| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 01/11/2000 | US6013339 Formed by sealing liquid crystal between substrates having electrodes and alignment film with seal material, the process comprising the steps of attaching two substrates in a vacuum, compressing under pressure; straightness, moisture resistance |
| 01/06/2000 | WO2000000566A1 Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition |
| 01/05/2000 | EP0697937B1 Surface treating articles and methods of making same |
| 12/29/1999 | WO1999067343A1 Thermosettable adhesive |
| 12/29/1999 | WO1999067340A1 Adhesive which hardens in several stages |
| 12/29/1999 | WO1999067316A1 Adhesive compositions |
| 12/29/1999 | CA2335567A1 Adhesive which hardens in several stages |
| 12/29/1999 | CA2335031A1 Adhesive compositions |
| 12/28/1999 | US6008150 Binder composition for producing fibrous webs and a process for producing fibrous web mouldings |
| 12/23/1999 | DE19927077A1 Multistage hardening hot melt adhesive, useful for the production and sealing of boxes and cartons for high-stress applications, e.g. ready-to-bake meals |
| 12/22/1999 | EP0964792A1 Adhesive systems for a one or multi step adhesive binding method, method for adhesive binding of printed matter |
| 12/15/1999 | EP0963421A1 Pressure-sensitive adhesive tape |
| 12/15/1999 | CN1047399C Topographical method |
| 12/14/1999 | US6001203 Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display |
| 12/09/1999 | WO1999063017A1 Radiation curable adhesive for bonding of optical discs |
| 12/01/1999 | CN1237274A Semiconductor, semiconductor chip mounting substrate, methods of manufacturing device and substrate, adhesive and adhesive double coated film |
| 11/30/1999 | US5993581 A) an epoxy resin; b) a thixotropy agent mainly containing silica fine particles; c) a lubricant mainly containing spheroidal fine particles; d) a polyamine or polymercaptan curing agent |
| 11/25/1999 | WO1999060068A1 Adhesive and coating formulations for flexible packaging |
| 11/24/1999 | EP0959498A1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film |
| 11/24/1999 | EP0958326A1 Method for gluing a surface to a component |
| 11/24/1999 | EP0958319A1 Unsaturated polymer polyurethane structural adhesive |
| 11/18/1999 | WO1999058591A1 Products for repairing, filling, glueing, protecting, organic or anorganic materials by mixing curable reactive compositions |
| 11/16/1999 | US5986038 Adhesive composition |
| 11/16/1999 | CA2152776C Liquid adhesive thermoset composition |
| 11/16/1999 | CA2000761C Curable epoxide resin compositions |
| 11/11/1999 | WO1999057216A1 Epoxy/thermoplastic photocurable adhesive composition |
| 11/11/1999 | WO1999057171A1 Hardener for epoxy resin |
| 11/10/1999 | EP0788522B1 Acetal derivatives of resole compounds |
| 11/03/1999 | EP0953621A1 Adhesive resin composition and sealing resin composition |
| 10/26/1999 | US5973056 Hot-melt adhesive composition excellent in heat resistance and cold resistance |
| 10/13/1999 | CN1231320A Equipment and technology for adhesive repairing demaged cylinder of car |
| 10/12/1999 | US5965269 Epoxy resin having a weight average molecular weight of less than 5000 and a curing agent; a high molecular weight (hmw) component compatible with the epoxy resin; a hmw component incompatible with the epoxy resin and a cure accelerator |
| 10/07/1999 | WO1999050369A1 Adhesive composition and precursor thereof |
| 10/06/1999 | CN1230974A Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range |
| 10/06/1999 | CN1230919A Readily bondable polyamide film |
| 10/05/1999 | US5962093 Thermally stable polyetheramines |
| 10/05/1999 | US5961767 Method for forming micron-sized and smaller liquid droplets |
| 09/29/1999 | EP0945498A1 A seal assembly with new resin stabilized adhesive composition to bond an insert member to the elastomeric seal material |
| 09/28/1999 | US5959256 Multilayer printed wiring board |
| 09/21/1999 | US5955543 Polymer adhesives for electroconductive or thermal conductive fillers |
| 09/15/1999 | EP0941296A1 Adhesive |
| 09/14/1999 | US5952071 Curable adhesive system |
| 09/07/1999 | US5948881 Polyamide curing agents based on mixtures of polyethylene-amines, piperazines and deaminated bis-(p-aminocyclohexyl) methane |
| 09/07/1999 | US5948863 Pressure sensitive structural adhesive or sealant composition comprising: a glycidyl ether-functional telechelic polymer and a heterotelechelic polydiene block polymer with glycidyl ether functionality; dual curing system of polyamine and sulfur or |
| 09/07/1999 | US5948491 Toner fuser member and new adhesion priming composition included therein |
| 09/01/1999 | EP0938526A1 Thermosettable pressure sensitive adhesive |
| 09/01/1999 | CN1227244A Adhesive for colour glazed glass |
| 08/31/1999 | US5945188 Insulating film of adhesive layer, polyamide resin, inorganic filler, epoxy resin layer with siloxane |
