| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 11/20/1997 | CA2254883A1 Adhesive compositions and methods of use |
| 11/18/1997 | US5688583 Adhesive for printed circuit board |
| 11/13/1997 | WO1997042367A1 Bonding fibrous batts with thermosetting fiber-binders of certain epoxy resins |
| 11/13/1997 | WO1997042027A1 Siloxane-modified adhesive/adherend systems |
| 11/12/1997 | EP0708791B1 Compatible blends of epoxy resins and epoxidized polydienes |
| 11/11/1997 | US5686509 Epoxy resin structural adhesive composition |
| 11/06/1997 | WO1997041170A1 Uv curable composition |
| 11/06/1997 | CA2252830A1 Uv curable composition |
| 11/05/1997 | EP0706548B1 Epoxy adhesive composition for bonding oily metal |
| 11/05/1997 | CN1164245A Curable epoxy resin accelerated by boric acid and its analogs |
| 10/30/1997 | WO1997040115A1 Ultraviolet-curing adhesive composition and article |
| 10/29/1997 | EP0802956A2 Method and composition for bonding components to glass |
| 10/21/1997 | US5679730 Good thixotropy and low stringiness obtained by adding water and a polycarbodimide to the mixture of liquid epoxy resin, thixotropic agent and filler; adhesion to metals; corrosion resistance |
| 10/14/1997 | US5677414 Storage stability; adhesives, coatings |
| 10/14/1997 | US5677393 Heat-resistant film adhesive for use in fabrication of printed circuit boards and process for using the same |
| 10/14/1997 | US5677053 Metallic base material and gel of acrylic plastisol adhered together by thermosetting resin layer containing bisphenol-type epoxy resin and phenolic resin |
| 10/14/1997 | US5677038 Hot-melt adhesive composition for the coating of interlining material |
| 10/08/1997 | EP0799874A2 Topographical method |
| 10/07/1997 | US5674611 Rubber modified epoxy resin, polyvinyl acetal resin, melamine or urethane resin |
| 10/01/1997 | CN1160864A Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display |
| 09/30/1997 | US5672637 Stabilized cationically-curable compositions |
| 09/24/1997 | CN1160417A Curable binders for pressure sensitive adhesives and sealants |
| 09/24/1997 | CN1160416A Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems |
| 09/23/1997 | US5670612 Polyamine/epoxy-containing polyoxyethylene/hydrophobic epoxy adduct curing agent |
| 09/10/1997 | EP0794238A2 Adhesive composition for bonding a lining tube on to the internal surface of an existing pipe |
| 09/10/1997 | EP0794019A1 Metallic surface coating and process for making it |
| 09/10/1997 | EP0793741A2 Binder composition useful for producing non-woven fabrics and process for producing moulded parts made of non-woven fabrics |
| 09/10/1997 | CN1035823C Prepn. of latent catalysts for solidifying epoxy resin |
| 09/05/1997 | CA2199168A1 New coating for metallic surfaces and associated application process |
| 09/02/1997 | US5663246 Acetal derivatives of resole compounds |
| 08/28/1997 | WO1997031078A1 Polyamide based laminating, coverlay, and bond ply adhesive with heat activated cure component |
| 08/21/1997 | WO1997030475A1 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 08/21/1997 | WO1997030132A1 Heat-sensitive pressure-sensitive adhesive and heat-sensitive pressure-sensitive adhesive sheet |
| 08/21/1997 | WO1997030101A1 Improved chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
| 08/21/1997 | CA2245689A1 Improved chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
| 08/20/1997 | EP0789720A1 Stable, low cure-temperature semi-structural pressure sensitive adhesive |
| 08/20/1997 | CN1157310A Adhesive composition and adhesive sheet |
| 08/13/1997 | EP0788522A1 Acetal derivatives of resole compounds |
| 08/12/1997 | US5656701 Polyurethane resins, process for producing the same, and uses thereof |
| 08/07/1997 | WO1997021229A3 Electrically conducting reaction resin mixture |
| 08/06/1997 | EP0787162A2 Curable epoxy resin accelerated by boric acid and its analogs |
| 08/06/1997 | CN1156166A Anti-flow pasty epoxy adhesive |
| 07/30/1997 | EP0785974A2 Curable binders for pressure sensitive adhesives and sealants |
| 07/30/1997 | EP0785973A1 Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems |
| 07/16/1997 | EP0591174B1 Reworkable adhesive for electronic applications |
| 07/09/1997 | EP0782601A1 Epoxy adhesive composition |
| 07/09/1997 | EP0703952B1 Stabilized curable adhesives |
| 07/08/1997 | US5646315 Polyglydicylphenyl ethers of alkyloxy chains for use in microelectronics adhesives |
| 07/02/1997 | EP0781790A1 Moisture-curable hot-melt adhesives exhausting no carbon dioxide or only small quantities |
| 07/02/1997 | EP0781771A1 Compounds containing cyclic amidine and uretedione groups, a method for their preparation and their use |
| 07/01/1997 | US5643975 Semiconductors formed by encapsulation with epoxy resin-phenolic resin mixtures |
