Patents for C25D 17 - Constructional parts, or assemblies thereof, of cells for electrolytic coating (9,411)
03/2006
03/29/2006CN1247825C Forming method of anode oxidation film on zipper tooth row and its forming equipment
03/28/2006US7020537 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
03/23/2006WO2006030998A1 Electro polishing combined electric plating apparatus and electroless plating apparatus using the same
03/23/2006US20060060468 System for treating, in particular, cataphoretically immersion painting vehicle bodies
03/23/2006DE102004036940A1 Electrode arrangement used for electrolytically deposition processes e.g. in the automobile industry comprises partial electrodes arranged next to each other and separated from each other by electrically poorly conducting sections
03/22/2006EP1637629A2 Apparatus and method for electroplating a workpiece
03/22/2006EP1636845A2 Wet chemical processing chambers for processing microfeature workpieces
03/21/2006US7014739 Convex profile anode for electroplating system
03/16/2006WO2006027311A1 Electrode arrangement having variable geometry for electrochemical treatments
03/16/2006WO2005035444A3 Electro-catalysts for the oxidation of ammonia in alkaline media
03/09/2006DE10229166B4 Verfahren zur Herstellung einer strukturierten Metallschicht A method for producing a structured metal layer
03/09/2006DE102004041812A1 Reaktor zum Erzeugen von Oberflächenreaktionen und dessen Verwendung A reactor for generation of surface reactions and the use thereof
03/08/2006CN1244722C Apparatus for copper plating using electroless plating and electroplating
03/08/2006CN1244720C Plating method of electrolytic copper
03/02/2006US20060042934 Method and apparatus for forming an electrical contact with a semiconductor substrate
03/02/2006US20060042931 ECM-machine
03/01/2006EP1630259A2 Electroplating apparatus and method for making an electroplating anode assembly
03/01/2006CN1742119A Plating device and plating method
03/01/2006CN1740403A Making process of large titanium cathode roller cylinder and composite great current cathode roller
02/2006
02/28/2006US7005046 Apparatus for electro chemical deposition
02/23/2006WO2005042804A3 Method and apparatus for fluid processing a workpiece
02/23/2006US20060037865 Methods and apparatus for fabricating gas turbine engines
02/23/2006US20060037858 Electroless plating apparatus and electroless plating method
02/23/2006US20060037857 Workpiece holder for processing apparatus, and processing apparatus using the same
02/23/2006US20060037855 Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
02/23/2006DE102004049303B3 Electrodeposition on rotationally symmetrical and electrically charged components useful generally in electroplating, e.g. in silver plating of copper rings with holding of the component by at least two rings during coating
02/23/2006DE102004039632A1 Behälter für eine galvanotechnische Vertikal-Behandlungsanlage und dessen Herstellverfahren Container for a vertical electroplating treatment plant and its manufacturing method
02/22/2006EP1627992A2 Methods and apparatus for fabricating gas turbine engines
02/22/2006EP1626928A1 Compositions, devices and methods for stabilizing and increasing the efficacy of halogen dioxide solutions
02/22/2006EP0991795B1 Electro-chemical deposition system and method of electroplating on substrates
02/22/2006CN2760055Y Electroplating machine driving device
02/22/2006CN2760054Y An anode for chrome plating of color glass screen die
02/22/2006CN1737207A Electroplating head and method for operating the same
02/21/2006US7001498 Thin film transistor (TFT); apparatus has a plurality of chambers that are adapted for movement in a first direction along the surface to be electroplated; liquid crystal displays for example
02/16/2006WO2005029540A3 Substrate carrier for electroplating solar cells
02/09/2006WO2005116302A3 Electrolyte cleaning method using bipolar plastic-diamond electrodes
02/09/2006US20060027747 coating only the tip portions of the test detectors by contact with the non-conductive fiber sheet; cost effective to manufacture and provides increase durability, wear resistance while minimizing alterations in the probe spring characteristics
02/09/2006US20060027463 Water treatment apparatus utilizing ozonation and electrolytic chlorination
02/09/2006US20060027452 Substrate processing apparatus and substrate plating apparatus
02/09/2006DE10309401B4 Vorrichtung und Verfahren zu Beschichtung von Gegenständen An apparatus and process for coating objects
02/08/2006EP1623057A2 Device for treating objects, in particular for plating printed circuit boards
02/07/2006US6994776 Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
02/02/2006WO2006012112A2 Electrochemical plating cell with an auxiliary electrode in an isolated anolyte compartment
02/02/2006WO2006010888A1 A process for manufacturing micro- and nano- devices
02/01/2006CN2755108Y Tree-like crystal remover of electrolyzer from gravity
02/01/2006CN2755107Y Chromium plating device
02/01/2006CN1729315A Method for producing galvanically deposited antennae for RFID labels using an adhesive that is selectively applied
02/01/2006CN1239754C Anodizing processing device
