| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 08/19/1998 | EP0858488A1 Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive |
| 08/19/1998 | EP0830396A4 Application of a polymer backing onto a glass substrate |
| 08/19/1998 | CN1190665A Pressure sensitive adhesive composition and use thereof |
| 08/18/1998 | US5795618 Forming an adhesive layer on a substrate, dispersion of cured powder amino resins for heat resistance, oxidation and roughening surface then treatment with electroless deposition of metals to form conductors |
| 08/13/1998 | WO1998034992A1 Method for gluing a surface to a component |
| 08/13/1998 | DE19705027A1 Verfahren zum Verkleben eines Bauelements mit einer Oberfläche A process for bonding a component with a surface |
| 08/13/1998 | CA2279849A1 Method for cementing a component to a surface |
| 08/12/1998 | CN1190113A Glue specially for reed beam |
| 08/12/1998 | CA2229300A1 Curable composition |
| 08/06/1998 | WO1998033845A1 Unsaturated polymer polyurethane structural adhesive |
| 08/06/1998 | WO1998033645A1 Die adhesive or encapsulant of epoxy siloxane and polyepoxy resin |
| 08/06/1998 | DE19804617A1 Soluble siloxane-polyimide for heat-resistant adhesive |
| 08/06/1998 | CA2279315A1 Unsaturated polymer polyurethane structural adhesive |
| 08/04/1998 | US5790762 Optical waveguide plug adhesive consisting of at least components and method of using same |
| 07/29/1998 | EP0705316B1 Epoxy adhesive composition |
| 07/23/1998 | WO1998031765A1 Adhesive composition and applications thereof |
| 07/22/1998 | EP0726925B1 Electrically conductive adhesives |
| 07/22/1998 | CN1188501A Adhesive compositions, bonding films made therefrom and processes for making bonding films |
| 07/21/1998 | US5783713 Flexibility, low chlorine content |
| 07/15/1998 | EP0703951B1 Electrically conductive adhesive compositions |
| 07/15/1998 | CN1187932A Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil |
| 07/14/1998 | US5780581 Plateable structural adhesive for cyanate ester composites |
| 07/09/1998 | WO1998029491A1 Polymer-organoclay-composites and their preparation |
| 07/09/1998 | CA2246269A1 Polymer-organoclay-composites and their preparation |
| 07/07/1998 | US5776998 Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 07/07/1998 | US5776290 Method of preparing a coated abrasive article by laminating an energy-curable pressure sensitive adhesive film to a backing |
| 06/30/1998 | US5773113 Adhesive compositions for electronic applications |
| 06/25/1998 | DE19756554A1 Hot melt adhesives used to bond copper films on flexible printed substrates to basis materials |
| 06/23/1998 | US5770706 A curable mixture comprising an epoxide or glycidyl polyether and a conductive filler; bonding silicon chip to copper frame |
| 06/16/1998 | US5766744 Chlorine-free multilayered films |
| 06/11/1998 | WO1998024861A1 Hot-melt adhesive composition with excellent heat and cold resistance |
| 06/09/1998 | US5763026 Anchor - fixing capsules |
| 06/09/1998 | US5762812 Thermal ink jet printhead and process for preparation thereof |
| 06/04/1998 | WO1998023701A1 Adhesive |
| 05/22/1998 | WO1998021287A1 Thermosettable pressure sensitive adhesive |
| 05/19/1998 | US5753727 Chloroprene rubber adhesive with chlorinated polyolefin and epoxy resin |
| 05/14/1998 | WO1998020085A1 Binder for building structures |
| 05/13/1998 | CN1038338C Heat-resistant building structure adhesive of amino multi-function epoxy resins |
| 05/06/1998 | CN1181102A Melt-flowable materials and method of sealing surfaces |
| 04/29/1998 | CN1180369A Epoxy adhesives with dithiooxamide adhesion promoters |
| 04/29/1998 | CN1180368A Adhesive, adhesive film and adhesive-backed metal foll |
| 04/29/1998 | CN1038192C Normal temp. solidifying electrostatic flocking adhesives and its use |
| 04/21/1998 | US5741856 Chemical curing of expoxidized diene polymers using aromatic anhydride curing agents |
| 04/21/1998 | US5741575 Adhesive for printed circuit board |
| 04/16/1998 | WO1998015975A1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film |
| 04/15/1998 | EP0835917A1 Ultraviolet-curing adhesive composition and article |
| 04/15/1998 | EP0835910A1 Curable resin compositions |
| 04/09/1998 | WO1998014527A1 Metal to ceramic attachment in dental appliances |
| 04/08/1998 | EP0833874A1 Adhesive compositions, bonding films made therefrom and processes for making bonding films |
| 04/08/1998 | CN1037975C Suspensions of solidifying epoxy resin |
| 04/01/1998 | EP0832164A1 Non-aqueous solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 04/01/1998 | EP0832163A1 Solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 03/25/1998 | EP0830396A1 Application of a polymer backing onto a glass substrate |
| 03/11/1998 | CN1175613A Ordinary temp. setting heat-resistant adhesive |
| 03/05/1998 | WO1998008906A1 Fluoropolymer-epoxy resin semi-interpenetrating network composition |
