| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) | 
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| 11/05/2003 | EP1358291A2 Method for adhering substrates using light activatable adhesive film | 
| 11/05/2003 | CN1453830A Plasma etching electrode with excellent heat resistance and dry etching apparatus using the same | 
| 11/04/2003 | US6641928 Adhesives and electric devices | 
| 10/29/2003 | EP1357576A2 Highly heat-resistant plasma etching electrode and dry etching device including the same | 
| 10/29/2003 | EP1355683A2 Biocompatible adhesives | 
| 10/23/2003 | WO2002091433A3 Method for grinding the back sides of wafers | 
| 10/23/2003 | US20030196759 Highly heat-resistant plasma etching electrode and dry etching device including the same | 
| 10/23/2003 | US20030196753 Epoxy adhesive having improved impact resistance | 
| 10/22/2003 | EP1354316A2 Radiation-curable compositions for optical media | 
| 10/22/2003 | EP1353978A2 Adhesive compositions including self-assembling molecules, adhesives, articles, and methods | 
| 10/22/2003 | EP0914398B1 Heat-setting single-component lva (low-viscosity adhesive) system with improved storage properties | 
| 10/22/2003 | CN1450849A Insulation material for printed circuit board and method for making printed circuit board by same | 
| 10/21/2003 | US6635138 Method of immobilizing circuitry fingers | 
| 10/16/2003 | WO2003085733A1 Thermosetting adhesive sheet with electroconductive and thermoconductive properties | 
| 10/16/2003 | WO2003085063A1 Activatable material | 
| 10/16/2003 | WO2003085062A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition | 
| 10/16/2003 | WO2002023556A8 Metal bonding film compositions | 
| 10/16/2003 | US20030192643 Epoxy adhesive having improved impact resistance | 
| 10/16/2003 | US20030192638 Curable adhesives containing polyacrylate and epoxy components; clarity, optics | 
| 10/16/2003 | CA2476737A1 Adhesive expandable material | 
| 10/15/2003 | CN1449418A No-flow flux adhesive compositions | 
| 10/14/2003 | US6632872 Adhesive compositions including self-assembling molecules, adhesives, articles, and methods | 
| 10/14/2003 | US6632523 Polyimidesiloxane made from a dianhydride, an aromatic diamine and a siloxanediamine, an epoxy resin, and a cyanate; tape | 
| 10/09/2003 | WO2003082947A1 Thermosetting resin composition and adhesive films | 
| 10/08/2003 | CN1123440C Electrically and thermally conductive adhesive tape, its mfg. process and conductive adhesive plaster | 
| 10/02/2003 | US20030187156 Reactive hot-melt adhesive composition | 
| 10/02/2003 | US20030187154 Corrosion and aging resistance; hot melt adhesive | 
| 10/02/2003 | US20030186049 Activatable material | 
| 10/01/2003 | EP1204691B1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings | 
| 09/25/2003 | WO2003078163A1 Epoxy adhesive having improved impact resistance | 
| 09/25/2003 | US20030181611 Organoborane amine complex polymerization initiators and polymerizable compositions | 
| 09/24/2003 | EP1346002A1 Multilayer metal sandwich materials comprising epoxy-based adhesive systems | 
| 09/24/2003 | CN1444618A Method for producing aliphatic oligocarbonate diols | 
| 09/24/2003 | CN1443824A Epoxy adhesive capable of using at ultralow-temp. and its preparation and application method | 
| 09/23/2003 | US6624213 Cycloaliphatic polyepoxide resin and 9,9-bis(3-methyl-4-aminophenyl)fluorene | 
| 09/18/2003 | WO2003076544A1 Uv-curable epoxy resin composition comprising lactone monomer | 
| 09/18/2003 | WO2003076485A2 Organoborane amine complex polymerization initiators and polymerizable compositions | 
| 09/18/2003 | US20030176585 Insulating resin composition, adhesive resin composition and adhesive sheeting | 
| 09/18/2003 | US20030176529 Photoreactive hot-melt adhesive composition | 
| 09/18/2003 | US20030176525 For use in composite molding material, adhesives, coating material; curability | 
| 09/18/2003 | CA2478084A1 Organoborane amine complex polymerization initiators and polymerizable compositions | 
| 09/17/2003 | CN1121468C Heat setting single component LVA (low-viscosity adhesive) system for bonding in micro-range | 
| 09/16/2003 | US6621170 Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film | 
| 09/16/2003 | US6620862 Sheet resin composition and process for manufacturing semiconductor device therewith | 
| 09/10/2003 | CN1441818A High funtional polymers | 
| 09/10/2003 | CN1441633A Metal casing sticked on casing base plate with auxiliary parts | 
| 09/09/2003 | US6617021 Blend of epoxy resin, phenolic resin, butadiene-styrene copolymer and organosilicon compound | 
| 09/09/2003 | US6616976 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer | 
