Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
12/2005
12/29/2005US20050284751 Electrochemical plating cell with a counter electrode in an isolated anolyte compartment
12/29/2005US20050284749 Membrane electrode system for electro coating
12/29/2005US20050284748 Electroplating head and method for operating the same
12/29/2005CA2568579A1 Plating apparatus
12/28/2005CN1714177A Plating uniformity control by contact ring shaping
12/28/2005CN1233880C Cathode chuck of electroplating tester
12/27/2005US6979391 continuous reel-to-reel electrolysis and electrolytic cell; insulating wall between electrodes; one- or two-sided metallization; conductive foils for printed circuits
12/22/2005US20050281947 Substrate processing unit and substrate processing apparatus
12/22/2005US20050279642 Common rack for electroplating and PVD coating operations
12/22/2005US20050279641 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
12/22/2005US20050279638 producing electrodes having generally regularly oriented and shaped pores with a diameter of less than one micron; are highly electrically and thermally conductive, allow unimpeded transport of gases or liquids through the electrode
12/22/2005US20050279626 Wastewater treatment equipment
12/22/2005US20050279625 Multifunctional oxygenated water machine
12/21/2005EP1606436A1 Device and the parts thereof for producing electrodeposited dental shaped pieces
12/21/2005CN2747232Y Terminal holder
12/15/2005WO2005118915A2 Microfluid device and synthetic methods
12/15/2005WO2005042809A3 Support for workpiece to be electrolytically coated
12/15/2005US20050276928 Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method
12/15/2005US20050274620 Copper replenishment system for interconnect applications
12/15/2005US20050274605 Method and apparatus for applying a voltage to a substrate during plating
12/15/2005US20050274604 Plating apparatus
12/15/2005US20050274603 Plating process enhanced by squeegee roller apparatus
12/14/2005CN1707759A Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
12/14/2005CN1231290C Vibration stirring device, and device and method for processing using stirring device
12/13/2005US6974558 A substrate made of an aluminum/silicon carbide composite alloy comprises aluminum-silicon carbide alloy parts and non alloy silicon carbide parat dispersed therin; oxygen freesintering aluminum and silcon carbide powder compact
12/13/2005US6974530 Method and system for controlling ion distribution during plating of a metal on a workpiece surface
12/08/2005WO2005116302A2 Electrolyte cleaning method using bipolar plastic-diamond electrodes
12/08/2005WO2005116300A1 External palladium plating structure of semiconductor component and semiconductor device manufacturing method
12/08/2005US20050269212 Method of making rolling electrical contact to wafer front surface
12/07/2005EP1602127A2 Plating apparatus
12/01/2005US20050263405 Fluorine separation and generation device
12/01/2005US20050263401 Method and apparatus for plating substrates
12/01/2005US20050263392 Cathode guidance and perimeter deposition control assembly in electro-metallurgy cathodes
12/01/2005DE102004021926A1 Verfahren zur Herstellung einer Beschichtung sowie Anode zur Verwendung in einem solchen Verfahren A process for preparing a coating and anode for use in such a method
12/01/2005DE102004021214A1 Producing and maintaining a prescribed gas composition in the environment of a band material after immersion treatment comprises moving the band material in a sealed housing from an immersion bath
11/2005
11/30/2005EP1601006A2 An apparatus and a method for processing a fluid meniscus
11/30/2005EP1600529A2 Method and apparatus for applying a voltage to one or more substrates during plating
11/30/2005EP1488025B1 Conveyorized plating line and method for electrolytically metal plating a workpiece
11/24/2005US20050258046 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
11/24/2005US20050258032 Holder for an electrochemical process substrate
11/24/2005US20050258031 Multilayer electrochemical cell technology using sol-gel processing applied to ceramic oxygen generator
11/24/2005DE102004021260A1 System und Verfahren für eine erhöhte Badlebensdauer in einem Einzelbadplattierungsverfahren System and method for enhanced bath life in a Einzelbadplattierungsverfahren
11/24/2005DE102004019110A1 Verfahren zur Herstellung eines Grünkörpers Process for the preparation of a green body
11/22/2005US6966976 Electroplating panel with plating thickness-compensation structures
11/17/2005WO2005108651A2 Method for production of a coating and anode used in such a method
11/17/2005US20050252786 Electrolytic process and apparatus
