| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 05/25/2005 | CN1619898A Laser module |
| 05/25/2005 | CN1619030A Production method of tearing proof tyre fabric |
| 05/25/2005 | CN1619029A Production method of impregnated basket canvas for soft body oil can |
| 05/25/2005 | CN1618912A Adhesive for robot leckage blocking and its formulating method and use |
| 05/25/2005 | CN1618911A 粘合带 Adhesive tape |
| 05/25/2005 | CN1203743C Metal casing sticked on casing base plate with auxiliary parts |
| 05/25/2005 | CN1203105C Amine hardener for epoxy resins |
| 05/19/2005 | WO2005044920A1 Curable silicone composition and cured product thereof |
| 05/19/2005 | US20050107494 Latent hardener, process for producing the same, and adhesive containing latent hardener |
| 05/19/2005 | US20050103422 Steel-plate-reinforcement resin composition, steel plate reinforcing sheet, and reinforcing method of steel plate |
| 05/19/2005 | DE10342616A1 Mixture of epoxy resin and a polymer with epoxide groups made by radical polymerisation, e.g. butyl acrylate-glycidyl methacrylate copolymer, used as adhesive, especially as a structural adhesive for metal, wood or plastics |
| 05/19/2005 | DE10342615A1 Epoxyklebstoff mit erhöhter Elastizität Epoxy adhesive with increased elasticity |
| 05/18/2005 | EP1531040A2 Method of reinforcing a steel plate with a resin rubber composition |
| 05/18/2005 | EP1530617A1 Epoxy compositions having improved shelf life and articles containing the same |
| 05/18/2005 | EP1326922B1 Paintable material |
| 05/18/2005 | CN1616580A Quick leak blocking glue for dangerous environment and its making method and use |
| 05/18/2005 | CN1616549A Energy-ray curing resin composition |
| 05/12/2005 | WO2005026284A3 Increased-strength epoxy adhesive |
| 05/12/2005 | US20050101734 Acrylic adhesive sheet |
| 05/12/2005 | US20050099089 Method for enhancing epoxy adhesion to gold surfaces |
| 05/11/2005 | CN1201337C Conducting paste and semiconductor prepared by using said paste |
| 05/11/2005 | CN1200986C Adhensive for producing cladding film of flexible printed circuit board and preparation method thereof |
| 05/05/2005 | US20050096432 Two-pack type adhesive |
| 05/05/2005 | US20050092428 Command-cure adhesives |
| 05/04/2005 | EP1528091A1 A pressure-sensitive adhesive tape |
| 05/04/2005 | EP1527147A1 Two part epoxide adhesive with improved strength |
| 05/04/2005 | EP1419207A4 Adhesive prepreg face sheets for sandwich panels |
| 05/04/2005 | EP1385896B1 Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds |
| 05/03/2005 | US6888257 Useful for integrated circuit packages enabling conducting heat generated by the die |
| 05/03/2005 | US6887914 Structural hot melt material and methods |
| 04/28/2005 | US20050090626 Adhesive compositions |
| 04/27/2005 | EP1525830A2 System and method for laying floor coverings |
| 04/27/2005 | EP1525281A1 Method for accelerated bondline curing |
| 04/27/2005 | CN1198863C Energy ray solidification type resin composition |
| 04/26/2005 | US6884854 A thermally curable formulation containing an epoxy resin, a copolymer having glass transition temp. of -30 degree C. or lower and epoxy reactive group or reaction product with epoxy resin, a hardner, and a polyamide or polyimde or mixture |
| 04/26/2005 | US6884695 Sheet resin composition and process for manufacturing semiconductor device therewith |
| 04/26/2005 | US6884315 Method for bonding DVD layers |
| 04/21/2005 | US20050084682 Mechanical activation to produce heat and friction; crosslinkable urea-, melamine, phenol-, or resorcinol-formaldehyde resin or polyurethane is converted into duroplastic; heat resistance; curing |
| 04/21/2005 | US20050082338 Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 04/21/2005 | CA2482139A1 System and method for laying floor coverings |
| 04/20/2005 | EP1524307A1 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 04/20/2005 | EP1524306A1 Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 04/20/2005 | CN1608092A Adhesive of expoxy compound, aliphatic amine and tertiary amine |
| 04/20/2005 | CN1197891C Aqueous two-component cross-linkable composition |
| 04/14/2005 | WO2005032854A1 Pneumatic radial tire |
| 04/13/2005 | EP1522568A2 Adhesive and use thereof |
| 04/13/2005 | CN1196744C Ambient-temp-stable one-part curable epoxy adhesive |
| 04/12/2005 | US6878435 Adapted for enhancing the adhesion strength of a typical single layer anisotropic conductive film in flip chip bonding; comprising epoxy resin-based film containing conductive particles |
