| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 03/22/2006 | CN1246411C Adhesive for connection of circuit |
| 03/16/2006 | WO2006005606A3 Method for treating and sticking work pieces made of metal or a metal alloy comprising a hydrated oxide and/or hydroxide layer |
| 03/15/2006 | EP0898603B1 Adhesive compositions and methods of use |
| 03/15/2006 | CN1748045A Flat rolled magnetic steel sheet or strip having its surface coated for bonding |
| 03/15/2006 | CN1746720A Method and apparatus for manufacturing 3d image display |
| 03/09/2006 | WO2005076376A3 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 03/09/2006 | US20060052628 Photostability |
| 03/09/2006 | US20060051587 Thermosetting resin composition and adhesive film |
| 03/08/2006 | EP1047740B1 Curable resin compositions |
| 03/08/2006 | CN1244661C Thermosetting rubber film for flexible circuit assembly and its preparing method |
| 03/08/2006 | CN1244660C Room temperature cured high temperature tolerant flexible epoxy adhesive and preparing method |
| 03/07/2006 | US7008693 Highly heat-resistant label |
| 03/02/2006 | US20060047050 Sulfur-crosslinkable, non-aqueous; does not require any activation treatment, such as intermediate drying, at the time of use; to provide bonding which is both mechanically effective; polyvinylpyridine-styrene-butadiene elastomer, polyester or vinyl ester resin |
| 03/02/2006 | DE102004039212A1 Rheologiesteuerung von Pickering-Emulsion durch Elektrolyte Rheology of Pickering emulsion by electrolytes |
| 03/01/2006 | EP1346002B1 Multilayer metal sandwich materials comprising epoxy-based adhesive systems |
| 03/01/2006 | CN1243810C Ultraviolet activatable adhesive film |
| 02/28/2006 | US7005394 non-woven webs of blown microfibers; porosity; formed by photocuring |
| 02/28/2006 | US7005185 Quick cure carbon fiber reinforced epoxy resin |
| 02/23/2006 | WO2006019023A1 Adhesive composition for optical disk, cured product and article |
| 02/22/2006 | EP1628363A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 02/22/2006 | EP1627024A2 Epoxy adhesives and bonded substrates |
| 02/21/2006 | US7001977 Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds |
| 02/16/2006 | WO2006017037A1 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
| 02/15/2006 | CN1735660A Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 02/14/2006 | US6998011 For use in forming structural bonds in vehicle construction, composite articles structural foams which serve to stiffen and reinforce cavities, gaps, structural members and the like |
| 02/14/2006 | CA2380380C Conductive carbon filled polyvinyl butyral adhesive |
| 02/14/2006 | CA2198612C Epoxy adhesive composition |
| 02/09/2006 | US20060030635 Photoreactive hot-melt adhesive composition |
| 02/09/2006 | US20060029811 Resin composition, method of its composition, and cured formulation |
| 02/08/2006 | EP1622977A1 Epoxy resin compositions containing mannich bases, suitable for high-temperature applications |
| 02/08/2006 | CN1732242A Adhesive composition for the direct joining of a pre-gelled polyester or vinyl ester to raw rubber |
| 02/08/2006 | CN1732215A Heat activated epoxy adhesive and use in a structural foam insert |
| 02/08/2006 | CN1240800C Well casing adhesive sand combing glue |
| 02/08/2006 | CN1240773C Road surface repairng material and its making method and use |
| 02/07/2006 | US6995193 Photocurable composition, process for producing photocurable composition, photocurable pressure-sensitive adhesive sheet, process for producing photocurable pressure-sensitive adhesive sheet, and method of bonding |
| 02/07/2006 | CA2253824C Siloxane-modified adhesive/adherend systems |
| 02/01/2006 | EP1620521A2 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 02/01/2006 | CN1729256A UV-curable epoxy acrylates |
| 02/01/2006 | CN1727429A Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| 02/01/2006 | CN1727428A Quick solidifiable bonding agent in use for squeezing and coating on vehicle, and preparation method |
| 02/01/2006 | CN1239663C Making method of epoxy resin adhesive for building |
| 02/01/2006 | CN1239654C A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 01/25/2006 | EP1278801B1 Formulation for strippable adhesive and coating films |
| 01/25/2006 | EP1209211B1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/25/2006 | CN1726242A Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 01/25/2006 | CN1238460C Binder for powder metallurgy, mixed powder for powder metallurgy and method for producing same |
| 01/25/2006 | CN1238459C High connecting intensity thermosetting conducting glue |
| 01/25/2006 | CN1238458C Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 01/19/2006 | DE102004031190A1 Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape for bonding electronic components and conductor tracks |
| 01/19/2006 | DE102004031189A1 Hitzeaktivierbares und vernetzbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated and curable adhesive tape for bonding electronic components and conductor tracks |
