Patents for C23F 1 - Etching metallic material by chemical means (16,062)
08/2009
08/18/2009US7575692 Method for etching chromium thin film and method for producing photomask
08/18/2009US7575638 Apparatus for defining regions of process exclusion and process performance in a process chamber
08/18/2009US7575623 Method for leaching aluminium-metal alloys
08/18/2009US7574974 Device for production of a plasma sheet
08/13/2009WO2009099630A1 Single phase fluid imprint lithography method
08/13/2009US20090200269 Protective coating for a plasma processing chamber part and a method of use
08/13/2009US20090200268 Adjustable gap capacitively coupled rf plasma reactor including lateral bellows and non-contact particle seal
08/13/2009US20090200265 Lead Frame Fabrication Method
08/13/2009US20090200262 Method for Producing Porous Microneedles and their Use
08/13/2009US20090199968 Method and Apparatus for Electronic Device Manufacture Using Shadow Masks
08/13/2009US20090199967 Mounting stage and plasma processing apparatus
08/13/2009DE102009006397A1 Polysiliziumschicht-Entfernverfahren und Speichermedium Polysilicon layer Removal and storage medium
08/12/2009EP1252028B1 Method of fabricating a micro machined structure
08/12/2009CN101505974A Photomask for the fabrication of a dual damascene structure and method for forming the same
08/12/2009CN101503801A Aluminum foil corrosion technique for electrolytic capacitor
08/12/2009CN101503791A Alloying technique for semiconductor chip Au-Si solder
08/12/2009CN100526507C Etching liquid fot titanium or titanium alloy
08/11/2009US7572386 Method of treating a mask layer prior to performing an etching process
08/11/2009US7572337 Blocker plate bypass to distribute gases in a chemical vapor deposition system
08/11/2009US7571697 Plasma processor coil
08/06/2009US20090197422 Reducing damage to low-k materials during photoresist stripping
08/06/2009US20090197049 Method for dry chemical treatment of substrates and also use thereof
08/06/2009US20090196999 Adhesion promotion
08/06/2009US20090196003 Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard
08/06/2009US20090194767 Conductive oxide-deposited substrate and method for producing the same, and mis laminated structure and method for producing the same
08/06/2009US20090194509 Substrate treatment apparatus, and substrate treatment method
08/06/2009US20090194508 Substrate plasma processing apparatus and plasma processing method
08/06/2009US20090194507 Apparatus and method for cleaning, etching, activation and subsequent treatment of glass surfaces, glass surfaces coated by metal oxides, and surfaces of other si02-coated materials
08/06/2009US20090194505 Vacuum coating techniques
08/06/2009US20090194238 Plasma processing apparatus
08/06/2009US20090194236 Plasma processing equipment
08/06/2009US20090194234 Substrate treatment apparatus, and substrate support to be used for the apparatus
08/06/2009US20090193903 Method for sensor fabrication and related sensor and system
08/05/2009CN101498002A Surface-treating agent for metal and printed wiring substrate
08/05/2009CN101498000A Etching agent composition for copper-containing material
08/05/2009CN100525590C Process for manufacturing a wiring substrate
08/05/2009CN100524651C Etching apparatus
08/05/2009CN100524558C A low-voltage anode foil used for aluminium electrolytic capacitor and its manufacturing method
08/05/2009CN100523300C Method for recovering and utilizing valuable metals from nickel and iron etching waste liquid
08/04/2009US7569154 Plasma processing method, plasma processing apparatus and computer storage medium
07/2009
07/30/2009WO2009093668A1 Bonded object of metal/alloy and adherend and process for producing the same
07/30/2009US20090191711 Hardmask open process with enhanced cd space shrink and reduction
07/30/2009US20090188892 Method of checking substrate edge processing apparatus
07/30/2009US20090188890 Solder void reduction on circuit boards
07/30/2009US20090188889 Expandable stents and method for making same
07/30/2009US20090188626 Plasma jet device
07/29/2009EP1797220A4 Rf ground switch for plasma processing system
07/29/2009CN100519843C Composite etchant for 409L ferritic stainless steel and use method thereof
07/28/2009US7566368 Method and apparatus for an improved upper electrode plate in a plasma processing system
07/23/2009WO2009091012A1 Etchant for copper or copper alloy, liquid for etching pretreatment, and etching method
07/23/2009WO2009071788A3 Method and device for selective etching
