Patents for C23F 1 - Etching metallic material by chemical means (16,062)
10/2004
10/19/2004US6806206 Etching method and etching liquid
10/19/2004US6806034 Method of forming a conductive pattern on dielectric substrates
10/14/2004WO2004087281A2 Implementation of microfluidic components, including molecular fractionation devices, in a microfluidic system
10/14/2004US20040203243 Polysilicon etch useful during the manufacture of a semiconductor device
10/14/2004US20040203178 Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry
10/14/2004US20040202958 an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid; pretreating an insulating film to remove residual metals exposed by etching
10/14/2004US20040200806 Adding water to reduce concentration of phosphoric acid in the etching solution, causing silicon compound to precipitate, filtering to return the etching solution for reuse
10/14/2004US20040200801 Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process
10/14/2004US20040200575 wet etching system for substrates having regions covered with self-assembled monolayers (SAMs) composed of KCN/Oxygen; and a perfluoroalkylthiol nonpolar additive that has a higher affinity to the regions of said substrate covered with SAMs than to the other regions of said substrate.
10/14/2004DE10313517A1 Lösung zum Ätzen von Kupferoberflächen und Verfahren zum Abscheiden von Metall auf Kupferoberflächen Solution for etching copper surfaces and methods for depositing metal on copper surfaces
10/13/2004EP0815585B1 Preferential etch of semiconductor substrate with respect to epitaxial layers
10/13/2004CN1170909C Chemical mechanical plane of metal wiring
10/12/2004US6802952 Method for surface treatment of metal base
10/07/2004WO2004086143A2 Multi-step process for etching photomasks
10/07/2004WO2004085706A1 Solution for etching copper surfaces and method of depositing metal on copper surfaces
10/07/2004WO2004030013A8 Baffle plate in a plasma processing system
10/07/2004US20040199261 Surface treatment for a metal prosthesis
10/07/2004US20040198153 Wafer support system
10/07/2004US20040198066 Using supercritical fluids and/or dense fluids in semiconductor applications
10/07/2004US20040197261 Potassium hydrogen peroxymonosulfate solutions
10/07/2004US20040195209 Applying caustic solution then nitric acid; without damage to base metal from used turbine engine blade having a metal-based substrate and an aluminide coating
10/06/2004EP1465251A2 Method for producing metal/ceramic bonded substrate
10/06/2004EP1463630A1 Textured surface having undercut micro recesses in a surface
10/06/2004CN1535104A Device and method ofr mfg. printed wiring board
10/06/2004CN1534738A Wet-anisotropic etching of silicon
10/06/2004CN1534111A Method of recovering copper metal from waste printed circuit board and copper containing waste liquid and its device
10/06/2004CN1170004C Process for removing Ni from waste etching FeC13 solution containing Ni
10/05/2004US6801396 Substrate independent superpolishing process and slurry
10/05/2004US6800564 Etching solution for signal wire and method of fabricating thin film transistor array panel with the same
10/05/2004US6800210 Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
09/2004
09/30/2004WO2004084287A1 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
09/30/2004WO2004083485A2 Methods and apparatus for atomic layer deposition
09/30/2004US20040192052 Viscous protective overlayers for planarization of integrated circuits
09/29/2004EP1032726A4 Selective removal of material using self-initiated galvanic activity in electrolytic bath
09/29/2004CN2644434Y Automatic piece sending mechanism of etching machine
09/29/2004CN1532305A 蚀刻液管理方法和蚀刻液管理装置 The etching solution and the etching solution management method managing means
09/29/2004CN1168794C Composition for oxide CMP
09/28/2004US6797621 Etchant composition for molybdenum and method of using same
09/23/2004WO2004081257A1 Method for manufacturing utensil for drinking water system made from lead-containing copper alloy, cast and lead-removed utensil for drinking water system, and utensil for drinking water system
09/23/2004WO2004054699A3 Method for improving the interaction between a medium and a structural component
09/23/2004US20040182822 Plasma etching wherein the semiconductor wafer is heated to selectively controllable temperature zones; determining a first dimensional variation of etched features with respect to reference dimensions over predetermined areas of surface; determining operating temperatures, plasma etching
09/23/2004US20040182513 Measurement of etching
09/23/2004DE10308134A1 Surface treatment of installation components in lead-containing copper alloy used in preventing the leaching out of lead from lead containing copper alloy components of water treatment installations
09/22/2004EP1459882A1 Composite material of aluminum alloy and resin and production method therefor
09/22/2004EP1459845A1 Surface treatment of metal
09/22/2004CN1531155A Method for making structure of wedge chamber and parallel chamber in indium phosphide based photoelectronic device
09/22/2004CN1530466A Recovery of tin from waste liquid of tin and lead
09/22/2004CN1530465A Aqueous solution composition with metal surface treatment