| 03/04/1998 | EP0826755A2 Adhesive system for rubber/metal composites |
| 03/03/1998 | US5723191 Tackified dual cure pressure-sensitive adhesive |
| 02/24/1998 | US5721318 Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems |
| 02/24/1998 | US5721289 Consisting of free radically polymerized polymer, cationically polymerizable monomer, photo-activatable catalyst system, optional alcohol; storage stable in absence of actinic radiation |
| 02/17/1998 | US5719240 Compounds containing cyclic amidine and uretdione groups, a process for their preparation and the use thereof |
| 02/17/1998 | US5718039 Adhering copper foils, masking, etching |
| 02/11/1998 | EP0823729A1 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 02/10/1998 | US5717054 Quick-setting |
| 02/10/1998 | CA2143260C One-coat rubber-to-metal bonding adhesive |
| 02/04/1998 | EP0821717A1 Amine cross-linkable hot-melt adhesive and adhesive film |
| 02/03/1998 | US5714238 Conductive adhesive and circuit using the same |
| 02/03/1998 | US5714199 Method for applying a polymer powder onto a pre-heated glass substrate and the resulting article |
| 02/03/1998 | US5714030 Applying plastisol adhesive to atleast filter and support medium comprises vinyl chloride polymer, a plasticizer and a phenolic resin as adhesion promoting agent, bonding and curing |
| 01/29/1998 | WO1998003606A1 Heat-setting single-component lva (low-viscosity adhesive) system for bonding in the micro-range |
| 01/29/1998 | WO1998003605A1 Heat-setting single-component lva (low-viscosity adhesive) system with improved storage properties |
| 01/29/1998 | WO1998003208A1 Medical pressure-sensitive adhesives with high permeability to water vapour and high adhesive force, and plasters provided therewith |
| 01/29/1998 | DE19629750A1 Thermisch härtbares einkomponentiges Low Viskosity Adhesive-Klebstoffsystem mit verbesserten Lagerungseigenschaften Thermally curable one-component low VISCOSITY Adhesive adhesive system with improved storage properties |
| 01/29/1998 | CA2260844A1 Medical pressure-sensitive adhesives with high permeability to water vapour and high adhesive force, and plasters provided therewith |
| 01/28/1998 | EP0820492A1 Epoxy adhesives with dithiooxamide adhesion promoters |
| 01/28/1998 | EP0820491A1 Melt-flowable materials and method of sealing surfaces |
| 01/27/1998 | US5712044 Suitable for compression blow molding, intravenous fluid bags |
| 01/27/1998 | US5712039 Amine cured epoxy adhesives |
| 01/22/1998 | WO1998003047A1 Film-like adhesive for connecting circuit and circuit board |
| 01/22/1998 | DE19629082A1 Thermisch härtbares einkomponentiges Low viskosity Adhesive-Klebstoffsystem für Verklebungen im Mikrobereich Thermally curable one-component low VISCOSITY Adhesive adhesive system for bonding microscale |
| 01/21/1998 | EP0819747A1 Adhesive, adhesive film and adhesive-backed metal foil |
| 01/21/1998 | EP0819746A2 Sheet form, curable pressure-sensitive adhesive |
| 01/21/1998 | CN1170748A High-grade heat-resistant and fire-retardant resin glue for encapsulation and impregnation |
| 01/21/1998 | CN1170747A Sheet-form, curable pressure-sensitive adhesive |
| 01/21/1998 | CN1170746A Novel coating for metal surfaces and method for implementing it |
| 01/14/1998 | EP0818486A1 Powder compounds, a process for their preparation as well as their use |
| 01/13/1998 | US5708059 Epoxy resins, polyhydroxy aromatics, dispersants, diluents and water |
| 01/13/1998 | US5708058 Aqueous coating composition based on low-solvent modified epoxy resin dispersions |
| 01/13/1998 | US5707729 Adhesive for copper foils and adhesive-backed copper foil |
| 01/11/1998 | CA2210043A1 Pulverulent compounds, a process for their preparation, and their use |
| 01/07/1998 | EP0816461A2 Solvent-free epoxy based adhesives for semiconductor chip attachment and process |
| 01/07/1998 | CN1169452A Solvent-free epoxy based adhesives for semiconductor chip attachment and process for preparing same |
| 01/06/1998 | CA2068657C Moisture resistant electrically conductive cements and methods for making and using same |
| 12/30/1997 | US5703195 Polyglycidylphenyl ethers of alkylene or alkyleneoxy chains for use in microelectronics adhesives |
| 12/29/1997 | EP0705314B1 One-coat rubber-to-metal bonding adhesive |
| 12/23/1997 | US5700884 Urethane modified epoxy resin from epoxy phosphate and isocyanate prepolymer |
| 12/23/1997 | US5700581 Solvent-free epoxy based adhesives for semiconductor chip attachment and process |
| 12/09/1997 | US5695872 Thermally conductive, electrically insulating glued connection, method for the production thereof and employment thereof |
| 12/04/1997 | WO1997045500A1 Thermosetting pressure-sensitive adhesive and adhesive sheets made by using the same |
| 11/25/1997 | US5691414 Blend containing tackifier resin |
| 11/20/1997 | WO1997043352A1 Adhesive compositions and methods of use |