Patents for C23F 1 - Etching metallic material by chemical means (16,062) |
---|
10/19/2004 | US6806206 Etching method and etching liquid |
10/19/2004 | US6806034 Method of forming a conductive pattern on dielectric substrates |
10/14/2004 | WO2004087281A2 Implementation of microfluidic components, including molecular fractionation devices, in a microfluidic system |
10/14/2004 | US20040203243 Polysilicon etch useful during the manufacture of a semiconductor device |
10/14/2004 | US20040203178 Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry |
10/14/2004 | US20040202958 an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid; pretreating an insulating film to remove residual metals exposed by etching |
10/14/2004 | US20040200806 Adding water to reduce concentration of phosphoric acid in the etching solution, causing silicon compound to precipitate, filtering to return the etching solution for reuse |
10/14/2004 | US20040200801 Manufacture having double sided features in a metal-containing web and manufacture and method for forming same in a liquid-based etch process |
10/14/2004 | US20040200575 wet etching system for substrates having regions covered with self-assembled monolayers (SAMs) composed of KCN/Oxygen; and a perfluoroalkylthiol nonpolar additive that has a higher affinity to the regions of said substrate covered with SAMs than to the other regions of said substrate. |
10/14/2004 | DE10313517A1 Lösung zum Ätzen von Kupferoberflächen und Verfahren zum Abscheiden von Metall auf Kupferoberflächen Solution for etching copper surfaces and methods for depositing metal on copper surfaces |
10/13/2004 | EP0815585B1 Preferential etch of semiconductor substrate with respect to epitaxial layers |
10/13/2004 | CN1170909C Chemical mechanical plane of metal wiring |
10/12/2004 | US6802952 Method for surface treatment of metal base |
10/07/2004 | WO2004086143A2 Multi-step process for etching photomasks |
10/07/2004 | WO2004085706A1 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
10/07/2004 | WO2004030013A8 Baffle plate in a plasma processing system |
10/07/2004 | US20040199261 Surface treatment for a metal prosthesis |
10/07/2004 | US20040198153 Wafer support system |
10/07/2004 | US20040198066 Using supercritical fluids and/or dense fluids in semiconductor applications |
10/07/2004 | US20040197261 Potassium hydrogen peroxymonosulfate solutions |
10/07/2004 | US20040195209 Applying caustic solution then nitric acid; without damage to base metal from used turbine engine blade having a metal-based substrate and an aluminide coating |
10/06/2004 | EP1465251A2 Method for producing metal/ceramic bonded substrate |
10/06/2004 | EP1463630A1 Textured surface having undercut micro recesses in a surface |
10/06/2004 | CN1535104A Device and method ofr mfg. printed wiring board |
10/06/2004 | CN1534738A Wet-anisotropic etching of silicon |
10/06/2004 | CN1534111A Method of recovering copper metal from waste printed circuit board and copper containing waste liquid and its device |
10/06/2004 | CN1170004C Process for removing Ni from waste etching FeC13 solution containing Ni |
10/05/2004 | US6801396 Substrate independent superpolishing process and slurry |
10/05/2004 | US6800564 Etching solution for signal wire and method of fabricating thin film transistor array panel with the same |
10/05/2004 | US6800210 Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants |
09/30/2004 | WO2004084287A1 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry |
09/30/2004 | WO2004083485A2 Methods and apparatus for atomic layer deposition |
09/30/2004 | US20040192052 Viscous protective overlayers for planarization of integrated circuits |
09/29/2004 | EP1032726A4 Selective removal of material using self-initiated galvanic activity in electrolytic bath |
09/29/2004 | CN2644434Y Automatic piece sending mechanism of etching machine |
09/29/2004 | CN1532305A 蚀刻液管理方法和蚀刻液管理装置 The etching solution and the etching solution management method managing means |
09/29/2004 | CN1168794C Composition for oxide CMP |
09/28/2004 | US6797621 Etchant composition for molybdenum and method of using same |
09/23/2004 | WO2004081257A1 Method for manufacturing utensil for drinking water system made from lead-containing copper alloy, cast and lead-removed utensil for drinking water system, and utensil for drinking water system |
09/23/2004 | WO2004054699A3 Method for improving the interaction between a medium and a structural component |
09/23/2004 | US20040182822 Plasma etching wherein the semiconductor wafer is heated to selectively controllable temperature zones; determining a first dimensional variation of etched features with respect to reference dimensions over predetermined areas of surface; determining operating temperatures, plasma etching |
09/23/2004 | US20040182513 Measurement of etching |
09/23/2004 | DE10308134A1 Surface treatment of installation components in lead-containing copper alloy used in preventing the leaching out of lead from lead containing copper alloy components of water treatment installations |
09/22/2004 | EP1459882A1 Composite material of aluminum alloy and resin and production method therefor |
09/22/2004 | EP1459845A1 Surface treatment of metal |
09/22/2004 | CN1531155A Method for making structure of wedge chamber and parallel chamber in indium phosphide based photoelectronic device |
09/22/2004 | CN1530466A Recovery of tin from waste liquid of tin and lead |
09/22/2004 | CN1530465A Aqueous solution composition with metal surface treatment |
