| Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411) |
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| 08/26/2004 | WO2004072331A2 Apparatus and method for highly controlled electrodeposition |
| 08/26/2004 | US20040166789 Method of sealing wafer backside for full-face processing |
| 08/26/2004 | US20040163963 Filter divides internal housing volume; fluid flow to second chamber is higher speed than to first chamber; flows are blended in second chamber; rotates at controlled speed |
| 08/26/2004 | US20040163950 Planar plating apparatus |
| 08/26/2004 | US20040163948 Plating apparatus and method of managing plating liquid composition |
| 08/26/2004 | US20040163946 Pad assembly for electrochemical mechanical processing |
| 08/26/2004 | DE10310071B3 Process for galvanizing components with metallic coatings comprises moving the component to be coated through process stations using a gripper (20), and immersing in galvanic baths |
| 08/26/2004 | DE10235020B4 Vorrichtung und Verfahren zum Ätzen großflächiger Halbleiterscheiben Apparatus and method for etching large-surface semiconductor wafers |
| 08/25/2004 | EP1448812A1 Hydrogen generating cell with cathode subassembly construction |
| 08/19/2004 | WO2004070808A1 Plasma treating device, and plasma treating device electrode plate, and electrode plate producing method |
| 08/19/2004 | US20040159553 Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices |
| 08/19/2004 | US20040159551 dissolving metal particles in a plating system containing a cathode (especially a circuit board) and an insoluble anode and contacting with oxygen in the form of air bubbles, which is automatically or manually controlled; relatively low temperature |
| 08/19/2004 | US20040159543 Electrochemical cell plate with integral seals |
| 08/19/2004 | US20040159542 Galvanizing device |
| 08/18/2004 | EP1447463A1 Metal element for use in a metal basket serving as an anode |
| 08/17/2004 | US6776885 Integrated plating and planarization apparatus having a variable-diameter counterelectrode |
| 08/12/2004 | US20040154927 Internal heat spreader plating methods and devices |
| 08/12/2004 | DE10304533A1 Bead single-crystal with provision for electrical heating, ease of cleaning and electroplating applications, as supply wires |
| 08/11/2004 | EP1445353A1 Method and device for surface treatment of treated object |
| 08/11/2004 | EP1444385A1 Anodes for electroplating operations, and methods of forming materials over semiconductor substrates |
| 08/11/2004 | EP1444064A2 Manufacture of fine-grained electroplating anodes |
| 08/11/2004 | EP1133589B1 Enhanced membrane electrode devices useful for electrodeposition coating |
| 08/11/2004 | CN2632100Y Electroplating coating pylons apparatus |
| 08/11/2004 | CN2632097Y Automatic three dimensional circulating electrolytic devices |
| 08/11/2004 | CN1520334A Vibratingly stirring appts., and device and method for processing using stirring appts. |
| 08/11/2004 | CN1519396A Appts. and method of forming zine oxide thin film |
| 08/11/2004 | CN1161501C Electroplating equipment |
| 08/11/2004 | CN1161499C Anode electrode structure for mfg. metal foil |
| 08/10/2004 | US6773576 Anode assembly for plating and planarizing a conductive layer |
| 08/10/2004 | US6773573 Plating bath and method for depositing a metal layer on a substrate |
| 08/10/2004 | US6773571 Distributing the current between concentric inner anode and and outer anode (near the wafer edge) to compensate for the variation in electrical resistance and voltage of the seed layer by using focusing elements |
| 08/10/2004 | US6773560 Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
| 08/10/2004 | US6773559 Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece |
| 08/05/2004 | WO2004065665A1 Method and devices for electrochemical treatment of articles |
| 08/05/2004 | WO2004065664A1 Plating device and plating method |
| 08/05/2004 | WO2004065049A1 System and method for holding and releasing a workpiece for electrochemical machining |
| 08/05/2004 | WO2002097170B1 Mobile zinc cathode stripping system |
| 08/05/2004 | US20040149588 Electrolytic cooper plating method, phosphorus-containing anode for electrolytic cooper plating, and semiconductor wafer plated using them and having few particles adhering to it |
| 08/05/2004 | US20040149584 Completely embedding conductive interconnects in high aspect ratio recesses; covering narrow and broad trenches; flatness; rapid chemical mechanical polishing without dishing; growing film while controlling current density |
| 08/05/2004 | US20040149573 Contact ring with embedded flexible contacts |
| 08/04/2004 | CN2630264Y Loading-unloading machine for electroplating apparatus |
| 08/04/2004 | CN1517453A Electroplating device, electroplating cup and cathode ring |
| 07/29/2004 | DE10296936T5 Verfahren zur Herstellung von elektroleitfähigen Teilchen A process for producing electro-conductive particles |
| 07/28/2004 | EP1441048A2 Plating apparatus, plating cup and cathode ring |
| 07/28/2004 | CN2628545Y Electroplating bath anode feeding apparatus |
| 07/28/2004 | CN2628544Y Crystallizer copper plate box type electroplating device for continuous casting machine |
| 07/28/2004 | CN1516755A Plating apparatus, plasting method and method for mfg. semiconductor device |
| 07/27/2004 | US6768194 Electrode for electroplating planar structures |
| 07/27/2004 | US6767437 Electroplating apparatus and electroplating method |
| 07/22/2004 | WO2004061164A1 Work transfer device for immerse transfer electroplating apparatus |