07/23/2009US20090187215 Methods and apparatus to reduce a dimension of an implantable device in a smaller state
07/23/2009US20090186487 Edge ring assembly with dielectric spacer ring
07/23/2009US20090186157 Method for at least selectively removing a first layer from an engine component
07/23/2009US20090184092 Palladium-Selective Etching Solution and Method for Controlling Etching Selectivity
07/23/2009US20090184089 Fabrication of a silicon structure and deep silicon etch with profile control
07/23/2009US20090183835 Etching process apparatus and member for etching process chamber
07/23/2009US20090183834 Plasma generation apparatus
07/23/2009US20090183833 Plasma processing apparatus
07/22/2009EP2079857A1 Method for measuring the active koh concentration in a koh etching process
07/22/2009CN101487123A Surface treating method for titanium belt and titanium mesh anode
07/22/2009CN101487122A Etching solution
07/22/2009CN100517596C Method and apparatus for reducing aspect ratio dependent etching in time division multiplexed etch processes
07/22/2009CN100516985C Etching composition for wet corrosion of laminated film
07/22/2009CN100516305C Fluorine surface etchant for semiconductor and preparation method thereof
07/22/2009CN100516304C Decoating liquid
07/22/2009CN100516303C Removing liquid for tungsten metal and method for removing tungsten metal using such liquid
07/21/2009US7563328 Method and apparatus for gas injection system with minimum particulate contamination
07/21/2009US7563315 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
07/21/2009US7562662 Oxidizer of ammonium iodine oxide, potassium iodine oxide, lithium iodine oxide, calcium iodine oxide, barium iodine oxide, potassium iodine, or ammonium iodine, deionized water, a fluorine based deoxidizer, and a surface charge controlling agent; corrosion resistance
07/21/2009US7562638 Methods and arrangement for implementing highly efficient plasma traps
07/16/2009WO2009089513A2 Methods of generating supported nanocatalysts and compositions thereof
07/16/2009US20090181545 Dry-etching method and apparatus
07/16/2009US20090181278 Micro fuel cell, fabrication method thereof, and micro fuel cell stack using the same
07/16/2009US20090179008 Substrate treating apparatus and method
07/16/2009US20090179007 Liquid treatment method and storage system
07/16/2009US20090179006 Method and Device for a Forced Wet-Chemical Treatment of Surfaces
07/16/2009US20090179005 Nanotube Processing Employing Solid-Condensed-Gas-Layers
07/16/2009US20090179003 Substrate processing method, substrate processing apparatus and recording medium
07/16/2009US20090179002 Method of forming polymer features by directed self-assembly of block copolymers
07/16/2009US20090178762 Substrate processing apparatus
07/15/2009EP1104693B1 Titanium composite material
07/15/2009CN101481801A Etching solution
07/15/2009CN100513645C Metallographic etching agent
07/15/2009CN100513644C Etchant and replenishment solution therefor, and etching method and method for producing wiring board using them
07/14/2009US7560040 Etching method and article etched molded by that method
07/14/2009US7560038 Thin film forming method and system
07/14/2009CA2386117C Multiple material golf club head
07/09/2009WO2009084648A1 Composite of steel product and resin and process for producing the composite
07/09/2009US20090176349 Method and Device for Machining a Wafer, in Addition to a Wafer Comprising a Separation Layer and a Support Layer
07/09/2009US20090176034 Surface Treatment Technique and Surface Treatment Apparatus Associated With Ablation Technology
07/09/2009US20090175023 Interposer and method for manufacturing interposer
07/09/2009US20090173931 Methods of Making, Positioning and Orienting Nanostructures, Nanostructure Arrays and Nanostructure Devices
07/09/2009US20090173718 Method of damaged low-k dielectric film layer removal
07/09/2009US20090173717 Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
07/09/2009US20090173713 Method for Manufacturing Metallic Panel Having Multilayer Arrays Of Micropores
07/09/2009US20090173446 Substrate support, substrate processing apparatus including substrate support, and method of aligning substrate
07/09/2009US20090173445 Inductively coupled plasma processing apparatus having internal linear antenna for large are processing
07/09/2009US20090173444 Surface processing apparatus
07/09/2009DE102007054485A1 Siliziumoberflächen-Strukturierungs-Verfahren Silicon surface texturing process
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