| 06/28/1997 | CA2193934A1 Moisture-crosslinking hot-melt adhesives which emit no or only small amounts of carbon dioxide |
| 06/28/1997 | CA2193925A1 Compounds containing cyclic amidine and uretdione groups, a process for their preparation and the use thereof |
| 06/25/1997 | EP0780435A1 Flexible epoxy adhesives with low bleeding tendency |
| 06/24/1997 | US5641852 Thermosetting resin composition and method of manufacturing it from an epoxy resin, cyanate and phenol |
| 06/24/1997 | US5641823 Solvent-free laminating adhesive composition |
| 06/24/1997 | US5641818 Aqueous dispersion of non-ionic solid, particlulate epoxy resin, a solid aromatic diamine curing agent, a solid particlulate elastomer toughener component; storage stability, solvent resistance |
| 06/21/1997 | CA2193707A1 Flexible epoxy adhesives with low bleeding tendency |
| 06/19/1997 | WO1997021735A1 Modified polyalkadiene-containing compositions |
| 06/17/1997 | US5639811 Curable, partially crosslinked polymer comprising carboxylicacid, alkyl ester, glycidyl ester acrylic monomers blended with tackifier resin; peel strength, high temperature shear strength |
| 06/12/1997 | WO1997021229A2 Electrically conducting reaction resin mixture |
| 06/12/1997 | WO1997020898A1 Adhesive, process for the preparation thereof, and process for mounting components |
| 06/10/1997 | US5637179 Process for adhesion using an epoxy resin adhesive composition |
| 06/05/1997 | DE19649893A1 Conductive adhesive for bonding e.g. semiconductors to circuit boards |
| 05/29/1997 | WO1997019125A1 Reactive resin manufacture |
| 05/28/1997 | EP0775715A2 Adhesive composition and adhesive sheet |
| 05/14/1997 | EP0660861B1 Aqueous voc-free epoxy primer compositions |
| 05/13/1997 | US5629380 Epoxy adhesive composition comprising a calcium salt and mannich base |
| 05/13/1997 | US5629098 Epoxy adhesives and copper foils and copper clad laminates using same |
| 05/09/1997 | WO1997016500A1 Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive |
| 05/02/1997 | EP0770657A2 Plateable structural adhesive for cyanate ester composites |
| 05/02/1997 | EP0770656A2 Metal-filled, plateable structural adhesive for cyanate ester composites |
| 04/29/1997 | US5624765 Adhesive compositions for adhering rubber and fiber, rubber-reinforcing synthetic fibers, and fiber-reinforced rubber structures |
| 04/17/1997 | DE19538468A1 Bonding ceramic and metallic materials to composite, useful at high temperature |
| 04/16/1997 | EP0768348A2 Aqueous coating composition based on solvent-poor modified epoxy resin dispersions |
| 04/15/1997 | US5620553 Photopolymerisable liquid compositions for bonding friction material to metal |
| 04/03/1997 | WO1997012009A1 Thermosetting composition |
| 04/01/1997 | US5616634 Stable, aqueous epoxy resin dispersions, processes for their preparation, and their use |
| 03/30/1997 | CA2186425A1 Aquoeus coating composition based on low-solvent modified epoxy resin dispersions |
| 03/26/1997 | EP0764786A1 Anchor-fixing capsules |
| 03/18/1997 | US5612448 Polyamides with high strength and flexibility |
| 03/12/1997 | EP0594644B1 Anisotropic conductive adhesive film |
| 02/26/1997 | EP0759462A2 Flexible electrically-conductive epoxy adhesives |
| 02/26/1997 | CN1143661A Process for preparing normal temp solidification polyurethane toughened epoxy resin adhesive |
| 02/25/1997 | US5605944 Polyamide-epoxy, thermoplastic-thermoset curable resin systems |
| 02/25/1997 | US5605763 Electrically conductive bonding films |
| 02/18/1997 | US5604026 Used to electrically connect two metal surfaces |
| 02/11/1997 | CA2054212C Method for polymerization of epoxide compounds |
| 02/04/1997 | US5599622 Heat curable acrylate-epoxy polymers; used in bonding substrates such as metals, glass, wood, paint and plastics |
| 01/29/1997 | EP0755424A1 Curable adhesive system |
| 01/29/1997 | CN1141574A Multi-layer printed circuit and method for mfg. same |
| 01/22/1997 | EP0754742A2 Room-temperature stable, one-component, flexible epoxy adhesives |
| 01/22/1997 | EP0754741A2 Room-temperature stable, one-component, thermally-conductive, flexible epoxy adhesives |
| 01/22/1997 | CN1033862C Metal adhesive |
| 01/21/1997 | US5596023 Sealing material for liquid crystal display panel, and liquid crystal display panel using it |
| 01/15/1997 | CN1140183A Thermosetting resin compostion electrical laminates obtained therefrom and process of producing these |
| 01/09/1997 | WO1997000923A1 Adhesive compositions, bonding films made therefrom and processes for making bonding films |
| 01/09/1997 | CA2224809A1 Adhesive compositions, bonding films made therefrom and processes for making bonding films |
| 01/03/1997 | WO1997000300A1 Non-aqueous solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 01/03/1997 | WO1997000299A1 Solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |