| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 03/22/2001 | WO2000075241A3 Oil soluble radiation curable metal-containing compounds and compositions |
| 03/21/2001 | EP1085071A2 Phenolic resin-based adhesive composition and process for producing the same |
| 03/21/2001 | CN1288481A Curable epoxy-based compositions |
| 03/15/2001 | WO2001018887A1 Method for encapsulating components |
| 03/15/2001 | WO2001018144A1 Photocurable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
| 03/13/2001 | US6200408 Method for cementing a component to a surface |
| 03/06/2001 | US6198017 Adhesive which adheres to both dry and wet skin comprising mixture of hydrophilic acrylate copolymer containing tertiary amino groups, hydrophobic acrylate copolymer containing carboxyl groups, one or more acids, polyol, crosslinking agent |
| 03/06/2001 | US6197882 Curable resin composition and adhesive |
| 03/06/2001 | US6197617 Semiconductor device with high reliability of connection between projective electrode of semiconductor element and conductive wire of substrate and method of manufacturing the same |
| 03/06/2001 | US6196730 Fiber optic connector containing a curable adhesive composition |
| 03/01/2001 | WO2001014485A1 Bonding of concrete parts |
| 03/01/2001 | CA2369003A1 Bonding of concrete parts |
| 02/27/2001 | US6194523 Comprising polyesterpolyurethane and an epoxy resin |
| 02/22/2001 | WO2001012694A1 Adhesive composition |
| 02/22/2001 | DE19937091A1 Adhäsivsysteme II Adhesive systems II |
| 02/21/2001 | EP1077243A2 Film adhesive composition for electronic packaging |
| 02/21/2001 | CN1284526A Film adhesion agent composition for electronic encapsulation |
| 02/21/2001 | CN1062194C Photocatalyst composition and method for producing the same |
| 02/15/2001 | WO2001010388A1 Adhesive systems |
| 02/14/2001 | EP1076082A1 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same |
| 02/13/2001 | US6187874 Comprising, as a resin component, two polyimide resins different in glass transition temperature by at least 20 degrees c from each other, and an epoxy resin |
| 02/13/2001 | US6187442 Thermosetting resin compositions, electrical laminates obtained therefrom and process of producing these |
| 02/08/2001 | WO2001055277A1 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 02/08/2001 | WO2001009221A1 Amine hardener for epoxy resins |
| 02/08/2001 | WO2001009219A1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 02/08/2001 | WO2000077066A3 Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 02/08/2001 | DE19937093A1 Adhesive system comprising a cationic- and radical initiator and cationically/radically polymerizable component is useful for bonding radically and/or cationically curable materials to teeth |
| 02/08/2001 | CA2380296A1 Amine hardener for epoxy resins |
| 02/07/2001 | EP1073697A1 Epoxy/thermoplastic photocurable adhesive composition |
| 02/07/2001 | CN1282771A Dual-component structural adhesive of epoxy resin for buildings |
| 02/01/2001 | DE19935325A1 Lösemittelfreie, raumtemperaturhärtende Reaktivsysteme und ihre Verwendung zur Herstellung von Klebstoffen, Dichtungsmassen, Vergußmassen, Formteilen oder Beschichtungen Solvent-free, room temperature curing reactive systems and their use for the production of adhesives, sealants, casting compounds, moldings or coatings |
| 01/30/2001 | US6180742 Carboxy copolymer, neutralizer and crosslinker |
| 01/30/2001 | US6180200 Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
| 01/24/2001 | CN1281491A Curable resin compositions |
| 01/23/2001 | US6176965 Method for producing a bonded structure of aluminum alloy pressed plate |
| 01/17/2001 | EP1068277A1 Adhesive composition and precursor thereof |
| 01/17/2001 | CN1280589A Waterborne polyurethanes with usea-urethane linkages |
| 01/10/2001 | EP1067163A1 Adhesive and semiconductor devices |
| 01/10/2001 | EP1067162A1 Adhesive and semiconductor devices |
| 01/04/2001 | WO2001000698A2 Poly(mercaptopropylaryl) curatives |
| 01/04/2001 | CA2365383A1 Poly(mercaptopropylaryl) curatives |
| 12/28/2000 | WO2000078887A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 12/27/2000 | EP1062289A1 Luminescent electroconductive adhesive |
| 12/21/2000 | WO2000077066A2 Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 12/21/2000 | CA2370642A1 Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 12/19/2000 | US6162863 Waterborne polyurethanes with urea-urethane linkages |
| 12/19/2000 | US6162504 Adhesives and sealants containing adhesion promoter comprising waste powder prime |