| 09/09/2003 | CA2144547C Aqueous essentially voc-free adhesive epoxy primer | 
| 09/04/2003 | WO2003072677A1 Sealing method | 
| 09/04/2003 | US20030166747 Casting compound based on thermosetting epoxy resins | 
| 09/03/2003 | CN1439686A Flexibel polyester-toughened epoxy adhesive and preparation thereof | 
| 09/03/2003 | CN1439685A Adhesion agent, adhesive membrane and electrie device | 
| 09/02/2003 | US6613438 Single component adhesive with an adaptable open joint time | 
| 08/28/2003 | WO2003070850A1 Two-pack type adhesive | 
| 08/28/2003 | US20030162046 Metal housing with auxiliary parts glued to housing base | 
| 08/28/2003 | US20030159773 Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device | 
| 08/27/2003 | CN1439028A Insulating resin composition, adhesive resin composition and adhesive sheeting | 
| 08/21/2003 | WO2003068840A1 Latent hardener, process for producing the same, and adhesive containing latent hardener | 
| 08/21/2003 | US20030158338 Aqueous adhesive compositions for bonding elastomers | 
| 08/21/2003 | US20030155663 Adhesives, adhesive films and electric devices | 
| 08/20/2003 | CN1437644A Adhesive for resin roll assembly and resin roll | 
| 08/19/2003 | US6608148 Hot melt adhesive of cationic polymerizable compound, photoinitiator and phthalate diester | 
| 08/19/2003 | US6607629 Process for the perfect binding of printed articles | 
| 08/14/2003 | WO2003066771A1 Adhesive resin composition and use thereof | 
| 08/14/2003 | US20030153121 Semiconductor package production method and semiconductor package | 
| 08/13/2003 | EP1334161A1 Structural hot melt material and methods | 
| 08/13/2003 | CN1436244A Enzyme-catalyzed polyamides and compositions and processes of preparing and using same | 
| 08/13/2003 | CN1435444A Cast composite based on thermosetting epoxy resin | 
| 08/13/2003 | CN1435443A Water adhesive composition for adhering elastomer | 
| 08/07/2003 | WO2003064552A1 Heat releasable thermosetting pressure-sensitive adhesive film | 
| 08/07/2003 | US20030149194 Epoxy resin composition | 
| 08/07/2003 | US20030146266 Conductive adhesive material with metallurgically-bonded conductive particles | 
| 08/07/2003 | US20030145949 Mixture of epoxy resin and glycidyl(meth)acrylate polymer | 
| 08/06/2003 | EP1333079A1 Conductive adhesive material with metallurgically-bonded conductive particles | 
| 08/06/2003 | EP1333057A2 Aqueous adhesive compositions for bonding elastomers | 
| 08/06/2003 | CN1434834A Photocurable composition and mfg. method, photocurable pressure-sensitive adhesive sheet and mfg. and bonding method | 
| 08/06/2003 | CN1116932C Photochemical catalyst complex and its prepn | 
| 08/05/2003 | CA2202643C Acetal derivatives of resole compounds | 
| 08/05/2003 | CA2188345C Metal-filled, plateable structural adhesives for cyanate ester composites | 
| 07/31/2003 | US20030144416 Chain extender, a catalyst, a reactive epoxy resin, and a polymeric toughner forms a thermally curable structural adhesive | 
| 07/31/2003 | US20030144381 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors | 
| 07/30/2003 | EP1331234A1 Potting composition based on duroplastic epoxid resin | 
| 07/30/2003 | CN1433453A Epoxy based reinforcing patches with improved adhesion to oily metal surfaces | 
| 07/30/2003 | CA2416665A1 Aqueous adhesive compositions for bonding elastomers | 
| 07/24/2003 | WO2003059999A2 Epoxy resin component containing a cationic methine dye | 
| 07/24/2003 | WO2002024792A3 Adhesive compositions including self-assembling molecules, adhesives, articles, and methods | 
| 07/24/2003 | US20030139537 Epoxidation using aqueous solution of hydrogen peroxide | 
| 07/23/2003 | EP1328602A2 Two component thermosettable compositions useful for producing structural reinforcing adhesives | 
| 07/23/2003 | EP1328600A1 Acid pretreatment for adhesive | 
| 07/23/2003 | EP1328567A1 High functional polymers | 
| 07/17/2003 | WO2003057753A1 Adhesive of epoxy compound, aliphatic amine and tertiary amine | 
| 07/16/2003 | EP1326922A1 Paintable material | 
| 07/15/2003 | US6592783 Anisotropic conductive adhesive film | 
| 07/10/2003 | WO2003055957A1 Multi-phase structural adhesives | 
| 07/10/2003 | US20030129438 Dual cure B-stageable adhesive for die attach | 
| 07/10/2003 | US20030129411 Impregnating core fiber with thermoplastic resin | 
| 07/08/2003 | US6590070 Ethylene-glycidyl (meth)acrylate copolymer, a rosin having a carboxyl group, and a (meth)acrylate having a carboxyl group such as methacrylic acid; bonding electronic parts; capable of being cured using a low dose of radiation | 
| 07/08/2003 | CA2102138C Structural adhesive composition having high temperature resistance | 
| 07/08/2003 | CA2033882C Curing compositions |