| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 07/04/2002 | WO2002031077A3 Two component thermosettable compositions useful for producing structural reinforcing adhesives |
| 07/04/2002 | WO2001083634A3 Formulation for strippable adhesive and coating films |
| 07/04/2002 | US20020084019 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A |
| 07/04/2002 | DE10062009A1 Mehrschichtige Sandwich-Materialien mit organischen Zwischenschichten auf Epoxidbasis Multi-layer sandwich materials with organic interlayers epoxy |
| 07/03/2002 | EP1219694A1 Photocurable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
| 07/03/2002 | EP1218950A1 Method for encapsulating components |
| 07/02/2002 | CA2123610C A dispersion-based heat sealable coating |
| 06/27/2002 | US20020081434 Thermosetting resin composition composed mainly of a polycarbodiimide obtained from organic polyisocyanates |
| 06/27/2002 | US20020079051 Process for coating and laminating film using 100% solids adhesive at room temperature |
| 06/26/2002 | CN1355820A Process for preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 06/25/2002 | US6410642 Adhesive and semiconductor devices |
| 06/20/2002 | WO2002048277A1 Multilayer metal sandwich materials comprising epoxy-based adhesive systems |
| 06/20/2002 | WO2002009863A3 Microcapsule, method for producing the same, and the use thereof in adhesives |
| 06/20/2002 | WO2001094493A3 Epoxy based reinforcing patches with improved adhesion to oily metal surfaces |
| 06/20/2002 | US20020076566 Ambient-temperature-stable, one-part curable epoxy adhesive |
| 06/12/2002 | EP1073697B1 Epoxy/thermoplastic photocurable adhesive composition |
| 06/12/2002 | EP0964792B1 Adhesive systems for a one or multi step adhesive binding method, method for adhesive binding of printed matter |
| 06/11/2002 | US6404532 Electrochromic system |
| 06/11/2002 | US6403678 Rope of chemical anchoring adhesive |
| 06/06/2002 | WO2002026888A3 Low temperature bonding adhesive composition |
| 06/06/2002 | WO2002020686A3 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| 06/06/2002 | WO2002004541A3 No-flow flux adhesive compositions |
| 06/05/2002 | EP0995139B1 Method for fixing an optical fiber cable in a connector for a connectable optical fiber connection |
| 06/04/2002 | US6399672 Oil soluble unsaturated compounds and photoinitiators |
| 05/30/2002 | US20020062918 Adhesives and electric devices |
| 05/29/2002 | EP1209253A2 Process for treating adhesion promoted metal surfaces with epoxy resins |
| 05/29/2002 | EP1209211A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 05/29/2002 | EP1208179A1 Bonding of concrete parts |
| 05/29/2002 | CN1085931C Resin-coated copper foil for multilayer printed wiring board and multiplayer printed wiring board provided with said copper foil |
| 05/23/2002 | US20020061972 Safe and consistant filling of end use containers of one component heat curable, solvent free, hot melt epoxy resin compositions which have a melting point less than 55 degrees C. |
| 05/22/2002 | CN1350045A Binder and electric apparatus |
| 05/21/2002 | US6391140 Adhesive material with flexibility modifiers |
| 05/16/2002 | WO2002039442A2 Radiation-curable compositions for optical media |
| 05/16/2002 | WO2001079374A3 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 05/15/2002 | EP1204691A1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 05/15/2002 | EP0963421B1 Pressure-sensitive adhesive tape |
| 05/14/2002 | US6387508 Electrically insulating composition for bonding to heated metal substrate comprising polyolefin polymer adapted for elevated temperature crosslinking and co-bonding agent mixed with polyolefin polymer |
| 05/14/2002 | US6387486 Crosslinked poly(alkylene oxide) release layer |
| 05/14/2002 | US6387310 Thermosetting resin composition for prestressed concrete tendon, its use and prestressed concrete tendon using the composition |
| 05/10/2002 | WO2002036343A1 Process for coating and laminating film using 100% solids adhesive at room temperature |
| 05/10/2002 | WO2002004542A3 High functional polymers |
| 05/02/2002 | WO2002034812A1 High functional polymers |
| 05/02/2002 | EP1200502A1 Amine hardener for epoxy resins |
| 05/02/2002 | EP1200036A1 Adhesive systems |
| 05/02/2002 | CA2422897A1 High functional polymers |
| 05/01/2002 | CN1347440A Backing for adhesive tape and such tape |
| 05/01/2002 | CN1083872C Solvent-free epoxy based adhesives for semiconductor chip attachment and process for preparing same |
| 05/01/2002 | CN1083871C Epoxy adhesives with dithiooxamide adhesion promoters |
| 04/30/2002 | US6380322 Crosslinked blend |
| 04/23/2002 | US6376070 Blend of acrylic polymer, photopolymerizable compound and photoinitiators |
| 04/18/2002 | WO2002031077A2 Two component thermosettable compositions useful for producing structural reinforcing adhesives |
| 04/18/2002 | WO2002031073A1 Acid pretreatment for adhesive |
