Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
11/2003
11/05/2003EP1358291A2 Method for adhering substrates using light activatable adhesive film
11/05/2003CN1453830A Plasma etching electrode with excellent heat resistance and dry etching apparatus using the same
11/04/2003US6641928 Adhesives and electric devices
10/2003
10/29/2003EP1357576A2 Highly heat-resistant plasma etching electrode and dry etching device including the same
10/29/2003EP1355683A2 Biocompatible adhesives
10/23/2003WO2002091433A3 Method for grinding the back sides of wafers
10/23/2003US20030196759 Highly heat-resistant plasma etching electrode and dry etching device including the same
10/23/2003US20030196753 Epoxy adhesive having improved impact resistance
10/22/2003EP1354316A2 Radiation-curable compositions for optical media
10/22/2003EP1353978A2 Adhesive compositions including self-assembling molecules, adhesives, articles, and methods
10/22/2003EP0914398B1 Heat-setting single-component lva (low-viscosity adhesive) system with improved storage properties
10/22/2003CN1450849A Insulation material for printed circuit board and method for making printed circuit board by same
10/21/2003US6635138 Method of immobilizing circuitry fingers
10/16/2003WO2003085733A1 Thermosetting adhesive sheet with electroconductive and thermoconductive properties
10/16/2003WO2003085063A1 Activatable material
10/16/2003WO2003085062A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
10/16/2003WO2002023556A8 Metal bonding film compositions
10/16/2003US20030192643 Epoxy adhesive having improved impact resistance
10/16/2003US20030192638 Curable adhesives containing polyacrylate and epoxy components; clarity, optics
10/16/2003CA2476737A1 Adhesive expandable material
10/15/2003CN1449418A No-flow flux adhesive compositions
10/14/2003US6632872 Adhesive compositions including self-assembling molecules, adhesives, articles, and methods
10/14/2003US6632523 Polyimidesiloxane made from a dianhydride, an aromatic diamine and a siloxanediamine, an epoxy resin, and a cyanate; tape
10/09/2003WO2003082947A1 Thermosetting resin composition and adhesive films
10/08/2003CN1123440C Electrically and thermally conductive adhesive tape, its mfg. process and conductive adhesive plaster
10/02/2003US20030187156 Reactive hot-melt adhesive composition
10/02/2003US20030187154 Corrosion and aging resistance; hot melt adhesive
10/02/2003US20030186049 Activatable material
10/01/2003EP1204691B1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings
09/2003
09/25/2003WO2003078163A1 Epoxy adhesive having improved impact resistance
09/25/2003US20030181611 Organoborane amine complex polymerization initiators and polymerizable compositions
09/24/2003EP1346002A1 Multilayer metal sandwich materials comprising epoxy-based adhesive systems
09/24/2003CN1444618A Method for producing aliphatic oligocarbonate diols
09/24/2003CN1443824A Epoxy adhesive capable of using at ultralow-temp. and its preparation and application method
09/23/2003US6624213 Cycloaliphatic polyepoxide resin and 9,9-bis(3-methyl-4-aminophenyl)fluorene
09/18/2003WO2003076544A1 Uv-curable epoxy resin composition comprising lactone monomer
09/18/2003WO2003076485A2 Organoborane amine complex polymerization initiators and polymerizable compositions
09/18/2003US20030176585 Insulating resin composition, adhesive resin composition and adhesive sheeting
09/18/2003US20030176529 Photoreactive hot-melt adhesive composition
09/18/2003US20030176525 For use in composite molding material, adhesives, coating material; curability
09/18/2003CA2478084A1 Organoborane amine complex polymerization initiators and polymerizable compositions
09/17/2003CN1121468C Heat setting single component LVA (low-viscosity adhesive) system for bonding in micro-range
09/16/2003US6621170 Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film
09/16/2003US6620862 Sheet resin composition and process for manufacturing semiconductor device therewith
09/10/2003CN1441818A High funtional polymers
09/10/2003CN1441633A Metal casing sticked on casing base plate with auxiliary parts
09/09/2003US6617021 Blend of epoxy resin, phenolic resin, butadiene-styrene copolymer and organosilicon compound
09/09/2003US6616976 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer
09/09/2003CA2144547C Aqueous essentially voc-free adhesive epoxy primer
