Patents for C23F 1 - Etching metallic material by chemical means (16,062)
04/2004
04/15/2004US20040072416 Method for eliminating voiding in plated solder
04/15/2004US20040071873 Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof
04/15/2004US20040069528 Process for producing ceramic circuit boards
04/15/2004US20040069408 Dual-port end point window for plasma etcher
04/15/2004US20040069318 Prior to cleaning with XeF2, contacting XeF2 gas with an article to be cleaned, such as a semiconductor, in a reduced-pressure or vacuum atmosphere containing a required amount of water to form HFto be
04/15/2004DE10244399A1 Repairing quartz defects, especially quartz bumps, on alternating phase masks, employs both mechanical- and etching stages
04/15/2004CA2501304A1 Aqueous composition for the chemical removal of metallic surfacing present on turbine blades, and its use
04/14/2004EP1408725A1 Process for producing ceramic circuit boards
04/14/2004EP0963419B1 Composition for oxide cmp
04/14/2004CN2612076Y Supermicro type thermocouple electrochemical preparation device
04/14/2004CN1489161A Method for removing residual copper of aluminium corroding foil surface of negative electrode for aluminium electrolytic capacitor
04/14/2004CN1488779A Multipurpose laser electrochemical micromanufacturing apparatus
04/14/2004CN1145716C Corrosive solution of passivated laminated point
04/13/2004US6720720 Color selection electrode, method of producing color selection electrode and cathode ray tube.
04/13/2004US6720522 Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining
04/13/2004US6719892 Selective removal of brazing compound from joined assemblies
04/08/2004WO2004030049A2 A method and system for etching high-k dielectric materials
04/08/2004WO2004030013A2 Baffle plate in a plasma processing system
04/08/2004WO2003027647A9 Method and apparatus for real-time dynamic chemical analysis
04/08/2004US20040067651 comprises an organometallic-modified colloidal abrasive and a nitrogen-containing polymer; stable even under acidic conditions and has high selectivity for removal of metal in relation to barrier layer and dielectric materials during polishing of substrates comprised of metal and dielectric material
04/08/2004US20040065931 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
04/08/2004US20040065863 Aqueous solution of titanate and sulfuric acid as etching mixture
04/08/2004US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues
04/08/2004US20040065552 Method for electrochemical fabrication
04/07/2004CN1488167A Viscous protective overlayers for planarization of integrated circuits
04/06/2004US6716402 Oxidation of ruthenium deposits in circuits of nuclear fuel reprocessing plants using perruthenate solution
04/06/2004US6716298 Method and apparatus for measuring and dispensing a wafer etchant
04/06/2004US6716281 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
04/01/2004WO2004027840A2 Process for etching silicon wafers
04/01/2004WO2004027810A2 System and method for removal of materials from an article
04/01/2004WO2004026096A2 Viewing window cleaning apparatus
04/01/2004US20040063315 Method of dry etching a semiconductor device in the absence of a plasma
04/01/2004US20040063309 Selectively-etched nanochannel electrophoretic and electrochemical devices
04/01/2004US20040062943 Composite material of aluminum alloy and resin and production method therefor
04/01/2004US20040061199 Etching metal using sonication
04/01/2004US20040060905 Etching method for making fluid bearings
04/01/2004US20040060658 Method and apparatus for an improved baffle plate in a plasma processing system
03/2004
03/31/2004EP1403907A1 Regeneration process of etching solution, etching process, and etching system
03/31/2004EP1402084A1 Method for making a mesh-and-plate surgical implant
03/25/2004WO2004024987A1 Method of treatment for reducing elution of lead from lead containing copper alloy and waterwork utensils made from lead containing copper alloy
03/25/2004WO2003027359A3 External counter electrode and method for chemical milling and cleaning metal
03/25/2004US20040056000 Surface processing method for a molded metal housing
03/25/2004US20040055127 Piezoelectric resonator and method of producing the same
03/25/2004DE19716480B4 Verfahren zum Herstellen einer Vorrichtung mit einem Hohlraum zur Aufnahme eines Lichtwellenleiters A method of manufacturing a device having a cavity for receiving an optical fiber
03/25/2004DE10341878A1 Method for separating and recycling aluminum plastic (paper) composite packaging material - comprises using an acid solution containing nitric acid to soak an aluminum plastic (paper) composite packaging material; etc.
