| Patents for C23F 1 - Etching metallic material by chemical means (16,062) |
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| 02/05/2004 | US20040023430 Method for forming a micro-mechanical component in a semiconductor wafer, and a semiconductor wafer comprising a micro-mechanical component formed therein |
| 02/04/2004 | EP1386351A1 Method of wet etching a silicon and nitrogen containing material |
| 02/04/2004 | EP1386350A1 Method of wet etching an inorganic antireflection layer |
| 02/04/2004 | CN1473209A Method for removing lead from plated cylindrical article made of lead-containing copper alloy and metal fitting for hydrant, and method for preventing leaching of lead from article made of lead-contai |
| 02/04/2004 | CN1472362A Method for removing copper stannous and lead ions from used tin soldering liquid |
| 02/04/2004 | CN1472361A Etching agent and application for improving etching selectvie ratio |
| 02/04/2004 | CN1137287C Method for protecting sacrificial layer of movable structure in deep-reaction ion etching process |
| 01/29/2004 | WO2004010486A1 High temperature anisotropic etching of multi-layer structures |
| 01/29/2004 | WO2004009872A2 In-line demetallization process for flexible metallized substrates |
| 01/29/2004 | US20040018730 Effective solution and process to wet-etch metal-alloy films in semiconductor processing |
| 01/29/2004 | US20040018372 Etching substrate material, etching process and article obtained by etching |
| 01/29/2004 | US20040016876 Method of etching semiconductor device using neutral beam and apparatus for etching the same |
| 01/28/2004 | EP1384797A1 In-line demetallization process for flexible metallized substrates |
| 01/28/2004 | EP1383943A1 Method of plating and pretreating aluminium workpieces |
| 01/28/2004 | CN1470674A Nickel-containing iron trichloride etching effluent extraction and separation method |
| 01/28/2004 | CN1136336C Chemical removing technology for composite coating of aircraft engine steel blade before low temperature aluminizing |
| 01/27/2004 | US6683009 Method for local etching |
| 01/27/2004 | US6683007 Etching and cleaning methods and etching and cleaning apparatus used therefor |
| 01/27/2004 | US6683006 Film forming method and film forming apparatus |
| 01/22/2004 | DE10230252A1 Verfahren zur Herstellung integrierter Mikrosysteme A method for manufacturing integrated microsystems |
| 01/21/2004 | CN1469939A A method for wet etching |
| 01/21/2004 | CN1469918A Stabilized alkaline compositions for cleaning microelectronic substrates |
| 01/21/2004 | CN1468977A Residual polymer eliminating method |
| 01/20/2004 | US6680668 Fast heat rise resistor using resistive foil |
| 01/15/2004 | WO2004006298A2 Method and apparatus for non-invasive measurement and analysis of semiconductor process parameters |
| 01/15/2004 | WO2004006285A1 Method and apparatus for non-invasive measurement and analysis of plasma parameters |
| 01/15/2004 | US20040007063 Micro machined polymer beam structure method and resulting device for spring applications |
| 01/14/2004 | CN1468050A Method of manufacturing printed wiring board and printed wiring board obtained by the manufacturing method |
| 01/14/2004 | CN1134553C Fe-Ni alloy cathode cover semi-product with good etching perforation property and its preparing method |
| 01/13/2004 | US6677167 Wafer processing apparatus and a wafer stage and a wafer processing method |
| 01/13/2004 | US6676843 Magnetically patterning conductors |
| 01/13/2004 | US6676802 Remote exposure of workpieces using a plasma |
| 01/08/2004 | WO2004003969A2 Method and system for predicting process performance using material processing tool and sensor data |
| 01/08/2004 | WO2004003410A1 Sealable surface method and device |
| 01/08/2004 | WO2004003256A1 Anisotropic dry etching of cu-containing layers |
| 01/08/2004 | US20040005723 Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices |
| 01/08/2004 | US20040004724 Spin etcher with thickness measuring system |
| 01/07/2004 | CN1465746A Etching liquid for silver alloy |
| 01/06/2004 | US6673156 Semiconductor processing device |
| 01/06/2004 | US6671945 Method for making a resistor using resistive foil |
| 01/01/2004 | US20040002430 Using a time critical wafer cleaning solution by combining a chelating agent with an oxidizer at point-of-use |
| 01/01/2004 | US20040002213 Method for descreasing number of particles during etching process |
| 01/01/2004 | US20040000378 Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry |
| 12/31/2003 | WO2004000972A1 An etchant for a wiring, a method for manufacturing the wiring using the etchant, a thin film transistor array panel including the wiring, and a method for manufacturing the same |
| 12/31/2003 | CN1465216A Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| 12/25/2003 | US20030235997 Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching layer etching process based on near infrared spectrometer |
| 12/25/2003 | US20030234079 Plasma ashing/etching using solid sapphire disk |
| 12/24/2003 | WO2003107400A2 Acid etching mixture having reduced water content |
| 12/24/2003 | CN1131733C Soup treatment appts. |
