| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 08/02/2000 | EP0700409B1 Thermally cross-linkable heat-sealing adhesive |
| 08/01/2000 | US6096808 Snap cure adhesive based on anhydride/epoxy resins |
| 08/01/2000 | CA2089160C Photo-activated, micro-capsulated thread locking composition |
| 07/26/2000 | EP1022321A1 Thermosettable pressure sensitive adhesive sheet |
| 07/26/2000 | EP1022320A1 Thermosettable pressure sensitive adhesive sheet |
| 07/20/2000 | WO2000042115A1 Photo curable adhesive composition |
| 07/20/2000 | WO2000042114A1 Luminescent electroconductive adhesive |
| 07/19/2000 | CN1260374A Bi-component corrosion-proof gum |
| 07/18/2000 | CA2009011C Tough epoxy resins |
| 07/13/2000 | WO2000020483A3 Impact-resistant epoxide resin compositions |
| 07/12/2000 | EP0715640B1 Adhesive composition |
| 07/11/2000 | US6086701 Process for the production of stamper |
| 07/06/2000 | WO2000039234A1 Method for fabricating an optical device using purified adhesives in the optical path |
| 07/06/2000 | WO2000039189A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 07/06/2000 | CA2357773A1 Method for fabricating an optical device using purified adhesives in the optical path |
| 07/04/2000 | US6084039 Triglycidyl ether of a (bis(hydroxyaryl)methyl), (hydroxyaryl)-cyclohexane compound of given formula and curing agent forms a polyepoxide having good balance of heat and moisture resistance; use as encapsulant for electronics |
| 06/29/2000 | WO2000037579A1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 06/29/2000 | WO2000037554A1 Shock-resistant epoxide resin compositions |
| 06/29/2000 | CA2355611A1 Shock-resistant epoxide resin compositions |
| 06/28/2000 | EP1012200A1 Epoxy resin compositions |
| 06/21/2000 | DE19858921A1 Compositions used as structural adhesives contain epoxide-reactive copolymer, reaction product of polyurethane prepolymer with poly:phenol or amino-phenol and epoxy resin |
| 06/20/2000 | US6077886 Having improved non slump and sag resistance properties |
| 06/15/2000 | WO2000034406A1 Adhesive powder |
| 06/15/2000 | WO2000034387A1 Acrylic terpolymer for the use as a self-fixturing adhesive |
| 06/14/2000 | EP1008640A1 Pressure-sensitive adhesive composition, process for the preparation thereof and pressure-sensitive adhesive sheets |
| 06/14/2000 | CN1256172A Photochemical catalyst complex and its prepn. |
| 06/13/2000 | US6074574 Adhesion priming composition for toner fuser member |
| 06/08/2000 | DE19856254A1 Klebstoffpulver Adhesive powder |
| 06/02/2000 | WO2000031202A1 Backing for adhesive tape and such tape |
| 06/02/2000 | CA2351432A1 Backing for adhesive tape and such tape |
| 05/30/2000 | CA2173219C Heat curable toughened epoxy resin compositions |
| 05/25/2000 | WO2000029498A1 Two-component material for chemical fixing means |
| 05/24/2000 | EP1002007A1 Soluble adhesives with a base consisting of a bonding agent containing di- or polysulfide bonds |
| 05/23/2000 | US6066699 Adhesive of epoxy resin and OH-terminated polyester with C8 -C30 appended alk(en)yl |
| 05/23/2000 | CA2287738A1 One-component thermoset coating compositions |
| 05/18/2000 | DE19852720A1 Zweikomponentenmasse für chemische Befestigungen Two-component material for chemical fixings |
| 05/16/2000 | US6063497 Pulverulent compounds, a process for their preparation |
| 05/11/2000 | WO2000026318A1 Adhesive composition |
| 05/11/2000 | WO2000026222A1 Substituted benzoylferrocene anionic photoinitiators |
| 05/10/2000 | EP0728165B1 Topographical method |
| 05/10/2000 | CN1052375C Copper foil used for layered plate plated with copper |
| 05/09/2000 | US6060539 Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives |
| 05/02/2000 | US6057389 Curable compositions |
| 05/02/2000 | US6057382 Epoxy/thermoplastic photocurable adhesive composition |
| 04/26/2000 | EP0995139A1 Method for fixing an optical fiber cable in a connector for a connectable optical fiber connection and adhesive used in said method |
| 04/26/2000 | CN1251600A Unsaturated polymer polyurethane structural adhesive |
| 04/25/2000 | US6054536 Epoxy resin compositions |
| 04/25/2000 | US6054509 Adhesive of epoxy resin, nitrile rubbers and curing agent |
| 04/20/2000 | WO2000022060A1 Optical fiber connector using colored photocurable adhesive |
| 04/20/2000 | WO2000022024A2 High strength epoxy adhesive and uses thereof |
| 04/20/2000 | DE19845607A1 Schlagfeste Epoxidharz-Zusammensetzungen Resistant epoxy resin compositions |
| 04/20/2000 | CA2346354A1 Optical fiber connector using colored photocurable adhesive |
| 04/19/2000 | EP0994142A1 Hardener for epoxy resin |
| 04/19/2000 | EP0993496A1 Adhesive compositions with durability under conditions of high humidity |
| 04/13/2000 | WO2000020483A2 Impact-resistant epoxide resin compositions |
