Patents
Sitemap › C09 - Dyes; Paints; Polishes; Natural resins; Adhesives; Compositions not otherwise provided for; Applications of materials not otherwise provided for › C09J - Adhesives; Non-mechanical aspects of adhesive processes in general; Adhesive processes not provided for elsewhere; Use of materials as adhesives › C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472)
07/2003
07/03/2003US20030125423 Adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene; improved peel and shear strength
07/03/2003US20030124355 2,4-toluenebis(N,N-dimethyl urea) catalyst; preferably contains a latent curing agent, such as dicyandiamide.
07/03/2003US20030122257 Electrically conductive paste and semiconductor device prepared by using the paste
07/03/2003US20030121606 Low read-through epoxy-bonded SMC
07/02/2003EP1323739A2 Preparation of epoxidized polyalkenylenes
07/02/2003CN1427035A Paste for connecting circuit, anisotropic conducting paste and application thereof
07/01/2003US6586089 Adhesive layer that contains epoxy-terminated adduct of an epoxy resin and a nitrile rubber
06/2003
06/26/2003WO2003052017A1 Method for connecting two bodies
06/26/2003WO2003052016A2 Dual cure b-stageable adhesive for die attach
06/26/2003US20030119987 Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates
06/25/2003EP0620259B1 Epoxy/polyester hot melt compositions
06/25/2003CN1426437A Non-aqueous solvent-free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers
06/25/2003CN1425731A Adhesive for slowly binding prestressed rib
06/25/2003CN1112419C Non-aqueous solvent free process for making UV carable adhesives and sealants from epoxidized monohydroxylated diene polymers
06/25/2003CN1112418C Solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers
06/24/2003US6583259 Adhesive in wet concrete; monoacrylate of an ethoxylated or propyloxylated bisphenol is curable synthetic resin, and curing agent; good adhesion to wall of wet drillhole
06/22/2003CA2414932A1 Preparation of epoxidized polyalkenylenes and use of phosphonic acids and derivatives thereof as catalysts
06/19/2003US20030111519 Fluxing compositions
06/19/2003US20030111175 Adhesive with glycidyl (meth) acrylate
06/19/2003US20030111174 A fast curable blends comprising a reactive elastomer, an epoxy resin, a phenol resin and a curing accelerator; used in flip-chip mounting, preventing the popcorn phenomenon and delamination
06/18/2003EP1319232A1 Metal bonding film compositions
06/17/2003US6579588 Substrate provided with removable adhesive of polyepoxide, curing agent and microspheres
06/12/2003US20030108746 Halogen free flame retardant adhesive resin coated composite
06/11/2003EP1317499A1 Method for cross-linking polyacrylates
06/10/2003US6576297 Curable resin compositions
06/10/2003US6576081 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A
06/05/2003US20030102573 Adhesive film for semiconductor, lead frame and semiconductor device using the same
06/05/2003US20030102466 Anisotropic conductive adhesive film
06/04/2003EP1316597A2 Glycidyl (meth)acrylate containing adhesive
06/04/2003EP1315780A2 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
06/04/2003EP1165647B1 Single component adhesive with an adaptable open joint time
06/04/2003CN1422316A Impact-resistant epoxy resin compositions
06/04/2003CN1422293A Aqueous two-component cross-linkable composition
06/03/2003US6572980 Curable epoxy or episulfide containing aromatic compound and curing agent; repair, replacement, recovery and/or recycling of electronics
06/03/2003US6572971 Structural modified epoxy adhesive compositions
05/2003
05/28/2003EP1314748A2 Curable resin compositions
05/28/2003CN1420151A Super-strong liquid pressure-resistant adhesive
05/28/2003CN1420150A Adhesive for connection of circuit
05/22/2003WO2003042316A1 Low read-through epoxy-bonded smc
05/22/2003US20030094237 For manufacturing/implanting bioprostheses such as heart valve prostheses, surgical patch, annuloplasty rings, and pacemakers
05/22/2003CA2466063A1 Low read-through epoxy-bonded smc
05/21/2003EP0782601B1 Epoxy adhesive composition
05/21/2003CN1109063C Solidifying agent of epoxy resin
05/20/2003US6565696 Photopolymerization; using photoinitiator
05/15/2003WO2003040251A1 High temperature epoxy adhesive films