| 04/18/2002 | WO2002002709A8 Oriented acrylic hotmelts$i() |
| 04/18/2002 | US20020045019 Fixing label |
| 04/18/2002 | CA2425414A1 Two component thermosettable compositions useful for producing structural reinforcing adhesives |
| 04/17/2002 | EP1196471A1 Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 04/17/2002 | CN1345255A Hollow yarn membrane module, potting agent therefor and method for deaeration of liquid chemicals |
| 04/16/2002 | US6372862 Comprising polyviny butyral, a novolak or resole and a hexamethylenetetramine adhesive hardener which forms an adduct with a phenolic resin; adhesive strength after heating; no drying step; no industrial wastes; powder coating; |
| 04/11/2002 | WO2002028849A1 Reworkable epoxidized 1-(cyclo)alkenyl ether/polycarboxylic acid product |
| 04/11/2002 | WO2001081494A3 Non-aqueous solvent-free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 04/04/2002 | WO2002026888A2 Low temperature bonding adhesive composition |
| 03/28/2002 | WO2002024792A2 Adhesive compositions including self-assembling molecules, adhesives, articles, and methods |
| 03/28/2002 | WO2001074960A3 Halogen free flame retardant adhesive resin coated composite |
| 03/28/2002 | US20020037976 Photo curable adhesive composition |
| 03/27/2002 | EP1189994A2 Oil soluble radiation curable metal-containing compounds and compositions |
| 03/21/2002 | WO2002023556A1 Metal bonding film compositions |
| 03/21/2002 | WO2001096588A3 Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 03/21/2002 | CA2419293A1 Metal bonding electrically insulating film composition |
| 03/20/2002 | EP1188810A2 Electrically conductive hot-melt silicone adhesive composition |
| 03/20/2002 | EP1188778A1 Thermosetting resin composition, and resin coated metal foil, prepreg and film-shaped adhesive all using the composition |
| 03/20/2002 | EP1187888A1 Adhesive/sealant composition and bonded structure using the same |
| 03/20/2002 | EP0866809B1 Modified polyalkadiene-containing compositions |
| 03/19/2002 | US6359039 Preparing solution containing a barbituric acid modified bismaleimide; mixing with an methyl ethyl ketone solution containing carboxylated acrylonitrile rubber, epoxy resin, hardening agent and catalyst |
| 03/19/2002 | US6359036 1-Aminopyrrolidine or its salt as epoxy resin hardener |
| 03/19/2002 | US6358354 UV and thermally curable adhesive formulation |
| 03/14/2002 | WO2002020686A2 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
| 03/14/2002 | WO2002020647A1 Method for cross-linking polyacrylates |
| 03/14/2002 | US20020032280 One-part, thermally-curable adhesive composition comprising: an epoxy resin substantially free of hydroxyl functionality; and an anhydride curing agent. |
| 03/13/2002 | EP1185595A2 Multi-layered sealant |
| 03/13/2002 | EP1185574A2 Poly(mercaptopropylaryl) curatives |
| 03/13/2002 | CN1339525A Resin firming agent containing phosphorus and nitrogen and fireproof resin composition containing said firming agent |
| 03/13/2002 | CN1080740C UV curable composition |
| 03/06/2002 | CN1339055A Adhesive, electrode-connecting structure, and method of connecting electrodes |
| 03/05/2002 | US6352762 Easily adhesive polyamide film |
| 02/28/2002 | US20020025431 Tape automated bonding (TAB); adhesive strength, moderate elastic modulus and coefficient of expansion; adhesive layer of a thermoplastic resin and a polyepoxide having skeleton containing one of dicyclopentadiene, terpene, or biphenyl |
| 02/27/2002 | CN1337975A Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 02/27/2002 | CN1079816C Adhesive composition for rubber fibre, synthetic fibre for reinforcement of ruber and products of rubber reinforced withfibres |
| 02/26/2002 | US6350803 Formulation of conductive putty |
| 02/21/2002 | DE10037729A1 Mikrokapsel, Verfahren zu deren Herstellung und deren Verwendung in Klebstoffen Microcapsule, to processes for their preparation and their use in adhesives |
| 02/20/2002 | EP0724613B1 Binders based on fat chemical reaction products |
| 02/20/2002 | CN1079417C Glue specially for reed beam |
| 02/19/2002 | US6348118 Thermosetting polyacrylic ester pressure sensitive adhesive, epoxy resin, a pigment, curing until said composition undergoes a detectable color change; mirrors on windshields |
| 02/19/2002 | CA2188344C Plateable structural adhesive for cyanate ester composites |
| 02/19/2002 | CA2043732C Epoxy resin compositions |
| 02/14/2002 | US20020018603 Hydrodynamic bearing device |
| 02/12/2002 | US6346573 Amine-modified epoxy resin reacted in presence of latent hardener |
| 02/07/2002 | WO2002009863A2 Microcapsule, method for producing the same, and the use thereof in adhesives |
| 02/06/2002 | CN1334397A Method for applying chemical anchoring adhesion |
| 02/06/2002 | CN1334305A Viscous and amine-cured chemical anchoring adhesive |
| 02/06/2002 | CN1334304A Chemical canchoring adhesive rope |