| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
|---|
| 03/12/2003 | EP1291404A1 Optical adhesive composition and optical apparatus |
| 03/12/2003 | EP1290211A2 Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 03/12/2003 | CN1401723A Adhesive for mutual inductor, and preparing method thereof |
| 03/12/2003 | CN1401720A Binding thin film for semiconductor, lead wire frame using same and semiconductor device |
| 03/06/2003 | WO2003018703A1 Adhesive sheet and semiconductor device and process for producing the same |
| 03/06/2003 | WO2003018688A1 Paintable material |
| 03/06/2003 | US20030045635 Polysilazane-modified polyamine hardeners for epoxy resins |
| 03/05/2003 | CN1400993A Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| 03/04/2003 | US6528169 No-flow flux adhesive compositions |
| 03/04/2003 | US6526959 Adhesive sheet for noise and shock absorption, and saw blade making use of it, and manufacturing methods therefor |
| 02/27/2003 | WO2003017363A1 Adhesive tape |
| 02/27/2003 | WO2003016369A1 Microcapsules, method for the production thereof and their use in adhesives |
| 02/27/2003 | WO2003015909A1 Method for the production of microcapsules |
| 02/27/2003 | US20030040578 Electrode-forming compositions and electrode members |
| 02/26/2003 | CN1399698A 起皱粘合剂 Creping adhesive |
| 02/26/2003 | CN1399662A Formulation for strippable adhesive and coating films and high preformance adhesives |
| 02/26/2003 | CN1398809A Method of raising adhesion strength and endurance of joint for ion-doped glass part |
| 02/25/2003 | US6524711 Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition |
| 02/20/2003 | WO2003015218A1 Batch electrically connecting sheet |
| 02/20/2003 | CA2453336A1 Batch electrically connecting sheet |
| 02/18/2003 | US6521732 Epoxy/acrylic terpolymer self-fixturing adhesive |
| 02/13/2003 | US20030029559 Adhesive for connecting electrodes and adhesion methods with the use of the same |
| 02/12/2003 | CN1396938A 环氧树脂组合物 The epoxy resin composition |
| 02/06/2003 | US20030026979 Sheet-form, curable pressure-sensitive adhesive |
| 02/05/2003 | EP1280868A1 Rigid substrate lamination adhesive |
| 02/05/2003 | EP1280842A1 Aqueous two-component cross-linkable composition |
| 02/05/2003 | CN1395604A Adhensive film for semiconductor, lead frame with adhensive film for semiconductor and semiconductor device using the same |
| 02/05/2003 | CN1395259A Conducting paste and semiconductor prepared by using said paste |
| 02/04/2003 | US6515048 Adhesive powder |
| 02/04/2003 | US6515045 For temporarily bonding a removable flexible substrate to a rigid permanent substrate |
| 01/30/2003 | WO2003008514A1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 01/29/2003 | EP1279709A1 Method of bonding adherend |
| 01/29/2003 | EP1279688A1 Quick cure carbon fiber reinforced epoxy resin |
| 01/29/2003 | EP1278801A2 Formulation for strippable adhesive and coating films |
| 01/29/2003 | EP0915753B1 Siloxane-modified adhesive/adherend systems |
| 01/23/2003 | US20030017346 Layer of an ion-migration retarding material non-releasably attached between the glass surface and the adhesive |
| 01/23/2003 | US20030017342 Optical adhesive composition and optical device |
| 01/23/2003 | US20030017341 Adhesives and adhesive compositions containing thioether groups |
| 01/23/2003 | US20030017327 High adhesion triple layered anisotropic conductive adhesive film |
| 01/22/2003 | EP1277778A2 Stabilized cationically-curable compositions |
| 01/22/2003 | EP1277777A2 Stabilized cationically-curable compositions |
| 01/22/2003 | EP1276812A2 Non-aqueous solvent-free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 01/22/2003 | EP1153098A4 Method for fabricating an optical device using purified adhesives in the optical path |
| 01/22/2003 | CN1392214A Stripping film and adhesive film using stripping film |
| 01/19/2003 | CA2393835A1 Method for enhancing strength and durability of an adhesive joint of ion-doped class components |
| 01/15/2003 | EP1274783A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 01/15/2003 | EP1029256B1 Electrochromic system |
| 01/15/2003 | CN1098902C Pressure sensitive adhesive composition and use thereof |
| 01/14/2003 | US6506494 Curable epoxy resin, a latent curative system of one encapsulated in thermoplastic polymeric microcapsules and a second admixed in the curable epoxy resin |
| 01/14/2003 | CA2064919C Adducts of epoxides and amines |
| 01/09/2003 | WO2003002684A1 Radiation curable adhesive |
| 01/09/2003 | US20030008950 Optical disc adhesives and radiation-curable lacquers |
| 01/09/2003 | CA2421045A1 Radiation curable adhesive |
