Patents
Sitemap › C25 - Electrolytic or electrophoretic processes; Apparatus therefor › C25D - Processes for the electrolytic or electrophoretic production of coatings; Electroforming; Joining workpieces by electrolysis; Apparatus therefor › C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
09/2003
09/25/2003WO2003078686A1 Non-cyanide copper plating process for zinc and zinc alloys
09/25/2003US20030178313 Permits placed layer of uniform thickness to be formed over particles without aggregating in plating solution; semiconductors
09/25/2003US20030178297 Reactor for electrochemically processing a microelectronic workpiece including improved electrode assembly
09/24/2003EP1347081A1 A plating method and apparatus with fixed immersed plating tool
09/24/2003CN2575121Y Shuttle and track loop structure for circular loom
09/24/2003CN1122123C Vibrating surface treating equipment
09/24/2003CN1122120C Processing method and device for drum electroplating
09/18/2003WO2003076688A2 Method and apparatus for electrolyzing water
09/18/2003WO2003076134A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
09/18/2003WO2003033770A3 System and method for electrolytic plating
09/18/2003US20030173209 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
09/17/2003EP1345263A1 Electronic device and method of manufacturing the electronic device
09/17/2003EP1344850A1 Alkaline zinc-nickel bath
09/17/2003EP1344849A1 ELECTROLYTIC COPPER PLATING METHOD, ELECTROLYTIC COPPER PLATING−USE PHOSPHORUS−CONTAINING COPPER ANODE AND SEMICONDUCTOR WAFER WITH LITTLE PARTICLES DEPOSITION PLATED BY USING THEM
09/17/2003CN1442516A Rolling hanging type electroplating method and its rotating electroplating hanging device
09/12/2003WO2003074768A1 Conveyorized horizontal processing line and method of wet-processing a workpiece
09/12/2003WO2003006718B1 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
09/11/2003US20030168344 Uniform metal deposition across the substrate
09/11/2003DE20309124U1 Rotatable perforated basket, for handling loose items within a bath e.g. for electrolytic or chemical treatment, has internal component, with hollow profile section, for holding ancillary equipment
09/10/2003CN1441088A Electrochemical catalyst electrode resulting in high endurance of the combination between coating and metal base
09/04/2003WO2003072855A1 Methods and devices for the electrolytic metallisation of perforated walls and structures
09/04/2003WO2003072853A2 Apparatus with processing stations for manually and automatically processing microelectronic workpieces
09/04/2003US20030164311 Multilayer electrochemical cell technology using sol-gel processing applied to ceramic oxygen generator
09/04/2003US20030164301 Uniform deposition thickness
09/03/2003CN1439745A One sided platinizing refractory metal plate and preparation for extended metal grid
09/02/2003US6613214 Apparatus for depositing a metal film, comprising a holder that positions the substrate so seed layer contacts an electrolyte solution, and electric contact which contacts second side or edge of substrate; uniform current density
08/2003
08/28/2003WO2003071009A1 Method and device for electrically contacting a flat product in electrolytic installations
08/28/2003WO2002062940A3 Improved electrophoretic deposition
08/28/2003US20030159921 Apparatus with processing stations for manually and automatically processing microelectronic workpieces
08/28/2003US20030159277 Method and apparatus for manually and automatically processing microelectronic workpieces
08/27/2003CN2568675Y Non-stage speed controller
08/27/2003CN1119436C Method and device for surface treatment of parts
08/27/2003CN1119434C Conducting roller and its manufacturing method
08/26/2003US6610190 Anode, a shaping plate, a liquid electrolyte, and electrical contact members
08/21/2003US20030155231 Field adjusting apparatus for an electroplating bath
08/19/2003US6607652 Electroplating method
08/14/2003US20030150738 High efficiency plating apparatus and method
08/14/2003US20030150715 Anode assembly and method of reducing sludge formation during electroplating
08/12/2003US6605205 For electrodeposition, etching, or polishing uniformily; retaining semiconductor substrates on moving cathode immersed in reaction solution wherein a wire mesh anodes rotates about the moving cathode during electrochemical reaction
08/07/2003WO2003064733A1 Method and device for electrically contacting a product to be treated in electrolytic systems
08/07/2003US20030146089 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
08/06/2003EP1332243A2 Method and apparatus for electrodeposition or etching of uniform films with minimal edge exclusion on substrate
08/06/2003CN2564589Y Electroplating pot for internal saw blade
08/06/2003CN1434882A Pad designs and structures for universal material working equipment
08/06/2003CN1117181C Method and installation forelectrolytic coating with metal layer of surface of cylinder for continuous casting of thin metal strips
