Patents
Sitemap › C23 - Coating metallic material; Coating material with metallic material; Chemical surface treatment; Diffusion treatment of metallic material; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general; Inhibiting corrosion of metallic material or incrustation in general › C23C - Coating metallic material; Coating material with metallic material; Surface treatment of metallic material by diffusion into the surface, by chemical conversion or substitution; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general › C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
05/2003
05/28/2003EP1314795A1 Sputtering target producing few particles
05/28/2003EP1314794A1 Soft metal and method of manufacturing the soft metal, and decorative part and method of manufacturing the decorative part
05/28/2003EP1314793A1 Titanium dioxide cobalt magnetic film and its manufacturing method
05/28/2003EP1314790A2 Cemented carbide with binder phase enriched surface zone
05/28/2003EP1313889A1 Method and device for continuous cold plasma deposition of metal coatings
05/28/2003EP1313798A2 Multilayer polymeric structure for enhanced gas and uv barrier
05/28/2003EP0762943B1 Radiation cured island coating system
05/28/2003CN2552944Y Vacuum film-coating axial motion controller
05/28/2003CN2552943Y Optical film thickness on line real time monitor
05/28/2003CN2552942Y Tubular aluminium material for vacuum coating film
05/28/2003CN1420943A Hydrogenating layer of antireflection coating
05/28/2003CN1420202A Process for mfg. MgO film
05/28/2003CN1420201A Method for mfg. functional MgO film
05/27/2003US6570172 Magnetron negative ion sputter source
05/27/2003US6570166 Operation method of ion source and ion beam irradiation apparatus
05/27/2003US6570085 Electromagnetic interference shield for electronic devices
05/27/2003US6569783 Graded composition diffusion barriers for chip wiring applications
05/27/2003US6569751 Low via resistance system
05/27/2003US6569295 Depositing a layer of filler material on the surface, covering the surface irregularities and etching the layer of filler material by directing particles at an oblique incident angle at the layer of filler material
05/27/2003US6569294 Sputtering target assembly and method for depositing a thickness gradient layer with narrow transition zone
05/27/2003US6569293 Titanium/boron thin films contain no morphological growth features such as those which accompany physical vapor deposition processes; for optical coatings
05/27/2003US6569270 Process for producing a metal article
05/22/2003WO2003043067A1 Apparatus for manufacturing organic electro-luminescent light emitting devices for mass production
05/22/2003WO2003043066A2 Layered structures
05/22/2003WO2003043052A1 Magnet array in conjunction with rotating magnetron for plasma sputtering
05/22/2003WO2003042424A1 Self-ionized and inductively-coupled plasma for sputtering and resputtering
05/22/2003WO2003042423A1 Apparatus
05/22/2003WO2003042421A1 High-purity aluminum sputter targets
05/22/2003WO2003018863A3 Method for producing a fluorescent material layer
05/22/2003US20030096711 Made with magnesium and boron ejected from magnesium target and boron target each in simultaneously sputtering process; film can be applied to fabricate integrated circuit without high temperature annealing
05/22/2003US20030096508 Reactive sputtering a metal oxide layer from a target of the metal onto the substrate characterised in that the support is biased to induce a direct current (DC) voltage across the depositing dielectric as it forms; making capacitors
05/22/2003US20030096077 Thermally-assisted magnetic recording disk with multilayered thermal barrier
05/22/2003US20030094366 Plasma processing apparatus with real-time particle filter
05/22/2003US20030094365 Facing-targets-type sputtering apparatus
05/22/2003US20030094362 Source for vacuum treatment process
05/21/2003EP1313140A1 Method of forming a liner for tungsten plugs
05/21/2003EP1313134A1 Semiconductor polysilicon component and method of manufacture thereof
05/21/2003EP1312695A1 Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles
05/21/2003EP1312586A1 Optical coating for UV applications
05/21/2003EP1311712A2 Method for increasing compression stress or reducing internal tension stress of a cvd, pcvd or pvd layer and cutting insert for machining
05/21/2003EP1311595A2 Multilayer polymeric/inorganic oxide structure for enhanced gas or vapor barrier
05/21/2003EP1261488A4 Method for producing desired tantalum phase
05/21/2003EP1204622B1 Silicon nitride components with protective coating
05/21/2003EP1017872B1 Device for applying layers of hard material by sputtering
05/21/2003CN1419608A Method of diffusion bonding targets to backing plates
05/21/2003CN1109127C Non-balance plane magnetic controlled sputtering cathode and film plating device thereof