| 01/19/2006 | DE102004031188A1 Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape for bonding electronic components and conductor tracks |
| 01/18/2006 | CN1723590A Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 01/12/2006 | DE19649893B4 Elektrisch leitender Klebstoff und dessen Verwendung Electrically conductive adhesive and its use |
| 01/11/2006 | EP1614734A1 Heat-activatable adhesive tape for bonding electronic components and printed circuit boards |
| 01/11/2006 | CN1719635A 1-3 structure huge magnetoelectric material and preparing process thereof |
| 01/11/2006 | CN1236003C Adhesive and electrical device |
| 01/11/2006 | CN1236002C Heat-setting single-component low-viscosity-adhesive system with improved storage properties |
| 01/05/2006 | DE102004027791A1 Klebstoff, enthaltend Adipinsäureester Adhesive comprising adipic |
| 01/04/2006 | EP1612251A1 Heat-activatable adhesive tape for bonding electronic components and printed circuit boards |
| 01/04/2006 | CN1715355A Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 01/04/2006 | CN1715353A Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 01/04/2006 | CN1234796C Epoxy modified organic silicon resin adhesive |
| 01/04/2006 | CN1234795C Weathering-resistant and permeable adhesive for paving a road and its constitutional body |
| 12/29/2005 | WO2005123803A1 Cationically photopolymerizable composition and optoelectronic component using same |
| 12/29/2005 | US20050288437 Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 12/29/2005 | US20050287363 Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 12/28/2005 | EP1123348B1 Impact-resistant epoxide resin compositions |
| 12/28/2005 | CN1714130A Uv-cure adhesive composition for optical disk, cured material and goods |
| 12/28/2005 | CN1712485A Single-component binder of rotor coil for brushless generator |
| 12/28/2005 | CN1233768C Epoxy resin adhesive containing dimalea mic and preparation process thereof |
| 12/28/2005 | CN1233767C Adhesive for slowly binding prestressed rib |
| 12/22/2005 | WO2005121269A1 Adhesive comprising adipate ester |
| 12/21/2005 | CN1710008A High-temperature-resistant aviation-tolerant lubricating oil adhesive and its preparing method |
| 12/20/2005 | US6977279 polyurethane blocked with phenolic OH-group in a hydrocarbon resin, a polyamine compound, an epoxy resin, 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine catalyst; curable at room temperature to a uniform film |
| 12/20/2005 | US6977024 Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies |
| 12/15/2005 | WO2005118734A1 Epoxy adhesive composition |
| 12/15/2005 | US20050276916 Hybrid adhesives, articles, and methods |
| 12/14/2005 | EP1603986A1 Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |
| 12/14/2005 | EP1603985A1 A conductive adhesive composition |
| 12/14/2005 | EP1328600B1 Acid pretreatment for adhesive |
| 12/14/2005 | CN1706905A Epoxy resin sealant for pressure jointed pipes and its production process |
| 12/14/2005 | CN1231539C Low temperature bonding adhesive composition |
| 12/07/2005 | EP1602702A1 Epoxy adhesive composition |
| 12/07/2005 | CN1704457A Adhesive composition containing light-sensitive polymer and bonding tablet using the composition |
| 12/07/2005 | CN1704456A Antiwear epoxy resin adhesive |
| 12/07/2005 | CN1231099C Insulation material for printed circuit board and method for making printed circuit board by same |
| 12/01/2005 | WO2005113689A1 Filler material, especially for filling cavities, especially of structural elements, method of production and structural element |
| 12/01/2005 | CA2567536A1 Filler material, especially for filling cavities, especially of structural elements, method of production and structural element |
| 11/30/2005 | CN1702137A Process for preparing epoxy adhesive capable of curing at room temperature for special assembly |
| 11/30/2005 | CN1229465C Epoxy adhesive capable of using at ultralow-temp. and its preparation and application method |
| 11/30/2005 | CN1229464C Epoxy based reinforcing patches with improved adhesion to oily metal surfaces |
| 11/29/2005 | US6969919 Semiconductor package production method and semiconductor package |
| 11/24/2005 | WO2005112091A1 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 11/24/2005 | WO2005111169A1 Connecting material |
| 11/23/2005 | EP1598864A2 Hardenable pressure-senstitive adhesive sheet for semiconductors and process for producing a semiconductor device |
| 11/23/2005 | EP1598398A1 Curable composition |
| 11/23/2005 | EP1598393A1 Filler based on polymer coated particles, for filling of cavities, particularly of structural elements, preparation thereof and structural element |
| 11/23/2005 | EP1597332A1 Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
| 11/23/2005 | CN1701106A Pressure sensitive adhesive composition for electro-magnetic shielding film and electro-magnetic shielding filter using the same |
| 11/23/2005 | CN1228383C Paste for connecting circuit, anisotropic conductive paste and applications thereof |