05/15/2003WO2003040250A1 Hybrid adhesives, articles, and methods
05/14/2003EP1012200B1 Epoxy resin compositions
05/14/2003EP0861278B1 Reactive resin manufacture
05/14/2003CN1417282A Structural glue containing nano material
05/08/2003WO2003037976A1 Curable organic resin composition
05/06/2003US6558797 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same
05/06/2003US6558576 Luminescent electroconductive adhesive
05/01/2003US20030082385 Mixture of carbon fibers, epoxy resin and curing agents
04/2003
04/29/2003CA2371166C Photocatalyst composite comprising fluorinated polymer and process for producing same
04/24/2003US20030078322 Conductive resin compositions and electronic parts using the same
04/24/2003US20030077423 Laminates with structured layers
04/24/2003US20030076386 Inkjet print head and method for making the same
04/23/2003EP1303571A1 Polyimide hybrid adhesives
04/23/2003EP1034203B1 Waterborne polyurethanes with urea-urethane linkages
04/23/2003EP0938526B1 Thermosettable pressure sensitive adhesive
04/17/2003WO2003031529A1 Laminates with structured layers
04/17/2003WO2003031492A1 Thermally reworkable epoxy resins and compositions based thereo n
04/16/2003EP1302496A1 Insulating resin composition, adhesive resin composition and adhesive sheeting
04/16/2003EP1301553A2 High functional polymers
04/16/2003CN1411478A Ambient-temp-stable one-part curable epoxy adhesive
04/15/2003US6548608 Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic
04/15/2003US6548566 Laminating adhesives hardenable by radiation
04/15/2003US6548189 Epoxidized cashew nutshell liquid, a catalyst, and bisphenol a diglycidyl ether
04/15/2003US6548175 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
04/10/2003WO2002070623A3 Protective articles
04/10/2003US20030069335 Structural hot melt material and methods
04/10/2003US20030069331 Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
04/09/2003EP1299497A2 Epoxy based reinforcing patches with improved adhesion to oily metal surfaces
04/09/2003EP1299493A1 Oriented acrylic hotmelts$i()
04/09/2003EP1299447A2 No-flow flux adhesive compositions
04/03/2003US20030065048 Radiation curable adhesive
04/03/2003US20030062630 Heat resistant thermoplastic resin, epoxy resin and triphenol curing agent; reliable low temperatures bonding
04/02/2003CN1407049A Flexible printing circuit board adhesive
04/02/2003CN1104441C Modified polyalkadiene-containing compositions
04/01/2003US6541553 Formulation for strippable adhesive and coating films and high performance adhesive
03/2003
03/27/2003WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes
03/27/2003WO2003025080A1 Die attach adhesives for semiconductor applications, processes for producing semiconductor devices and semiconductor devices produced by such processes
03/27/2003US20030057538 Die attach adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
03/26/2003CN1405260A Adhensive for producing cladding film of flexible printed circuit board and preparation method thereof
03/26/2003CN1405259A Adhensive for producing flexible printed circuit board base board and preparation method thereof
03/25/2003US6537659 Pressure sensitive adhesives
03/20/2003WO2003022953A1 Structural hot melt material and methods
03/20/2003WO2003022952A1 Adhesive for gas barrier laminates and laminated films
03/20/2003WO2003022949A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
03/20/2003WO2003022904A1 Network polymers comprising epoxy-terminated esters
03/20/2003US20030054162 Adhesive for joining surface of semiconductor
03/20/2003US20030051807 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
03/20/2003CA2460312A1 Network polymers comprising epoxy-terminated esters
03/20/2003CA2427866A1 Structural hot melt material and methods
03/19/2003EP1293549A1 Adhesive for resin roll assembly and resin roll
03/19/2003EP1292630A1 Method for producing aliphatic oligocarbonate diols
03/13/2003WO2003020816A1 Fluxing compositions
03/13/2003US20030049883 Semiconductor package production method and semiconductor package
03/13/2003US20030049453 Paintable material
03/13/2003US20030047279 Adhesive and coating formulations for flexible packaging
1 ... 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 ... 85