09/04/2003WO2003072677A1 Sealing method
09/04/2003US20030166747 Casting compound based on thermosetting epoxy resins
09/03/2003CN1439686A Flexibel polyester-toughened epoxy adhesive and preparation thereof
09/03/2003CN1439685A Adhesion agent, adhesive membrane and electrie device
09/02/2003US6613438 Single component adhesive with an adaptable open joint time
08/2003
08/28/2003WO2003070850A1 Two-pack type adhesive
08/28/2003US20030162046 Metal housing with auxiliary parts glued to housing base
08/28/2003US20030159773 Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device
08/27/2003CN1439028A Insulating resin composition, adhesive resin composition and adhesive sheeting
08/21/2003WO2003068840A1 Latent hardener, process for producing the same, and adhesive containing latent hardener
08/21/2003US20030158338 Aqueous adhesive compositions for bonding elastomers
08/21/2003US20030155663 Adhesives, adhesive films and electric devices
08/20/2003CN1437644A Adhesive for resin roll assembly and resin roll
08/19/2003US6608148 Hot melt adhesive of cationic polymerizable compound, photoinitiator and phthalate diester
08/19/2003US6607629 Process for the perfect binding of printed articles
08/14/2003WO2003066771A1 Adhesive resin composition and use thereof
08/14/2003US20030153121 Semiconductor package production method and semiconductor package
08/13/2003EP1334161A1 Structural hot melt material and methods
08/13/2003CN1436244A Enzyme-catalyzed polyamides and compositions and processes of preparing and using same
08/13/2003CN1435444A Cast composite based on thermosetting epoxy resin
08/13/2003CN1435443A Water adhesive composition for adhering elastomer
08/07/2003WO2003064552A1 Heat releasable thermosetting pressure-sensitive adhesive film
08/07/2003US20030149194 Epoxy resin composition
08/07/2003US20030146266 Conductive adhesive material with metallurgically-bonded conductive particles
08/07/2003US20030145949 Mixture of epoxy resin and glycidyl(meth)acrylate polymer
08/06/2003EP1333079A1 Conductive adhesive material with metallurgically-bonded conductive particles
08/06/2003EP1333057A2 Aqueous adhesive compositions for bonding elastomers
08/06/2003CN1434834A Photocurable composition and mfg. method, photocurable pressure-sensitive adhesive sheet and mfg. and bonding method
08/06/2003CN1116932C Photochemical catalyst complex and its prepn
08/05/2003CA2202643C Acetal derivatives of resole compounds
08/05/2003CA2188345C Metal-filled, plateable structural adhesives for cyanate ester composites
07/2003
07/31/2003US20030144416 Chain extender, a catalyst, a reactive epoxy resin, and a polymeric toughner forms a thermally curable structural adhesive
07/31/2003US20030144381 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors
07/30/2003EP1331234A1 Potting composition based on duroplastic epoxid resin
07/30/2003CN1433453A Epoxy based reinforcing patches with improved adhesion to oily metal surfaces
07/30/2003CA2416665A1 Aqueous adhesive compositions for bonding elastomers
07/24/2003WO2003059999A2 Epoxy resin component containing a cationic methine dye
07/24/2003WO2002024792A3 Adhesive compositions including self-assembling molecules, adhesives, articles, and methods
07/24/2003US20030139537 Epoxidation using aqueous solution of hydrogen peroxide
07/23/2003EP1328602A2 Two component thermosettable compositions useful for producing structural reinforcing adhesives
07/23/2003EP1328600A1 Acid pretreatment for adhesive
07/23/2003EP1328567A1 High functional polymers
07/17/2003WO2003057753A1 Adhesive of epoxy compound, aliphatic amine and tertiary amine
07/16/2003EP1326922A1 Paintable material
07/15/2003US6592783 Anisotropic conductive adhesive film
07/10/2003WO2003055957A1 Multi-phase structural adhesives
07/10/2003US20030129438 Dual cure B-stageable adhesive for die attach
07/10/2003US20030129411 Impregnating core fiber with thermoplastic resin
07/08/2003US6590070 Ethylene-glycidyl (meth)acrylate copolymer, a rosin having a carboxyl group, and a (meth)acrylate having a carboxyl group such as methacrylic acid; bonding electronic parts; capable of being cured using a low dose of radiation
07/08/2003CA2102138C Structural adhesive composition having high temperature resistance
07/08/2003CA2033882C Curing compositions
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