| Patents for C23F 1 - Etching metallic material by chemical means (16,062) |
|---|
| 06/16/2004 | EP1429185A1 Etching method and composition for forming etching protective layer |
| 06/16/2004 | EP0954385B1 Fluid delivery apparatus and method |
| 06/15/2004 | US6750597 Method for manufacturing spark plug and spark plug |
| 06/15/2004 | US6750148 Method of manufacturing wireless suspension blank |
| 06/15/2004 | US6749766 Etched metal oxide film |
| 06/15/2004 | US6749760 Etching a ball-limiting metallurgy stack in presence of lead, tin, and copper; integrated circuits |
| 06/10/2004 | WO2004049418A1 Plasma processing system and method and electrode plate of plasma processing system |
| 06/10/2004 | WO2004048636A2 Method of cleaning a coated process chamber component |
| 06/10/2004 | US20040110375 Method and system for etching high-k dielectric materials |
| 06/10/2004 | US20040108300 Semiconductor processing device |
| 06/10/2004 | US20040108299 Etchant |
| 06/10/2004 | US20040108297 Process for etching silicon wafers |
| 06/10/2004 | US20040108296 XeF2 gas produced by sublimation in a vacuum atmosphere decomposes and gasifies grease components and removes silicon pieces by etching; with or without water |
| 06/10/2004 | US20040108059 System and method for removal of materials from an article |
| 06/09/2004 | CN1502722A Etching solution composition for metal foil using silver as main composition |
| 06/08/2004 | US6747351 Semiconductor device and method of manufacturing of the same |
| 06/08/2004 | US6746967 Etching metal using sonication |
| 06/08/2004 | US6746621 Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board |
| 06/03/2004 | WO2004045869A1 Method for improving the accuracy of an etched silicon pattern using mask compensation |
| 06/03/2004 | WO2004034460A3 Method for eliminating voiding in plated solder |
| 06/03/2004 | US20040106530 Using mixture containing hydroxylamine compound |
| 06/03/2004 | US20040106235 Method for manufacturing circuit devices |
| 06/03/2004 | US20040104199 Combined wet etching method for stacked films and wet etching system used for same |
| 06/03/2004 | US20040104196 Method of forming fine patterns |
| 06/02/2004 | CN1501763A Plasma processing apparatus |
| 06/02/2004 | CN1501762A Plasma processing apparatus |
| 06/02/2004 | CN1501176A Combined wet etching method for stacked films and wet etching system used for same |
| 06/02/2004 | CN1500912A Improved cleaning c omposition |
| 06/02/2004 | CN1152154C 制备锑化镓基半导体器件用的化学腐蚀液 Chemical etching solution prepared GaSb-based semiconductor device with |
| 06/01/2004 | US6743727 Method of etching high aspect ratio openings |
| 05/27/2004 | US20040101624 Treating metal surfaces with a modified oxide replacement composition |
| 05/27/2004 | US20040099637 Microetching; printed circuits; mixture of acid, oxidizer, organonitrogen compound and silver compounds; overcoating with polymer |
| 05/27/2004 | US20040099635 photoreactive alignment layer is made from polyamic acid obtained by reacting a diamine with an acid anhydride, selected from1,2,3,4-cyclopentanetetracarboxylic acid dianhydride,1,2,3,4-butanetetracarboxylic acid dianhydride, and 1,2,3,4-cyclobutanetetracarboxylic acid dianhydride; free of nonuniformity |
| 05/27/2004 | US20040099376 Plasma etching uniformity control |
| 05/27/2004 | US20040099285 Method of cleaning a coated process chamber component |
| 05/26/2004 | EP1421164A1 Surface treatment composition and method for removing si component and reduced metal salt produced on the aluminum dicast material in etching process |
| 05/26/2004 | CN1499583A Method for reducing proportion of discarding wafer in chemical-treating facility |
| 05/26/2004 | CN1499179A Chemical treating tank with indicator for liquid level in outer trough |
| 05/26/2004 | CN1498985A Nickel ion separated from ferric chloride solution by using iron substitution method |
| 05/25/2004 | US6740252 Potassium hypochlorite, hydrofluoric acid and deionized water |
| 05/25/2004 | US6739360 Liner for use in processing chamber |
| 05/20/2004 | US20040098080 Expandable stents and method for making same |
| 05/20/2004 | US20040097088 Conductor treating single-wafer type treating device and method for semi-conductor treating |
| 05/20/2004 | US20040094503 forming electroconductive layers comprising transition metals, then laying masking layers comprising aluminum, titanium or tungsten silicide, nitrides and/or oxides, etching the masking layer to form contact apertures and applying dielectrics between the apertures; miniaturization |
| 05/20/2004 | US20040093725 Bond surface conditioning system for improved bondability |
| 05/19/2004 | DE10216725B4 Verfahren zur Herstellung einer Metallplatte mit einer Öffnung von ultrakleinem Querschnitt A process for producing a metal plate having an opening of ultra small cross-section |
| 05/19/2004 | CN1498291A Electrolytic recycling device |