03/23/2004US6709979 Method of manufacturing a semiconductor device
03/23/2004US6709610 Isotropic dry cleaning process for noble metal integrated circuit structures
03/23/2004US6709528 Surface treatments to improve corrosion resistance of austenitic stainless steels
03/18/2004WO2004022817A1 Method for preventing elution of lead and/or nickel from copper alloy piping material such as valve or pipe joint and copper alloy piping material, and fluid for use in cleaning piping material
03/18/2004WO2004009872A3 In-line demetallization process for flexible metallized substrates
03/18/2004US20040053508 Etching and cleaning methods and etching and cleaning apparatuses used therefor
03/18/2004US20040053506 High temperature anisotropic etching of multi-layer structures
03/18/2004US20040050816 Forming pattern using graft polymer containing metal particles; overcoating substrates; removal polymer
03/17/2004EP1397533A1 Method and device for locally removing coatings from parts
03/17/2004EP0706582B2 Improved compositions and methods for polishing
03/16/2004US6706207 Aqueous sulfuric acid and sodium metatitanate or potassium titanate; nontoxic; environment, health
03/16/2004US6706204 Method of fabricating and a device that includes nanosize pores having well controlled geometries
03/11/2004WO2004021425A1 Method of etching and etching apparatus
03/11/2004US20040048486 Method for roughening copper surfaces for bonding to substrates
03/11/2004US20040047759 Aluminium alloy for lithographic sheet
03/11/2004US20040046148 Composition for chemical mechanical planarization of copper, tantalum and tantalum nitride
03/11/2004US20040045936 Chemical milling of gas turbine engine blisks
03/11/2004US20040045930 Method for etching
03/10/2004EP1396557A1 Metal cleaning composition and process
03/10/2004CN1480779A Method of forming metal wire of LCD device
03/10/2004CN1480560A Multiple etching technique for imitating cast copper, and its products
03/10/2004CN1480556A Double-frequency vacuum sediment equipment having radiofrequency power supply feeding unit
03/09/2004US6703291 Selective NiGe wet etch for transistors with Ge body and/or Ge source/drain extensions
03/04/2004WO2004019398A1 Magnetron plasma-use magnetic field generation device
03/04/2004WO2004019397A1 Plasma processing device
03/04/2004WO2002079542A8 Improved adhesion of polymeric materials to metal surfaces
03/04/2004US20040040933 Wafer processing apparatus and a wafer stage and a wafer processing method
03/04/2004US20040040661 Load port capable of coping with different types of cassette containing substrates to be processed
03/03/2004EP1392888A1 Method for operating an aluminium pickling bath
03/03/2004CN1479565A 布线基板及其制造方法 Wiring board and manufacturing method thereof
03/03/2004CN1140654C Selective chemical corrosion method to Si in Si/Ge structure
03/03/2004CN1140653C Method for producing cutter
03/03/2004CN1140652C Surface-treated article of magnesium or magnesium alloy, method of surface preparation and method of coating
03/02/2004US6699398 Effective dry etching process of actinide oxides and their mixed oxides in CF4/O2/N2 plasma
02/2004
02/26/2004US20040037343 Calorimeter and manufacturing method thereof
02/26/2004US20040036835 Method for forming metal line of liquid crystal display device
02/26/2004US20040035821 Methods for forming and releasing microelectromechanical structures
02/26/2004US20040035717 Electrolysis reduction by the cathode, electrochemical process by dipping in an acidic solution, etching chromium-based undercoatings away; forming a carrier tape for semiconductor chips
02/26/2004US20040035448 Selective treatment of microelectronic workpiece surfaces
02/25/2004EP1392092A1 COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET AND METHOD OF PRODUCING PRINTED WIRING BOARD USING THE COPPER PLATED CIRCUIT LAYER−CARRYING COPPER CLAD LAMINATED SHEET
02/25/2004CN1477231A Method for suspension etching one face of film
02/24/2004US6696358 Viscous protective overlayers for planarization of integrated circuits
02/19/2004US20040031503 Substrate treatment apparatus and substrate treatment method
02/19/2004DE10226328B3 Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen Acidic solution for silver deposition and process for depositing silver layers on metal surfaces
02/18/2004CN1476489A Etchant composition
02/17/2004US6692628 Process to remove ferric iron impurities from an acidic aqueous solution used in the electro-winning of copper
02/17/2004US6692576 Wafer support system
02/12/2004US20040026360 Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrument
02/12/2004US20040026359 Method and apparatus for etching-manufacture of cylindrical elements
02/10/2004US6689692 Composition for oxide CMP
02/10/2004US6689426 Photochemically; using a capillary method to apply liquid to surface; laser; making fluoroplastic surface adhesive
02/10/2004US6689222 Sealable surface method and device
02/10/2004US6689159 Expandable stents and method for making same
02/05/2004WO2004012221A2 Method for adjusting voltage on a powered faraday shield
02/05/2004US20040023494 Selective treatment of microelectronic workpiece surfaces