02/01/2006CN1239753C Nickel base alloy composite conductor roll and manufacturing method
01/2006
01/31/2006US6991717 Web processing method and apparatus
01/31/2006US6991710 Apparatus for manually and automatically processing microelectronic workpieces
01/31/2006CA2179904C Method and device for electrolytically depositing metals from electrolytes containing organic additives
01/26/2006WO2006010149A2 A bio-electrochemically assisted microbial reactor that generates hydrogen gas and methods of generating hydrogen gas
01/26/2006WO2006009686A1 Common rack for electroplating and pvd coating operations
01/26/2006WO2005095678A3 Electroplating system and method
01/26/2006WO2004085714A8 Device and the parts thereof for producing electrodeposited dental shaped pieces
01/26/2006DE102004032659A1 Vorrichtung und Verfahren zum chemischen oder elektrolytischen Behandeln von Behandlungsgut sowie die Verwendung der Vorrichtung Apparatus and method for chemical or electrolytic treatment of material to be treated and to the use of the device
01/25/2006CN1238571C Electroplating cup with adjustable spacing between cathode, anode and uniform stream plate in wafer level package
01/24/2006US6989084 Semiconductor wafer plating cell assembly
01/24/2006US6988932 Apparatus of sealing wafer backside for full-face processing
01/19/2006WO2006006992A1 Chromium plating method
01/19/2006US20060011491 Bio-electrochemically assisted microbial reactor that generates hydrogen gas and methods of generating hydrogen gas
01/19/2006US20060011489 Electrolysis process and apparatus
01/19/2006US20060011479 Method and apparatus for the bulk coating of components
01/19/2006US20060011472 Deep well geothermal hydrogen generator
01/19/2006DE102004030726A1 Process to etch manufacture printed circuit board by regulation of electrolytic cell voltage transverse to the direction of travel
01/19/2006DE102004030377B3 Translatorischer Manipulator, Behandlungsanlage und Verfahren zum Behandeln von Behandlungsgut Translational manipulator treatment system and method for treating treated
01/19/2006CA2579670A1 Chromium plating method
01/18/2006CN2752277Y Top cover structure for electroplated rolling drum
01/18/2006CN1722374A Substrate proximity processing structures and methods for using and making the same
01/18/2006CN1722372A Proximity head heating method and apparatus
01/17/2006US6986838 producing electrodes having generally regularly oriented and shaped pores with a diameter of less than one micron; are highly electrically and thermally conductive, allow unimpeded transport of gases or liquids through the electrode
01/12/2006WO2006004747A2 Membrane electrode system for electro coating
01/12/2006WO2006002969A2 Device and method for chemically and electrolytically treating work pieces
01/12/2006WO2005059206A3 Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces
01/12/2006WO2005054838A3 Method for controlling electrodeposition of an entity and devices incorporating the immobilized entity
01/12/2006US20060009033 Defect-free thin and planar film processing
01/12/2006US20060006060 Method and apparatus for processing a substrate with minimal edge exclusion
01/11/2006CN1720633A Fluorine separation and generation device
01/11/2006CN1718870A Conductive brush
01/11/2006CN1718868A Electrolytic film plating device
01/05/2006WO2006000301A1 Electrochemical surface treatment device and method
01/05/2006US20060000719 Method and apparatus for feeding chips to a deposition location in a coating system
01/05/2006US20060000716 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
01/05/2006US20060000708 Noble metal contacts for plating applications
01/05/2006US20060000704 Solution treatment apparatus and solution treatment method
01/05/2006DE102004031422B3 Vorrichtung und Verfahren zur elektrochemischen Oberflächenbehandlung Device and method for the electrochemical surface treatment
01/04/2006EP1612855A2 Method and apparatus for plating semiconductor wafers
01/04/2006EP1612298A2 Electroplating head and method for operating the same
01/04/2006CN1717153A Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
01/04/2006CN1234919C Electroplating apparatus
01/04/2006CN1234917C Continuous nickel plating apparatus for fine metal wire
01/04/2006CN1234916C Method and device for electrolytic treatment of electrically insulating film materials and use of said method
12/2005
12/29/2005WO2005123989A1 Plating apparatus
12/29/2005WO2004094702A8 Multi-chemistry plating system
12/29/2005US20050284770 A multilayer pad having a ring-shaped upper polish layer and replaceable conductive layer; attaching to exterior power source; controlling the rate of copper material removal from printed circuits, determining each polishing time in each zone; tools for making semiconductors
12/29/2005US20050284769 Using electrolytic bath; overcoating plating chromium compound on substrates; controlling temperature, pH
12/29/2005US20050284755 Substrate support element for an electrochemical plating cell
12/29/2005US20050284754 Electric field reducing thrust plate
12/29/2005US20050284753 Capping board with separating walls
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