| 04/13/2000 | CA2346634A1 Impact-resistant epoxide resin compositions |
| 04/12/2000 | EP0958319A4 Unsaturated polymer polyurethane structural adhesive |
| 04/11/2000 | US6048944 Aliphatic epoxide-amine adducts with substantial side-chain branching, process for their preparation, and their use |
| 04/11/2000 | US6048576 Carboxylic group-containing acrylonitrile-butadiene copolymer, a mixed epoxy resin, a compound having at least two intramolecular maleimide groups, an aromatic diamine compound, an epoxy-containing liquid silicon resin, a filler and a |
| 04/05/2000 | EP0991306A1 Film for flexible printed wiring board |
| 04/05/2000 | EP0990686A2 Adhesive film for semiconductor package |
| 04/05/2000 | CN1249716A Adhesive system for one or multi step adhesive binding method, method for adhesive binding of printed matter |
| 04/04/2000 | US6046403 Solar battery module |
| 04/04/2000 | US6045648 Multilayer films or tubes such as medical IV tubing, or medical pump cassettes; clarity, flexibility and toughness, without the environmental and health hazards of polyvinyl chloride; PVC-free; of susceptor particles cause localized heating, and form a leak-free joint via heat self-sealing |
| 03/29/2000 | EP0989175A1 Thermosetting adhesive |
| 03/29/2000 | EP0989173A1 Thermosetting pressure-sensitive adhesive |
| 03/28/2000 | US6042685 Multiple wire printed circuit board and process for making the same |
| 03/23/2000 | WO2000016164A1 Adhesives for preparing a multilayer laminate featuring an ink-bearing surface bonded to a second surface |
| 03/22/2000 | CN1050618C Solidifiable epoxy resin composition |
| 03/22/2000 | CN1050617C Epoxy resin composition with solidifying inhibitor |
| 03/21/2000 | US6040084 Resistant to internal pressure and impact, and capable of maintaining its high-level performance constantly for a long time; as power source for vehicles, automobiles |
| 03/21/2000 | US6039821 Contacting polyepoxide fiber-binder with the fibers to form a raw batt with the fiber-binder loosely adhering to the fibers of the batt, heating the raw batt with a cross-linker to react with polyepoxide and form a crosslinked batt |
| 03/09/2000 | WO2000012585A1 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, and process for producing photocurable pressure-sensitive adhesive sheet |
| 03/09/2000 | WO2000012584A1 Cationic photocatalyst composition and photocurable composition |
| 03/01/2000 | EP0982385A1 Adhesive, method for bonding, and assemblies of mounted boards |
| 03/01/2000 | CN1049904C Thermally cross-linkable heat-sealing adhesive |
| 02/29/2000 | US6030701 Melt-flowable materials and method of sealing surfaces |
| 02/23/2000 | EP0980409A1 Adhesive compositions that are removable after thermosetting |
| 02/17/2000 | WO2000008085A1 Method for producing vinyl compounds |
| 02/17/2000 | CA2339737A1 Method for producing vinyl compounds |
| 02/16/2000 | CN1244550A Adhesion agent, saling glue and paint composition |
| 02/15/2000 | US6025438 Metal complex crosslinking agent; wear and corrosion resistance |
| 02/10/2000 | WO2000006661A1 Adhesive compositions and their precursors |
| 02/10/2000 | DE19835906A1 Verfahren zur Herstellung von Vinylverbindungen Process for the preparation of vinyl compounds |
| 02/09/2000 | EP0793741B1 Binder composition useful for producing non-woven fabrics and process for producing moulded parts made of non-woven fabrics |
| 02/03/2000 | WO2000005288A1 Adhesive system to form reversible glued joints |
| 02/03/2000 | DE19832629A1 Klebstoffsystem zur Bildung reversibler Klebeverbindungen Adhesive system for forming reversible adhesive bonds |
| 02/02/2000 | EP0976804A1 Polymeric adhesive and multilayered polymeric structures, process for their preparation and their use |
| 02/02/2000 | EP0976771A1 Curable resin compositions, their preparation and use |
| 02/01/2000 | US6020508 Radiation- or thermally-initiated cationically-curable epoxide compounds and compositions made from those compounds |
| 02/01/2000 | US6020059 Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
| 01/26/2000 | EP0819747B1 Adhesive, adhesive film and adhesive-backed metal foil |
| 01/26/2000 | CN1242404A Epoxy resin composition for bonding semiconductor chips |
| 01/25/2000 | US6017983 Color indicator for completion of polymerization for thermosets |
| 01/20/2000 | WO2000002968A1 Tackified thermoplastic-epoxy pressure sensitive adhesives |
| 01/20/2000 | WO2000002731A1 Adhesive material with flexibility modifiers |
| 01/18/2000 | US6015865 Hot melt adhesive from epoxy resin/amine-terminated polyalkylene glycol adduct |
| 01/12/2000 | EP0971011A2 Adhesive composition and adhesive sheet |
| 01/12/2000 | EP0971009A2 Adhesive composition for bonding semiconductor chips |
| 01/12/2000 | CN1048270C Compatible blends of epoxy resins and epoxidized polydienes |