| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 09/30/2004 | WO2004083332A1 A conductive adhesive composition |
| 09/30/2004 | US20040191523 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 09/29/2004 | EP1042422B1 Laminating adhesive hardenable by radiation and use of same |
| 09/29/2004 | EP0994142B1 Hardener for epoxy resin |
| 09/29/2004 | CN1532256A Adhesive for circuit connection |
| 09/29/2004 | CN1532255A Adhesive for circuit connection |
| 09/29/2004 | CN1532254A Adhesive for circuit connection |
| 09/29/2004 | CN1532253A Adhesive for circuit connection |
| 09/29/2004 | CN1532252A Adhisive for circuit connection |
| 09/29/2004 | CN1532251A Adhesive for circuit connection |
| 09/28/2004 | US6797787 Epoxidation using aqueous solution of hydrogen peroxide |
| 09/28/2004 | US6797376 Overcoating metal substrate with epoxy resin adhesive blends |
| 09/23/2004 | WO2004081077A1 Thermosetting epoxy resin composition |
| 09/23/2004 | US20040186268 curing agents comprising thio amines, used to form polyepoxides products having chemical resistance, flexibility, viscoelasticity, strength and hardness |
| 09/22/2004 | EP1155082B1 Shock-resistant epoxide resin compositions |
| 09/22/2004 | EP0941296B1 Container for foodstuffs |
| 09/22/2004 | CN1531726A Adhesive for optical disk and optical disk |
| 09/22/2004 | CN1531580A Structural bonding tapes and articles containing the same |
| 09/22/2004 | CN1167763C Adhesive tape for electronic component |
| 09/22/2004 | CN1167732C Resin firming agent containing phosphorus and nitrogen and fireproof resin composition contaniing said firm agent |
| 09/21/2004 | US6794451 Compatible solid resin of given softening point, a monocyclic ether such as oxetane compound, a polyepoxide monomer, and a latent cationic polymerization initiator; solvent-free; easily coated; use as pressure sensitive adhesive |
| 09/21/2004 | US6794038 Latent hardener, manufacturing method for latent hardener, and adhesive |
| 09/16/2004 | WO2004078870A1 Conductive adhesive compositions with electical stability and good impact resistance for use in electronics devices |
| 09/16/2004 | US20040181013 Impact resistant epoxide resin compositions |
| 09/16/2004 | US20040180981 Network polymers comprising epoxy-terminated esters |
| 09/15/2004 | EP1456321A1 Multi-phase structural adhesives |
| 09/15/2004 | EP1456314A1 Method for connecting two bodies |
| 09/14/2004 | US6790310 Sheet-form, curable pressure-sensitive adhesive |
| 09/10/2004 | WO2004076578A1 Reactivatable adhesive |
| 09/08/2004 | EP1453931A1 Radiation curable adhesive |
| 09/08/2004 | EP1453924A2 Dual cure b-stageable adhesive for die attach |
| 09/08/2004 | CN1527869A Ultraviolet activatable adhesive film |
| 09/08/2004 | CN1526784A Ad hesive agent and producing process of the same adhesive agent and plastic thin film laminated steel plates |
| 09/08/2004 | CN1165592C Curable epoxy-based compositions |
| 09/07/2004 | US6787614 Thermosetting resin composition and process for producing the same |
| 09/07/2004 | US6786577 Inkjet print head and method for making the same |
| 09/02/2004 | US20040169162 Mixing epoxy resin, amine, filler, corrosion inhibitor and oxygen scavenger, imidazole curing agent and solvent |
| 09/01/2004 | CN1524912A Permeable road surface adhesive |
| 08/31/2004 | US6784555 Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes |
| 08/31/2004 | US6784025 Semiconductor package with a die attach adhesive having silane functionality |
| 08/26/2004 | US20040166309 Reactivatable adhesive |
| 08/25/2004 | EP1448746A1 Hybrid adhesives, articles, and methods |
| 08/25/2004 | EP1448694A1 Curable organic resin composition |
| 08/25/2004 | EP1299447B1 No-flow flux adhesive compositions |
| 08/25/2004 | EP0820491B1 Melt-flowable materials and method of sealing surfaces |
| 08/25/2004 | CN1523074A Room temperature printable adhesive paste |
| 08/24/2004 | US6780898 Adhesive composition |
| 08/24/2004 | US6780518 Silicone rubber adhesive composition and integrally molded article of silicone rubber and thermoplastic resin |
| 08/24/2004 | US6780510 For manufacturing/implanting bioprostheses such as heart valve prostheses, surgical patch, annuloplasty rings, and pacemakers |
| 08/18/2004 | EP1447843A2 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate, and semiconductor device |
| 08/18/2004 | EP1447421A1 Room temperature printable adhesive paste |
| 08/18/2004 | EP1252217B1 Ambient-temperature-stable, one-part curable epoxy adhesive |