09/21/2004 | US6794757 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement |
09/21/2004 | US6794302 Dynamic feed forward temperature control to achieve CD etching uniformity |
09/21/2004 | US6793838 Milling solution mixture of nitric and hydrofluoric acid, dissolved titanium, wetting agent and surfactant |
09/21/2004 | US6793836 Puddle etching method of thin film by using spin-processor |
09/21/2004 | US6793738 Method for processing acid treatment solution, solution processed thereby, and method for treating articles therewith |
09/21/2004 | US6792957 Wet etching apparatus and method |
09/16/2004 | WO2004030013A3 Baffle plate in a plasma processing system |
09/16/2004 | US20040180799 Sulfuric acid and sodium metatitanate or potassium titanate in water; increasing adhesion to protective coating or corrosion resistant layer; applicable to aluminum or titanium metal or alloys, stainless steel; nontoxic |
09/16/2004 | US20040178476 Etching metal using sonication |
09/16/2004 | US20040177517 Microedged shaving surface and a method for making the same |
09/16/2004 | DE10309711A1 Verfahren zum Einätzen von Strukturen in einem Ätzkörper mit einem Plasma Method for etching of structures in an etching body with a plasma |
09/15/2004 | EP1289678A4 Process for improving the adhesion of polymeric materials to metal surfaces |
09/15/2004 | CN1167110C Etching solution, etched article and method for etched article |
09/15/2004 | CN1167106C Photoresist film removing method and device therefor |
09/15/2004 | CN1166816C Process for regenerating waste etching liquid containing Ni and FeCl3 and recovering Ni |
09/14/2004 | US6790786 Etching processes for integrated circuit manufacturing including methods of forming capacitors |
09/14/2004 | US6790768 Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects |
09/14/2004 | US6790377 Method for electrochemical fabrication |
09/14/2004 | US6790298 Depositing a sacrificial layer on a cleaned substrate, sputtering an amorphous shape memory alloy and depositing sputtered alloy in a thin film onto the sacrificial layer, applying chemical etchant to remove sacrificial layer |
09/09/2004 | US20040173575 Method of releasing devices from a substrate |
09/09/2004 | US20040173573 etching gas contains C4F6 gas and O2 gas, and the ratio C4F6/O2 of the C4F6 gas to the O2 gas falls within a range of 0.7 and 1.5 |
09/09/2004 | US20040173309 Plasma processing apparatus and plasma processing method |
09/08/2004 | EP0980092B1 Vacuum processing method |
09/07/2004 | US6787408 Method for forming an electrical insulating layer on bit lines of the flash memory |
09/07/2004 | US6786632 Calorimeter and manufacturing method thereof |
09/02/2004 | WO2004075277A1 Method of etching, etching apparatus and process for producing semiconductor device |
09/02/2004 | WO2004073893A2 Gas gate for isolating regions of differing gaseous pressure |
09/02/2004 | US20040169013 Using a acid |
09/02/2004 | US20040169010 Using water vapor to removal impurities; etching titanium nitride film using photoresist as masking; using oxygen, nitrogen as ashing gases; then water |
09/02/2004 | US20040168771 Layout of electromagnets positioning on edges of plasma enclosure; impacting particles; controlling distribution of current signals |
09/01/2004 | EP1089884A4 Method and apparatus for manufacturing cylindrical articles |
08/31/2004 | US6783694 Remove materials in the presence of cobalt silicide |
08/31/2004 | US6783690 Method of stripping silver from a printed circuit board |
08/26/2004 | WO2004073025A2 Methods of reducing photoresist distortion while etching in a plasma processing system |
08/26/2004 | WO2004071722A1 Microedged shaving surface and a method for making the same |
08/26/2004 | US20040167633 Metallic implants having roughened surfaces and methods for producing the same |
08/26/2004 | US20040167632 Metallic implants having roughened surfaces and methods for producing the same |
08/26/2004 | US20040166598 processing method |
08/26/2004 | US20040163762 Plasma treating device and substrate mounting table |
08/26/2004 | US20040163669 Cleaning chamber surfaces to recover metal-containing compounds |
08/25/2004 | EP1449544A1 Metallic implants having roughened surfaces and methods for producing the same |
08/25/2004 | EP1299575B1 Acidic treatment liquid and method of treating copper surfaces |
08/25/2004 | EP1029117B1 Method for separating layers from articles |
08/24/2004 | US6780784 Etchant is hydrogen peroxide (h2o2), and a mixed solution including at least one of an organic acid, an inorganic acid, and a neutral salt; for liquid crystal display devices having copper lines |
08/24/2004 | US6780773 Method of chemical mechanical polishing with high throughput and low dishing |
08/24/2004 | US6780751 Method for eliminating voiding in plated solder |
08/24/2004 | US6780277 Etching method and etching apparatus |
08/24/2004 | US6779713 Joining of composite beryllium-aluminum parts |
08/19/2004 | WO2004070812A1 Method for manufacturing semi-transparent semi-reflective electrode substrate, reflective element substrate, method for manufacturing same, etching composition used for the method for manufacturing the reflective electrode substrate |
08/19/2004 | WO2003043747A8 Manufacture having double sided features in a metal-containing web formed by etching |
08/19/2004 | US20040161545 Adhesion method |
08/19/2004 | US20040160700 Pattern forming method, method of manufacturing magneto-resistive device and magnetic head using same, and head suspension assembly and magnetic disk apparatus |