11/17/2005US20050252784 Microfluid device and synthetic methods
11/17/2005US20050252764 Wind-powered linear motion hydrogen production systems
11/16/2005EP1177325B1 Component support
11/16/2005CN2740626Y Electroplating pylons
11/16/2005CN2740625Y Hitch for deactivating treatment of radiator surface
11/16/2005CN1227394C Steel wire spring clamp head, wire-guiding frame conveying belt and electroplating system
11/15/2005US6964792 Using diffuser membrane in electrolytic cells
11/10/2005WO2005105322A1 Substrate processing unit and substrate processing apparatus
11/10/2005US20050250324 Plating apparatus
11/10/2005US20050247556 Electrolytic reactor
11/09/2005EP1594161A1 Plasma processing apparatus, electrode plate for plasma processing apparatus, and electrode plate manufacturing method
11/09/2005CN2739198Y Natural-sediment-filter electroplating tank
11/08/2005US6962649 Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
11/08/2005US6962524 Conductive polishing article for electrochemical mechanical polishing
11/03/2005WO2005103339A1 Method for producing a green body
11/03/2005WO2005033377A3 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
11/03/2005US20050245784 Mediated electrochemical oxidation of inorganic materials
11/03/2005US20050245083 Apparatus and method for electrochemically depositing metal on a semiconductor workpiece
11/03/2005US20050242064 Substrate processing apparatus
11/03/2005US20050241955 Substrate processing apparatus and substrate processing method
11/03/2005US20050241947 System and method for an increased bath lifetime in a single-use plating regime
11/03/2005US20050241946 electrodeposition of copper or silver; for filling fine interconnect recesses such as trenches and via holes in semiconductor substrate with uniform coatings; control the movement of the conductive layer and the porous member relatively to each other without passing electric current
11/03/2005US20050241137 Electrode, electrochemical device, and method of making electrode
11/03/2005DE10393792T5 Integrierte photoelektrochemische Zelle und System mit einem flüssigen Elektrolyten Integrated photo-electrochemical cell and system with a liquid electrolyte
11/02/2005CN1691372A Electrode, electrochemical device, and method of making electrode
11/01/2005CA2176579C Method and apparatus for electrolytically metallising or etching material
10/2005
10/27/2005US20050239292 Device for etching semicnductors with a large surface area
10/27/2005US20050236268 Substrate processing apparatus
10/26/2005EP0813243B1 Material for a semiconductor device carrier substrate and method of producing the same
10/26/2005CN1688753A Device and method for electrolytically treating an at least superficially electrically conducting work piece
10/25/2005US6958113 Plating apparatus and plating method
10/20/2005US20050233653 Electronic connector terminal, a method for plating, and a terminal stack
10/20/2005US20050230268 electrolytic cells including water tanks, electrodes and a direct current power source, used for trapping and precipitating gramnegative bacteria from water; water treatment
10/20/2005US20050230267 Electro-decontamination of contaminated surfaces
10/20/2005US20050230262 Electrochemical methods for the formation of protective features on metallized features
10/20/2005US20050230260 Plating apparatus and method
10/19/2005CN1685085A Electrolytic cell leak limiter
10/19/2005CN1685083A Electrolysis process and apparatus
10/19/2005CN1685080A Substrate processing apparatus and substrate processing method
10/19/2005CN1683222A Surface treating device
10/19/2005CN1223708C Product guide mechanism for electroplating processing device
10/13/2005WO2005095678A2 Electroplating system and method
10/13/2005US20050224359 Method and apparatus for electroplating
10/13/2005US20050224358 Method for improved local planarity control during electropolishing
10/13/2005US20050224357 Method and device for treating flat and flexible work pieces
10/13/2005US20050224340 System for electrochemically processing a workpiece
10/13/2005CA2559152A1 Electroplating system and method
10/12/2005EP1292724B1 Zinc-nickel electroplating
10/12/2005CN2732766Y Durionising device capable of saving electric energy and equipment accessory
10/12/2005CN1682393A Anode compositions having an elastomeric binder and an adhesion promoter
10/12/2005CN1681967A Non-cyanide copper plating process for zinc and zinc alloys
10/12/2005CN1680631A Electrolysis treating method and apparatus
10/06/2005US20050221621 Proximity head heating method and apparatus
10/06/2005US20050221162 Catalyst structures for electrochemical fuel cells
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