| 05/19/2004 | CN1498289A Method of plating and pretreating aluminium workpieces |
| 05/19/2004 | CN1497691A Manufacturing method of circuit device |
| 05/19/2004 | CN1497066A Wet chemical processing method and device of silicon |
| 05/18/2004 | US6737358 Plasma etching uniformity control |
| 05/18/2004 | US6737221 Lithography |
| 05/18/2004 | US6736983 Method for producing microcomponents |
| 05/13/2004 | WO2004040633A1 Method for using additives in the caustic etching of silicon for obtaining improved surface characteristics |
| 05/13/2004 | WO2004006298A3 Method and apparatus for non-invasive measurement and analysis of semiconductor process parameters |
| 05/13/2004 | WO2004003969A3 Method and system for predicting process performance using material processing tool and sensor data |
| 05/13/2004 | US20040089838 Etching with sulfuric acid, hydrogen peroxide, and tetrazole derivative to form acicular projections in printed circuits |
| 05/13/2004 | US20040089634 Compositions for oxide CMP |
| 05/13/2004 | US20040089419 Method for using additives in the caustic etching of silicon for obtaining improved surface characteristics |
| 05/12/2004 | EP0954226A4 Molding of fastening hooks and other devices |
| 05/12/2004 | CN1495865A Etching liquid reproducing method, etching method and system |
| 05/12/2004 | CN1495292A Chemical processing method and chemical processing device |
| 05/12/2004 | CN1149646C Vacuum processing method and apparatus |
| 05/11/2004 | US6733616 Surface isolation device |
| 05/11/2004 | US6733615 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
| 05/06/2004 | WO2004038068A1 Method for removing a layer area of a component |
| 05/06/2004 | US20040084413 Etching method |
| 05/06/2004 | US20040084319 Method for electrochemical fabrication |
| 05/06/2004 | EP1414770A2 A process for converting a metal carbide to diamond by etching in halogens |
| 05/06/2004 | DE10248481A1 Process for the wet chemical treatment of silicon, e.g. wafers, comprises using an etching liquid containing water, nitric acid and hydrofluoric acid |
| 05/04/2004 | US6730600 Method of dry etching a semiconductor device in the absence of a plasma |
| 04/29/2004 | US20040079681 Recycle process for a metal bearing sludge concentrate |
| 04/29/2004 | DE10247499A1 For the partial removal of material from the interior of a hollow body, the lower end of the shaping zone is sealed by a closure, and a chemical etching agent is fed into the required height over it |
| 04/28/2004 | CN1492804A Composite comprising aluminium alloy and resin and method for manufacturing the same |
| 04/28/2004 | CN1147621C Figure forming method |
| 04/27/2004 | US6727188 Etchant and method for fabricating a substrate for an electronic device using the same wherein the substrate includes a copper or copper alloy film |
| 04/27/2004 | US6727187 Fabrication method for semiconductor device |
| 04/27/2004 | US6727178 Etchant and method of etching |
| 04/27/2004 | US6726847 Silver stain removal by chemical etching and sonication |
| 04/27/2004 | US6726800 Ashing apparatus, ashing methods, and methods for manufacturing semiconductor devices |
| 04/22/2004 | WO2004034460A2 Method for eliminating voiding in plated solder |
| 04/22/2004 | WO2004033758A2 Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof |
| 04/22/2004 | US20040075396 Plasma processing method and apparatus |
| 04/22/2004 | US20040074870 Etching method and apparatus |
| 04/22/2004 | US20040074600 Wet etch system with overflow particle removing feature |
| 04/21/2004 | EP1411538A1 Method and device for focussed electron beam induced etching |
| 04/21/2004 | EP1411149A1 Process for stripping coatings from components |
| 04/21/2004 | CN1491429A Work treating method and treating device |
| 04/21/2004 | CN1490850A Dry etching method for gallium nitride materials |
| 04/21/2004 | CN1490431A Surface decorative pattern shaping method for article metal casing |
| 04/20/2004 | US6723649 Method of fabricating a semiconductor memory device |
| 04/20/2004 | US6723385 Process for the preliminary treatment of copper surfaces |
| 04/20/2004 | US6722376 Polysilicon etch useful during the manufacture of a semiconductor device |
| 04/15/2004 | WO2004032213A1 High frequency plasma generator and high frequency plasma generating method |
| 04/15/2004 | WO2004032194A2 Method and system for analyzing data from a plasma process |
| 04/15/2004 | WO2004032178A2 Plasma processing system and method |
| 04/15/2004 | WO2004031448A1 Aqueous composition for the chemical removal of metallic surfacing present on turbine blades, and its use |
| 04/15/2004 | WO2003107400A3 Acid etching mixture having reduced water content |
| 04/15/2004 | US20040072444 Etchant for wire, method of manufacturing wire using etchant, thin film transistor array panel including wire and manufacturing method thereof |
| 04/15/2004 | US20040072439 Chemical mechanical polishing composition and process |