08/06/2003CN1117178C Technology process and equipment for depositing permalloy film electrically
08/05/2003US6602394 Alkali zinc nickel bath
07/2003
07/31/2003WO2003062505A1 Anodization device and anodization method
07/31/2003WO2003062504A1 Liquid treating device, and liquid treating method
07/31/2003US20030141267 Jig and a method and apparatus of applying a surface treatment to a member on the jig
07/31/2003US20030141185 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
07/30/2003EP1287185A4 Anode assembly for plating and planarizing a conductive layer
07/30/2003CN2563165Y Down flow type electroplating bath
07/30/2003CN1433487A Method and apparatus for electrodeposition or etching of uniform film with miniml edge exclusion on substrate
07/30/2003CN1116449C Device for processing printed circuit boards
07/30/2003CN1116213C Device for surface treatment by immersion
07/30/2003CN1116122C Powder coating apparatus
07/29/2003US6599404 Flake-resistant multilayer thin-film electrodes and electrolytic cells incorporating same
07/29/2003US6599402 Electro-chemical deposition cell for face-up processing of single semiconductor substrates
07/29/2003CA2287536C Anode structure for manufacture of metallic foil
07/24/2003WO2003060201A1 System and method for items to be electrochemically treated
07/24/2003WO2003060200A1 Electrode for metal plating and plating device
07/24/2003US20030136682 Electrodepositing a metal layer, adjusting the current density, eliminating defects and a uniform thickness
07/24/2003US20030136668 Electrolytic processing device and substrate processing apparatus
07/24/2003DE10215463C1 Continuous plant for electrolytic metallization of printed circuit boards, includes precautions reducing electrical potential between adjacent workpieces
07/17/2003US20030134509 Manufacturing method of semiconductor device
07/17/2003US20030132120 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
07/17/2003US20030132103 Electrolytic processing device and substrate processing apparatus
07/17/2003US20030132102 Cathode contact pin for an electroplating process
07/16/2003EP1230442B1 Device for electrolytically treating board-shaped workpieces, especially printed circuits
07/16/2003CN1429934A Forming method of anode oxidation film on chain tooth row and its forming equipment
07/15/2003US6592743 Integrated with gas flow channel of fuel cells efficiently at low costs without deteriorating processing accuracy
07/10/2003WO2003056609A2 Apparatus and method for electroplating a wafer surface
07/10/2003WO2002097170A3 Mobile zinc cathode stripping system
07/10/2003US20030127337 Apparatus and methods for electrochemical processing of microelectronic workpieces
07/10/2003US20030127320 Apparatus for electrochemically depositing a material onto a workpiece surface
07/09/2003CN1429284A Elastic contact element
07/09/2003CN1428462A Product guide mechanism for electroplanting processing device
07/09/2003CN1113983C Method and device for electrochemical treatment of items with processing fluid
07/08/2003US6589406 Electrode characterized by highly adhering superficial catalytic layer and method for its production
07/08/2003US6589400 Apparatus for metal coating of bands by electroplating
07/03/2003WO2003053839A1 Method and apparatus for transferring sheet-like objects
07/03/2003US20030124404 Device for supplying at least two liquid media to consumers of a fuel cell system
07/03/2003US20030121790 Contact composite of metal and plastic; press fitting
07/03/2003US20030121774 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
07/02/2003EP1015669A4 Article, method, and apparatus for electrochemical fabrication
07/02/2003CN1427902A Electrical contacting element made of elastic material
07/01/2003US6585876 Electrolyte cell configured to receive a substrate to have a metal film deposited thereon; a porous, rigid diffuser positioned between where the substrate is to be and the anode; uniform coating; pressure removes bubbles
06/2003
06/26/2003US20030116429 Apparatus for continuous processing of semiconductor wafers
06/25/2003CN1426495A Electro-plating apparatus and method
06/24/2003US6582570 Electroplating apparatus for wheel disk
06/19/2003WO2003050328A1 Plating apparatus, plating method, and method for manufacturing semiconductor device
06/19/2003US20030113996 Semiconductor production device and production method for semiconductor device
06/19/2003US20030111346 Micro structured electrode and method for monitoring wafer electroplating baths
06/19/2003US20030111339 Plating system
06/19/2003CA2467037A1 Manufacturing method for semiconductor device
06/18/2003CN1425196A Conductive interconnections
06/17/2003US6579430 Semiconductor wafer plating cathode assembly
06/12/2003WO2003048429A1 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
06/12/2003WO2003048423A1 Contact assemblies for electrochemical processing of microelectronic workpieces and method of making thereof
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