| 08/17/2004 | US6776869 Epoxy reactive end groups or a reaction product of the copolymer with a polyepoxide, a reaction product of a polyurethane prepolymer and a polyphenol or polyaminophenol and at least one epoxy resin. |
| 08/12/2004 | US20040158008 Bonding silicon chip to substrate; mixture of epoxy resin and bismaleimide resin |
| 08/12/2004 | US20040157997 Curable adhesive compositions containing reactive multi-functional acrylate |
| 08/12/2004 | US20040157021 Curable hot melt adhesive for casemaking |
| 08/11/2004 | EP1444307A1 Low read-through epoxy-bonded smc |
| 08/11/2004 | CN1520448A Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same |
| 08/10/2004 | US6774496 Semiconductor package with a thermoset bond |
| 08/10/2004 | US6774250 Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 08/10/2004 | US6774199 Polymer having switchable tackiness |
| 08/05/2004 | WO2002002709A9 Oriented acrylic hotmelts$i() |
| 08/05/2004 | US20040151869 Adhesive for optical disk and optical disk |
| 08/04/2004 | EP1442090A1 High temperature epoxy adhesive films |
| 08/04/2004 | EP1185595B1 Multi-layered sealant |
| 08/03/2004 | US6770957 Adhesives, adhesive films and electric devices |
| 08/03/2004 | US6770812 Metal housing with auxiliary parts glued to housing base |
| 08/03/2004 | US6770370 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination |
| 07/29/2004 | US20040147640 Mixture of phosphoorus containing epoxy resin, promer, hardener , polyphenylene oxide and filler; heat resistance, flame retarders |
| 07/29/2004 | US20040147120 Process for the back-surface grinding of wafers |
| 07/28/2004 | CN1516727A Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus |
| 07/27/2004 | US6767935 Cationic polymerization of unsaturated carbonic acids, anhydrides or acid chlorides, phosphoric or phosphonic acid or esters, sulfonic acids or esters; curing |
| 07/22/2004 | WO2004061039A1 Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates |
| 07/22/2004 | WO2004060996A1 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 07/22/2004 | WO2004060984A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/22/2004 | US20040143034 Moisture curable; heating, fusion particles; extrusion onto cooling surfaces; packaging into hermetic sealed packages; free-flowing; pouring; multilayer composite |
| 07/22/2004 | US20040142191 using a transparent and heat resistant polyimide film as a protection coverfilm instead of using a higher cost black polyimide film and using a black epoxy adhesive containingcarbon black powder instead of using a common epoxy adhesive. |
| 07/22/2004 | CA2509629A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/21/2004 | CN1514774A 改进的透明粘合片 Improved transparent adhesive sheet |
| 07/21/2004 | CN1514063A Road surface repairng material and its making method and use |
| 07/21/2004 | CN1513933A Building strengthening epoxy type edhesive and its preparation method |
| 07/20/2004 | US6764569 Adhesive system for form reversible glued joints |
| 07/15/2004 | WO2004058909A1 Adhesive composition for the direct joining of a pre-gelled polyester or vinyl ester to raw rubber |
| 07/15/2004 | US20040138325 Ultraviolet activatable adhesive film |
| 07/14/2004 | EP1437394A1 Adhesives composition, adhesive film, and semiconductor apparatus using the same |
| 07/14/2004 | EP1437393A1 Adhesive for gas barrier laminates and laminated films |
| 07/14/2004 | CN1512522A Resin size used for chip resistor |
| 07/13/2004 | US6762504 Release films and adhesive films using the release films |
| 07/13/2004 | US6762260 Mixtures of activators, lewis acid catalysts and heterocyclic amines or ethers, used as adhesives or coatings |
| 07/08/2004 | WO2004056930A1 Uv-curable epoxy acrylates |
| 07/08/2004 | US20040132955 Particularly on copper; epoxy resin having a reactive double bond, a radical curing resin, and a radical initiator |
| 07/08/2004 | US20040131839 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/07/2004 | EP1434827A1 Laminates with structured layers |
| 07/07/2004 | CN1511434A Method for producing components for electronic devices |
| 07/07/2004 | CN1156550C Single-component organic heat-conducting daub |
| 07/07/2004 | CN1156549C Adhesive compositions and their precursors |
| 07/06/2004 | US6760533 Optical adhesive composition and optical device |
| 07/06/2004 | US6759506 Polymercaptopolyamines as epoxy resin hardeners |
| 07/01/2004 | WO2004055092A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 07/01/2004 | US20040127680 Vinyl ester adhesive compositions |