| 04/12/2005 | CA2155088C Adhesive composition for fiber |
| 04/07/2005 | WO2005030894A2 Adhesive compositions |
| 04/07/2005 | US20050074039 Laser module |
| 04/05/2005 | US6875506 Thermally crosslinked acrylic hotmelts |
| 03/31/2005 | WO2005028582A1 Water-resistant adhesive composition for wood |
| 03/31/2005 | US20050070634 Process for applying a streamable epoxy adhesive |
| 03/30/2005 | CN1602343A Dual cure B-stageable adhesive for die attach |
| 03/24/2005 | WO2005026663A1 Magnetic encoder |
| 03/24/2005 | WO2005026284A2 Increased-strength epoxy adhesive |
| 03/24/2005 | US20050065296 Adhesive composition and adhesive film |
| 03/24/2005 | US20050064200 Polycarbodiimides; for electronic parts and lamination treatments; improved storage stability, adhesive strength, and high elastic modulus at high temperatures; for adhesion of copper foil onto glass fiber reinforced epoxy resin substrate |
| 03/23/2005 | EP1516891A1 A binder composition for lamination and an adhesive film using the same |
| 03/23/2005 | EP1516031A1 Heat curable adhesive composition, article, semiconductor apparatus and method |
| 03/22/2005 | CA2320545C Energy ray curing resin composition |
| 03/17/2005 | WO2005023954A1 Adhesive agent and method for production thereof |
| 03/16/2005 | EP1170346B1 Die attach adhesives with epoxy resin having allyl or vinyl groups |
| 03/16/2005 | CN1594480A Silicane modified polyurethane cementing sealing glue and method for making same |
| 03/16/2005 | CN1193081C Fixed adhesive for epoxy resin chip having allyl or vinyl |
| 03/10/2005 | WO2005000990A3 Water-based adhesive compositions with polyamine functioning as curative and binder |
| 03/09/2005 | EP1425330B1 Network polymers comprising epoxy-terminated esters |
| 03/09/2005 | EP1200502B1 Amine hardener for epoxy resins |
| 03/09/2005 | CN1590084A Adhesive sheet for steel plate |
| 02/24/2005 | WO2005017923A1 Insulation-coated electroconductive particles |
| 02/24/2005 | WO2005016989A1 Command-cure adhesives |
| 02/24/2005 | WO2005016987A1 Curable compositions having a reduced enthalpy output |
| 02/24/2005 | US20050043502 The polyimide contains 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane and the addition-condensation polyamide contains carboxylated polybutadiene with an optional acrylonitrile block; low elasticity, excellent flexibility and heat resistance |
| 02/23/2005 | EP1508261A1 Nanoparticle filled underfill |
| 02/23/2005 | EP1507837A1 Segmented curable transfer tapes |
| 02/23/2005 | EP1507836A1 Adhesive tape |
| 02/23/2005 | CN1585808A Low read-through epoxy-bonded SMC |
| 02/23/2005 | CN1585807A Hybrid adhesives, articles, and methods |
| 02/23/2005 | CN1585792A Network polymers comprising epoxy-terminated esters |
| 02/23/2005 | CN1583930A Well casing burnt-on sand combing glue |
| 02/23/2005 | CN1583929A Felt environmental protection rapid forming adhesive for vehicle internal decorative material and preparing method thereof |
| 02/23/2005 | CN1583928A 环氧树脂灌封胶 Epoxy Potting |
| 02/23/2005 | CN1190801C Aeolotropic conductive adhering film |
| 02/22/2005 | US6858695 Curable hot melt adhesive for casemaking |
| 02/17/2005 | WO2005014748A1 Adhesive composition and optical disc prepared therewith |
| 02/16/2005 | CN1582320A High temperature epoxy adhesive films |
| 02/16/2005 | CN1580172A Epoxy modified organic silicon resin adhesive |
| 02/16/2005 | CN1580171A Thermosetting rubber film for flexible circuit assembly and its preparing method |
| 02/15/2005 | US6855748 Quick-setting mixtures comprising heterocyclic ethers, acyclic alcohols-2+ and curing agents, used in stereolithography, coatings, adhesives or primers |
| 02/10/2005 | US20050032447 Adhesive sheet for steel plate |
| 02/09/2005 | EP1504890A2 Adhesive sheet for steel plate |
| 02/09/2005 | EP1504073A1 Heat-curable epoxy resin composition |
| 02/09/2005 | CN1578808A Thermosetting organic resin composition |
| 02/09/2005 | CN1576343A 粘胶膜 Adhesive film |
| 02/09/2005 | CN1576295A Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 02/08/2005 | US6852415 Having at least one aminoglycidyl group in the molecule, a curative, and a fluorosurfactant; insulating materials in the production of measuring transducers, bushings, circuit breakers, dry-type transformers, and electrical machinery |
| 02/03/2005 | WO2004104130A3 Epoxy adhesives and bonded substrates |
| 02/03/2005 | US20050022929 Multi-phase structural adhesives |
| 02/01/2005 | CA2118766C Coated abrasive article incorporating an energy cured hot melt make coat |