09/21/2004US6794757 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement
09/21/2004US6794302 Dynamic feed forward temperature control to achieve CD etching uniformity
09/21/2004US6793838 Milling solution mixture of nitric and hydrofluoric acid, dissolved titanium, wetting agent and surfactant
09/21/2004US6793836 Puddle etching method of thin film by using spin-processor
09/21/2004US6793738 Method for processing acid treatment solution, solution processed thereby, and method for treating articles therewith
09/21/2004US6792957 Wet etching apparatus and method
09/16/2004WO2004030013A3 Baffle plate in a plasma processing system
09/16/2004US20040180799 Sulfuric acid and sodium metatitanate or potassium titanate in water; increasing adhesion to protective coating or corrosion resistant layer; applicable to aluminum or titanium metal or alloys, stainless steel; nontoxic
09/16/2004US20040178476 Etching metal using sonication
09/16/2004US20040177517 Microedged shaving surface and a method for making the same
09/16/2004DE10309711A1 Verfahren zum Einätzen von Strukturen in einem Ätzkörper mit einem Plasma Method for etching of structures in an etching body with a plasma
09/15/2004EP1289678A4 Process for improving the adhesion of polymeric materials to metal surfaces
09/15/2004CN1167110C Etching solution, etched article and method for etched article
09/15/2004CN1167106C Photoresist film removing method and device therefor
09/15/2004CN1166816C Process for regenerating waste etching liquid containing Ni and FeCl3 and recovering Ni
09/14/2004US6790786 Etching processes for integrated circuit manufacturing including methods of forming capacitors
09/14/2004US6790768 Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
09/14/2004US6790377 Method for electrochemical fabrication
09/14/2004US6790298 Depositing a sacrificial layer on a cleaned substrate, sputtering an amorphous shape memory alloy and depositing sputtered alloy in a thin film onto the sacrificial layer, applying chemical etchant to remove sacrificial layer
09/09/2004US20040173575 Method of releasing devices from a substrate
09/09/2004US20040173573 etching gas contains C4F6 gas and O2 gas, and the ratio C4F6/O2 of the C4F6 gas to the O2 gas falls within a range of 0.7 and 1.5
09/09/2004US20040173309 Plasma processing apparatus and plasma processing method
09/08/2004EP0980092B1 Vacuum processing method
09/07/2004US6787408 Method for forming an electrical insulating layer on bit lines of the flash memory
09/07/2004US6786632 Calorimeter and manufacturing method thereof
09/02/2004WO2004075277A1 Method of etching, etching apparatus and process for producing semiconductor device
09/02/2004WO2004073893A2 Gas gate for isolating regions of differing gaseous pressure
09/02/2004US20040169013 Using a acid
09/02/2004US20040169010 Using water vapor to removal impurities; etching titanium nitride film using photoresist as masking; using oxygen, nitrogen as ashing gases; then water
09/02/2004US20040168771 Layout of electromagnets positioning on edges of plasma enclosure; impacting particles; controlling distribution of current signals
09/01/2004EP1089884A4 Method and apparatus for manufacturing cylindrical articles
08/2004
08/31/2004US6783694 Remove materials in the presence of cobalt silicide
08/31/2004US6783690 Method of stripping silver from a printed circuit board
08/26/2004WO2004073025A2 Methods of reducing photoresist distortion while etching in a plasma processing system
08/26/2004WO2004071722A1 Microedged shaving surface and a method for making the same
08/26/2004US20040167633 Metallic implants having roughened surfaces and methods for producing the same
08/26/2004US20040167632 Metallic implants having roughened surfaces and methods for producing the same
08/26/2004US20040166598 processing method
08/26/2004US20040163762 Plasma treating device and substrate mounting table
08/26/2004US20040163669 Cleaning chamber surfaces to recover metal-containing compounds
08/25/2004EP1449544A1 Metallic implants having roughened surfaces and methods for producing the same
08/25/2004EP1299575B1 Acidic treatment liquid and method of treating copper surfaces
08/25/2004EP1029117B1 Method for separating layers from articles
08/24/2004US6780784 Etchant is hydrogen peroxide (h2o2), and a mixed solution including at least one of an organic acid, an inorganic acid, and a neutral salt; for liquid crystal display devices having copper lines
08/24/2004US6780773 Method of chemical mechanical polishing with high throughput and low dishing
08/24/2004US6780751 Method for eliminating voiding in plated solder
08/24/2004US6780277 Etching method and etching apparatus
08/24/2004US6779713 Joining of composite beryllium-aluminum parts
08/19/2004WO2004070812A1 Method for manufacturing semi-transparent semi-reflective electrode substrate, reflective element substrate, method for manufacturing same, etching composition used for the method for manufacturing the reflective electrode substrate
08/19/2004WO2003043747A8 Manufacture having double sided features in a metal-containing web formed by etching
08/19/2004US20040161545 Adhesion method
08/19/2004US20040160700 Pattern forming method, method of manufacturing magneto-resistive device and magnetic head using same, and head suspension assembly and magnetic disk apparatus