002WO2002008499A1 A jig and a method and apparatus of applying a surface treatment to a member on the jig
01/31/2002WO2001050505A3 A microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
01/31/2002US20020011417 Method and apparatus for plating and polishing a semiconductor substrate
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