| 12/23/2003 | US6666987 Mixtures of sulfuric acid, hydrogen peroxide and 5-amino tetrazole, used for cleaning or texturing surfaces of foils to improve acid resistance and bonding strength of multilayer printed circuits laminations |
| 12/23/2003 | US6666986 Mixtures of cleaning compounds used on semiconductor substrates |
| 12/18/2003 | WO2003104527A1 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
| 12/18/2003 | US20030230549 Method for etching chemically inert metal oxides |
| 12/18/2003 | US20030230548 Etching a silicon substrate using an aqueous acid mixture comprising hydrofluoric acid, reducing water content by adding fluorosulfonic acid, controlling the concentration of hydrogen fluoride |
| 12/18/2003 | CA2481133A1 Acidic solution for silver deposition and method for silver layer deposition on metal surfaces |
| 12/17/2003 | CN1461822A Stripping lqiuid nickel or nickel alloy |
| 12/17/2003 | CN1131340C Method for preventing contamination by lead from metallic piping devices |
| 12/16/2003 | US6664197 Process for etching thin-film layers of a workpiece used to form microelectronic circuits or components |
| 12/16/2003 | US6664128 Bump fabrication process |
| 12/16/2003 | US6664123 Method for etching metal layer on a scale of nanometers |
| 12/11/2003 | WO2003102540A2 Micro machined polymer beam structure method and resulting device for spring applications |
| 12/11/2003 | WO2003025971A3 Plasma processing apparatus with coil magnet system |
| 12/11/2003 | US20030226687 Method of manufacturing printed wiring board and printed wiring board obtained by the manufacturing method |
| 12/10/2003 | EP1369180A2 Spray nozzle and method of manufacturing the same |
| 12/10/2003 | EP0968322B1 Method and device for operating milling baths |
| 12/10/2003 | CN1461584A Improved adhesion of polymeric materials to metal surfaces |
| 12/10/2003 | CN1461493A Cleaning method and etching method |
| 12/10/2003 | CN1460892A Laser processing method and equipment |
| 12/10/2003 | CN1130474C Silicon etching liquid and its preparing method |
| 12/09/2003 | US6661162 Piezoelectric resonator and method of producing the same |
| 12/09/2003 | US6660655 Method and solution for preparing SEM samples for low-K materials |
| 12/09/2003 | US6660102 Method of decoating a turbine blade |
| 12/09/2003 | US6659111 Removing deposits from interior surfaces of metal apparatus used for forming metal or alloy films, by flowing mixtures of hydrogen fluoride and oxygen, then evacuating with inert gases |
| 12/04/2003 | WO2003100900A1 Bipolar plate assembly, fuel cell stacks and fuel cell systems incorporating the same |
| 12/04/2003 | WO2003100842A1 Conveying type substrate treating device |
| 12/04/2003 | US20030224610 Fabrication process for bonded wafer precision layer thickness control and its non-destructructive measurement method |
| 12/04/2003 | US20030224263 Process for producing precision metal components |
| 12/04/2003 | US20030222048 Method for manufacturing porous structure and method for forming pattern |
| 12/03/2003 | EP1366860A1 Non-destructive method for measuring the thickness of a bonded wafer |
| 12/03/2003 | EP1366510A2 Ruthenium silicide wet etch |
| 12/02/2003 | US6656370 Method for the manufacture of printed circuit boards |
| 12/02/2003 | US6656294 Method of reducing elution of lead in lead-containing copper alloy, and drinking water service fittings made of lead-containing copper alloy |
| 12/02/2003 | US6656279 Apparatus for the spray treatment of printed circuit boards |
| 12/02/2003 | CA2168013C Alkaline ammoniacal cupric chloride etching bath containing a copper (i) stabilizer |
| 11/27/2003 | US20030219639 Bipolar plate assembly, fuel cell stacks and fuel cell systems incorporating the same |
| 11/27/2003 | US20030218735 Stent manufacturing apparatus |
| 11/27/2003 | US20030217990 Enhanced endpoint detection for wet etch process control |
| 11/27/2003 | US20030217809 Laser machining method and apparatus |
| 11/26/2003 | EP1364398A1 Method for microfabricating structures using silicon-on-insulator material |
| 11/26/2003 | CN1128893C Corrosion apparatus |
| 11/25/2003 | US6653055 Forming printed circuits by selectively etching copper lamination by exposing photoresists and electrodeposited coatings to light |
| 11/25/2003 | US6652993 Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer |
| 11/20/2003 | US20030213773 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof |
| 11/20/2003 | US20030213771 Degreasing, then chemically etching with aqueous phosphoric acid compound to form magnesium phosphate coating |
| 11/20/2003 | US20030213553 Smooth copper surface is contacted with an adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer |
| 11/18/2003 | US6649081 Nitric acid, fluoroborate anions, hydrogen peroxide, propylene glycol and benzotriazole |
| 11/18/2003 | US6649077 Method and apparatus for removing coating layers from alignment marks on a wafer |
| 11/18/2003 | US6648503 Superconducting radiation detector; forming mechanically strong, thermal conductivity controlling membrane without cracks |
| 11/13/2003 | WO2003065419A3 Plasma etching of ni-containing materials |
| 11/13/2003 | US20030209521 Etching mixture of water soldium metatitanate, potassium titanate and sulfuric acid |