| 07/22/2004 | US20040140224 Plenum located within holder has proximal end capable of being removably coupled; piston is configured to move upward in plenum and to lift workpiece off |
| 07/22/2004 | US20040140203 Liquid isolation of contact rings |
| 07/22/2004 | US20040140199 Plating apparatus, plating cup and cathode ring |
| 07/22/2004 | DE10241619B4 Vorrichtung und Verfahren zum elektrolytischen Behandeln von zumindest oberflächlich elektrisch leitfähigem Behandlungsgut Method and apparatus for electrolytic treatment of at least superficially electrically conductive material to be treated |
| 07/21/2004 | EP1438447A2 Method and conveyorized system for electrolytically processing work pieces |
| 07/21/2004 | EP1438446A2 System and method for electrolytic plating |
| 07/21/2004 | CN1158412C Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated |
| 07/21/2004 | CN1158411C Electroplating device for circuit board |
| 07/15/2004 | WO2004059045A2 Anode used for electroplating |
| 07/15/2004 | US20040134793 for plating conductive material on semiconductor substrate by rotating pad/blade/anode; eliminates dishing and voids; for production of integrated circuits |
| 07/15/2004 | US20040134774 Processing apparatus including a reactor for electrochemically etching microelectronic workpiece |
| 07/14/2004 | CN1511977A Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package |
| 07/14/2004 | CN1157503C Method for producing very small metal ball |
| 07/08/2004 | WO2004007811A3 Device and method for monitoring an electrolytic process |
| 07/08/2004 | WO2004001813A3 Substrate holder and plating apparatus |
| 07/08/2004 | WO2002004712A3 Flow diffuser to be used in electro-chemical plating system |
| 07/08/2004 | US20040131766 Substrate processing method and apparatus |
| 07/08/2004 | US20040129576 improves the flatness of a plated film on a substrate even when fine grooves and large grooves are co-present in the surface of the substrate, enabling a later CMP processing to be carried out in a short time while preventing dishing |
| 07/08/2004 | US20040129575 rotating substrate holding member to remove plating liquid; and sucking liquid remaining on the substrate-contacting portion or in its vicinity, while the holding member is rotated |
| 07/08/2004 | US20040129569 Electrolytic processing apparatus and electrolytic processing method |
| 07/08/2004 | US20040129384 Chemical treatment apparatus and chemical treatment method |
| 07/08/2004 | US20040129209 Phosphate film processing method and phospate film processing device |
| 07/08/2004 | DE10261493A1 Anode zur Galvanisierung Anode for electroplating |
| 07/08/2004 | DE10261396A1 Handling station for electroplating of band type substrate carriers, e.g. in solar cells, has a first trough-type container used for galvanizing the strip and a second container which recycles electrolyte flowing from first container |
| 07/08/2004 | DE10260863A1 Closed reactor for surface electroplating, especially chromium plating of a workpiece, includes a reactor housing and a reactor space containing the workpiece |
| 07/06/2004 | US6758958 System and a method for plating of a conductive pattern |
| 07/06/2004 | US6758920 Copper, silver alloy |
| 07/01/2004 | WO2004055923A2 Direct organic fuel cell proton exchange membrane and method of manufacturing the same |
| 07/01/2004 | WO2003002784A3 Electrolysis cell for restoring the concentration of metal ions in electroplating processes |
| 07/01/2004 | US20040124089 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 06/30/2004 | EP1433880A1 Electroforming system and electroforming method |
| 06/30/2004 | EP1433537A1 Holding device for hollow articles and its operating method |
| 06/30/2004 | EP1432523A1 Improvements relating to coating processes and carriers |
| 06/30/2004 | EP1278899B1 Method and device for the electrolytic coating of a metal strip |
| 06/30/2004 | CN1509351A Copper electroplating method, phosphorus-copper anode for copper electroplating, and semiconductor wafer with minimal particle adhesion plated by using them |
| 06/30/2004 | CN1509350A Anodization device and anodization method |
| 06/30/2004 | CN1509348A Workpiece wet processing |
| 06/30/2004 | CN1508296A Electroplating device and method thereof |
| 06/29/2004 | US6755960 Zinc-nickel electroplating |
| 06/29/2004 | US6755955 Immersing a planar substrate in an electrolyte that contains the catalytically active metallic; applying an electrical voltage; depositing a layer of catalytically active metallic material by electrochemical deposition on the planar substrate |
| 06/29/2004 | US6755954 Electrochemical treatment of integrated circuit substrates using concentric anodes and variable field shaping elements |
| 06/29/2004 | US6755946 Clamshell apparatus with dynamic uniformity control |
| 06/24/2004 | WO2004053204A1 Submicron and nano size particle encapsulation by electrochemical process and apparatus |
| 06/24/2004 | WO2004052547A2 Coated and magnetic particles and applications thereof |
| 06/24/2004 | WO2004020320A3 Apparatus for treating strip-shaped parts |
| 06/24/2004 | US20040118676 Plating apparatus and plating method |
| 06/23/2004 | EP1431424A2 Plating apparatus and plating method |
| 06/23/2004 | EP1430167A2 Plating apparatus and method |
| 06/23/2004 | CN1506502A Method and equipment for controlling local electric current to obtain uniform electroplating thickness |
| 06/22/2004 | US6752915 Web conveying apparatus, and apparatus and method for electrodeposition using web conveying apparatus |