| 01/08/2003 | EP1273644A1 Photoreactive hot-melt adhesive composition |
| 01/08/2003 | EP1272587A1 Impact-resistant epoxy resin compositions |
| 01/08/2003 | EP1272586A2 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 01/07/2003 | US6502990 Hydrodynamic bearing device |
| 01/03/2003 | WO2003000816A1 Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same |
| 01/02/2003 | EP1270636A1 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding |
| 12/27/2002 | WO2002102911A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| 12/25/2002 | CN1387244A Bound board with electric conductor, method for mfg. semiconductor device and semiconductor device |
| 12/24/2002 | US6498000 Substrate having particles of a photocatalyst such as tio2, adhered on via a less degradative adhesive such as a copolymer of a vinyl ether and a fluoroolefin or a silicone |
| 12/24/2002 | US6497078 Adhesive composition for chemically inert substrate |
| 12/20/2002 | WO2002000756A1 Insulating resin composition, adhesive resin composition and adhesive sheeting |
| 12/20/2002 | CA2413759A1 Resin composition for insulation material, resin composition for adhesive and adhesion sheet |
| 12/19/2002 | WO2002061010A3 Method for adhering substrates using light activatable adhesive film |
| 12/19/2002 | US20020193519 Comprises epoxy resin, polysiloxane and curing agent; moldability; catalytic polymerization; nondegrading; elasticity |
| 12/17/2002 | CA2042065C Tackified dual cure pressure-sensitive adhesive |
| 12/12/2002 | US20020187339 Bonding body and method of producing the same |
| 12/11/2002 | EP0832164B1 Non-aqueous solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 12/10/2002 | US6492438 Electrically connectable adhesive agent for semiconductor |
| 12/10/2002 | US6491783 Using adhesive made up of part a and part b mixed together, wherein part a includes 12-99% by weight bisphenol a or f type epoxy resin, part b includes 6-99% by weight amidoamine curing agent |
| 12/10/2002 | US6491444 Method for fixing an optical fiber cable in a connector for a connectable optical fiber connection and adhesive use in said method |
| 12/05/2002 | WO2002097002A1 Ultraviolet activatable adhesive film |
| 12/05/2002 | WO2002083806A1 Optical adhesive composition and optical apparatus |
| 12/05/2002 | US20020182955 Structural bonding tapes and articles containing the same |
| 12/05/2002 | US20020182350 Case for a hard cover book; casemaking machine comprising a curing apparatus. |
| 12/05/2002 | US20020179240 Protective articles |
| 12/05/2002 | CA2411185A1 Optical adhesive composition and optical device |
| 12/04/2002 | EP1062289B1 Luminescent electroconductive adhesive |
| 12/04/2002 | CN1382745A Thermoset resin compsns. and its mfg. method |
| 11/28/2002 | WO2002096171A1 Method for producing components for electronic devices |
| 11/28/2002 | WO2002095744A1 Adhesive for optical disk and optical disk |
| 11/28/2002 | WO2002079338A3 Thermosetting adhesive |
| 11/28/2002 | DE10122437A1 Schmelzklebstoff in Form eines Granulates Melt adhesive in the form of granules |
| 11/28/2002 | CA2449198A1 Processes for the production of components of electronic apparatuses |
| 11/26/2002 | US6486256 Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst |
| 11/26/2002 | US6485589 Melt-flowable materials and method of sealing surfaces |
| 11/21/2002 | US20020173580 Methods of making and using creping adhesives comprised of polyamine-epihalohydrin resin/poly(vinyl alcohol) mixtures |
| 11/19/2002 | CA2205750C Sheet-form, curable pressure-sensitive adhesive |
| 11/14/2002 | WO2002091433A2 Method for grinding the back sides of wafers |
| 11/14/2002 | WO2002090454A1 Hot-melt adhesive provided in the form of granulated material |
| 11/14/2002 | DE10121556A1 Verfahren zum Rückseitenschleifen von Wafern Process for back-surface grinding of wafers |
| 11/12/2002 | US6479151 Dispersion of a partially neutralized amino-functional epoxy derived polymer and a compound with at least two acetoacetate groups and/or acetoacetamide groups; coatings with hardness, gloss, water and solvent resistance; adhesive strength |
| 11/12/2002 | CA2126418C Photocatalyst composite and process for producing the same |
| 11/07/2002 | WO2002087895A1 Curable hot melt adhesive for casemaking |
| 11/07/2002 | US20020164485 Structural modified epoxy adhesive compositions |
| 11/07/2002 | CA2445446A1 Curable hot melt adhesive for casemaking |
| 11/05/2002 | US6475641 Connecting material and connection structure |
| 10/31/2002 | WO2002086003A1 A thermosetting adhesive film, and an adhesive structure based on the use thereof |