| 08/25/1999 | EP0937763A2 Conductive epoxy adhesive |
| 08/25/1999 | EP0820492B1 Epoxy adhesives with dithiooxamide adhesion promoters |
| 08/25/1999 | CN1226915A Thermosetting pressure-sensitive adhesive and adhesive sheets therefrom |
| 08/24/1999 | US5942592 Reacting a diamine mixture comprising diaminopolysiloxane, an alicyclic diamine and an aromatic diamine with aromatic tetracarboxylic acid or anhydride and polyimidizing the resulting polyamic acid |
| 08/24/1999 | US5942583 Primer composition |
| 08/24/1999 | US5942073 Siloxane-modified adhesive/adherend systems |
| 08/19/1999 | WO1999028378A8 Adhesives and sealants containing adhesion promoter comprising waste powder prime |
| 08/18/1999 | EP0935643A1 Metal to ceramic attachment in dental appliances |
| 08/18/1999 | CN1226281A Heat-setting single-component low-viscosity-adhesive system with improved storage properties |
| 08/17/1999 | US5939196 Coating for metal surfaces and method for implementing it |
| 08/12/1999 | WO1999040150A1 Adhesive composition and precursor thereof |
| 08/05/1999 | WO1999038903A1 Snap cure adhesive based on anhydride/epoxy resins |
| 08/05/1999 | WO1999038902A1 Color indicator for completion of polymerization for thermosets |
| 08/05/1999 | WO1999023528A3 Electrochromic system |
| 08/03/1999 | US5932656 Chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
| 07/29/1999 | DE19751738A1 Halogen-free epoxy resin useful as coating for electronic components |
| 07/28/1999 | EP0931803A1 Polymer compositions, their preparation and their use |
| 07/28/1999 | EP0931802A1 Polyurethane resins, process for producing the same, and uses thereof |
| 07/28/1999 | CN1224434A Cold curing epoxy resin formulation |
| 07/27/1999 | US5929272 Binders, adhesives, sealing compounds; environmental friendliness |
| 07/27/1999 | US5929141 Consists of a flexible polyepoxide resin, stoichiometric amount of amine-terminated acrylonitrile-butadiene copolymer as curing agent, electroconductive noble metal filler; high impact strength, elongation, resilience and adhesion |
| 07/27/1999 | US5928757 Polyimide |
| 07/22/1999 | WO1999036484A1 Curable epoxy-based compositions |
| 07/22/1999 | CA2318167A1 Curable epoxy-based compositions |
| 07/21/1999 | CN1044256C Process for preparation of chip glue in use of surface assembling technology |
| 07/14/1999 | CN1222927A Polyamide based laminating, coverlay and bond ply adhesive with heat activated cure component |
| 07/14/1999 | CN1222552A Epoxy resin adhesive containing rigid mesomorphic radical and flexible chain and its preparation |
| 07/08/1999 | WO1999033931A1 Laminating adhesive hardenable by radiation and use of same |
| 07/08/1999 | WO1999033897A1 Laminating adhesives hardenable by radiation |
| 07/08/1999 | CA2316198A1 Laminating adhesives hardenable by radiation |
| 07/08/1999 | CA2316197A1 Laminating adhesive hardenable by radiation and use of same |
| 07/07/1999 | EP0821717B1 Amine cross-linkable hot-melt adhesive and adhesive film |
| 06/30/1999 | EP0925914A1 Readily bondable polyamide film |
| 06/24/1999 | DE19857237A1 Laminating adhesive satisfying criteria for producing foil composites contains epoxide, low-molecular triol or polyol, photoinitiator and optionally other compounds, |
| 06/24/1999 | DE19857203A1 Laminating adhesive satisfying criteria for producing foil composites, for laminating paper, plastics, metal foil, etc. |
| 06/17/1999 | WO1999029790A1 Curable resin compositions |
| 06/16/1999 | EP0785973B1 Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems |
| 06/10/1999 | WO1999028378A1 Adhesives and sealants containing adhesion promoter comprising waste powder prime |
| 06/10/1999 | WO1999028362A1 Waterborne polyurethanes with urea-urethane linkages |
| 06/10/1999 | CA2312796A1 Waterborne polyurethanes with urea-urethane linkages |
| 06/09/1999 | EP0921146A1 Polyamide curing agents based on mixtures of polyethelene-amines, piperazines and deaminated bis-(p-amino-cyclohexyl) methane |
| 06/09/1999 | EP0920482A1 Fluoropolymer-epoxy resin semi-interpenetrating network composition |
| 06/08/1999 | US5910542 Adhesives and sealants based on telechelic polymers and heterotelechelic block polymers with dual cure systems |
| 06/08/1999 | US5910541 Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems |
| 06/01/1999 | US5908902 Self-emulsifying aqueous epoxy resin dispersions |
| 05/25/1999 | CA1340560C Colour-changeable adhesive |
| 05/19/1999 | EP0915753A1 Siloxane-modified adhesive/adherend systems |
| 05/19/1999 | CN1217005A UV curable composition |
| 05/14/1999 | WO1999023528A2 Electrochromic system |
| 05/14/1999 | CA2308308A1 Electrochromic system |
| 05/12/1999 | EP0914398A1 Heat-setting single-component lva (low-viscosity adhesive) system with improved storage properties |
| 05/11/1999 | US5902843 Mixture of copolyester containing tetramethylene glycol units, copolyamide containing laurolactam units, bisphenol a epoxide; wash resistant |