05/21/2003CN1109126C White decorative part and process for producing the same
05/21/2003CN1109125C Method for forming Fe-W-Mo-Co type alloying surface on ferrous based work piece
05/21/2003CN1109124C Surface metallurgical teechnology to preciptate hardened stainless steel coating
05/20/2003US6567258 High temperature electrostatic chuck
05/20/2003US6567219 Laser irradiation apparatus
05/20/2003US6566661 Ion implanter with wafer angle and faraday alignment checking
05/20/2003US6566259 Integrated deposition process for copper metallization
05/20/2003US6566247 Electronic devices with composite atomic barrier film and process for making same
05/20/2003US6566175 Method of manufacturing gate insulated field effect transistors
05/20/2003US6566161 Tantalum sputtering target and method of manufacture
05/20/2003US6565892 Synergistic fungicidal composition comprising a compound analogous to strobilurin
05/20/2003US6565720 Determination dielectric end-point
05/20/2003US6565719 Magnetic disk comprising a first carbon overcoat having a high SP3 content and a second carbon overcoat having a low SP3 content
05/15/2003WO2003041453A1 Inorganic material evaporation apparatus
05/15/2003WO2003041138A2 Sintered polycrystalline gallium nitride
05/15/2003WO2003041113A1 Magnetron sputtering device
05/15/2003WO2003040783A1 Method for forming thin film on synthetic resin and multilayer film
05/15/2003WO2003040782A1 Display device and reflection preventing substrate
05/15/2003WO2003040429A1 Method for producing a continuous coating at the surface of a component
05/15/2003WO2003040428A1 Method and apparatus for multi-target sputtering
05/15/2003WO2003040427A1 Thin film deposition by laser irradiation
05/15/2003WO2003040426A1 Zinc oxide layer and method for the production thereof
05/15/2003WO2002101113A9 Method and device for treating a substrate
05/15/2003WO2002041363A3 System and methods for laser assisted deposition
05/15/2003US20030092282 Susceptor of apparatus for manufacturing semiconductor device
05/15/2003US20030092264 Substrate processing apparatus and method
05/15/2003US20030091871 A sputtered inorganic coatings having high barrier properties and high translucency with no safety and health problems; a nitride or oxynitride of aluminum film protecting from moisture, oxygen and carbon dioxide gas, the heat
05/15/2003US20030091870 Method of forming a liner for tungsten plugs
05/15/2003US20030091798 Layered thin-film media for perpendicular magnetic recording
05/15/2003US20030091738 High speed conveying substrate; controlling microstructure
05/15/2003US20030091500 Magnetic recording media
05/15/2003US20030090195 Application of multi-layer antistatic/antireflective coating to video display screen by sputtering
05/15/2003US20030089602 Semiconductor device, method of fabricating the same, and supttering apparatus
05/15/2003US20030089601 Magnet array in conjunction with rotating magnetron for plasma sputtering
05/15/2003US20030089597 Method of depositing a TaN seed layer
05/15/2003US20030089482 Process for producing a tube-shaped cathode sputtering target
05/15/2003US20030089430 Charge transfer compounds comprising polymers such as polyvinylpyridine and/or copolymers coupled to osmium compounds, used as biosensors in redox systems
05/15/2003US20030089429 Textured-grain-powder metallurgy tantalum sputter target
05/15/2003DE10152211C1 Layer system used for transparent substrates comprises a partial layer of a mixed oxide of zinc oxide, titanium oxide and a further oxide, and further metal and/or oxide layers with functional silver layers
05/14/2003EP1310979A2 Plasma impedance controlling device
05/14/2003EP1310580A2 Hard layer-coated tool
05/14/2003EP1309736A1 Sputtering target
05/14/2003EP1309733A2 Chromium-containing cemented carbide body having a surface zone of binder enrichment
05/14/2003EP1232293B1 Method for regulating sputtering processes
05/14/2003EP1144722B1 Improved corrosion resistant coating
05/14/2003EP1044459B1 Plasma device including a powered non-magnetic metal member between a plasma ac excitation source and the plasma
05/14/2003EP0871843B1 Mounting member and method for clamping a flat thin conductive workpiece
05/14/2003EP0748260B1 Ion beam process for deposition of highly abrasion-resistant coatings
05/14/2003CN2550376Y Multifunction device for plasma and laser beam combined treatment material
05/14/2003CN1418150A Method for producing desired tantalum phase
05/14/2003CN1417374A Film forming equipment and method
05/14/2003CN1417373A Sputtering equipment and film forming method
05/14/2003CN1417372A 阴极溅镀装置 Cathode sputtering apparatus
05/14/2003CN1108390C Magnetic alloy and magnetic recording medium and target for forming magnetic film and magnetic recording device
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