| 12/14/2000 | WO2000075241A2 Oil soluble radiation curable metal-containing compounds and compositions |
| 12/13/2000 | CN1276805A Thermally stable polyetheramines |
| 12/12/2000 | US6160077 Halogen-free epoxy resin |
| 12/07/2000 | WO2000073371A1 Novel adhesive and conductive composition, use thereof and conductor element |
| 12/06/2000 | EP1057850A2 LCP bonding method |
| 12/06/2000 | EP1056757A1 Substituted benzoylferrocene anionic photoinitiators |
| 12/05/2000 | US6156835 Polymer-organoclay-composites and their preparation |
| 11/30/2000 | WO2000071632A1 Adhesive/sealant composition and bonded structure using the same |
| 11/28/2000 | US6153302 Epoxy/thermoplastic photocurable adhesive composition |
| 11/22/2000 | EP1053280A1 Adhesive composition and precursor thereof |
| 11/16/2000 | DE19901107C1 Lumineszierender elektrisch leitender Klebstoff Luminescent electrically conductive adhesive |
| 11/08/2000 | EP1049735A1 Snap cure adhesive based on anhydride/epoxy resins |
| 11/08/2000 | EP1049734A1 Color indicator for completion of polymerization for thermosets |
| 11/02/2000 | EP1048709A1 Adhesive composition |
| 11/02/2000 | EP1048682A2 Thermosetting resin composition for prestressed concrete tendon, its use and prestressed concrete tendon using the composition |
| 11/02/2000 | EP1047744A1 Curable epoxy-based compositions |
| 11/02/2000 | EP1047740A1 Curable resin compositions |
| 10/31/2000 | US6140454 Comprising an epoxy resin, a phenolic resin and a polycarbodiimide resin; integrated circuit package resin composition |
| 10/28/2000 | CA2306727A1 Thermosetting resin composition for prestressed concrete tendon, its use and prestressed concrete tendon using the composition |
| 10/24/2000 | US6136944 Adhesive of epoxy resin, amine-terminated polyamide and polyamine |
| 10/24/2000 | US6136384 Epoxy/thermoplastic photocurable adhesive composition |
| 10/17/2000 | US6132851 Phenolic resole resin and epoxy resin |
| 10/17/2000 | CA1341122C Reactive hot-melt adhesive |
| 10/12/2000 | WO2000059715A1 Multi functional electrically and thermally conductive adhesive tape |
| 10/12/2000 | WO2000059614A1 Hollow yarn membrane module, potting agent therefor and method for deaeration of liquid chemicals |
| 10/11/2000 | EP1042422A1 Laminating adhesive hardenable by radiation and use of same |
| 10/11/2000 | EP1042387A1 Laminating adhesives hardenable by radiation |
| 10/11/2000 | CN1269809A Epoxy resin composition |
| 10/10/2000 | US6130269 Heat resistance; storage stability |
| 10/03/2000 | US6127514 One-component thermoset coating compositions |
| 10/03/2000 | US6127445 Substituted benzoylferrocene anionic photoinitiators |
| 09/20/2000 | CN1056624C Process for preparing adhesive block copolymer |
| 09/13/2000 | EP1034203A1 Waterborne polyurethanes with urea-urethane linkages |
| 09/13/2000 | CN1056402C Anti-flow pasty epoxy adhesive |
| 09/13/2000 | CN1056399C Electrically conductive adhesive compositions |
| 09/08/2000 | WO2000022024A3 High strength epoxy adhesive and uses thereof |
| 09/05/2000 | US6114450 Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin |
| 08/29/2000 | US6111015 Core/shell polymer toughener suspended in epoxy resin |
| 08/29/2000 | US6110993 Thermosetting epoxy resin composition |
| 08/23/2000 | EP1029256A1 Electrochromic system |
| 08/22/2000 | US6106415 Comprising an adhesive layer for bonding between the intermediate layer and the cover, for improving in rebound and spin properties |
| 08/17/2000 | WO2000047686A1 Soluble adhesives |
| 08/17/2000 | DE19905800A1 Haft- und Strukturklebstoff zur aggressiven Fixierung von Fügeteilen mit anschließender Aushärtung in der Klebefuge mittels thermischer Energiezufuhr Adhesion and structural adhesive for fixing aggressive adherends followed by curing in the joint by means of thermal energy supply |
| 08/17/2000 | CA2362502A1 Soluble adhesives |
| 08/16/2000 | EP1028151A1 Pressure sensitive adhesive and structural adhesive for the aggressive fixation of joint parts followed by curing in the glue joint adding thermal energy |
| 08/15/2000 | US6103551 Semiconductor unit and method for manufacturing the same |
| 08/10/2000 | WO2000046318A1 Pressure sensitive adhesive tape |
| 08/10/2000 | WO2000046315A1 Adhesive, electrode-connecting structure, and method of connecting electrodes |
| 08/10/2000 | DE19904835A1 Lösbare Klebstoffe Releasable adhesives |
| 08/09/2000 | EP1026218A1 UV-curable polyester/epoxy adhesive |
| 08/09/2000 | EP1026217A1 Method of producing adhesive tape for electronic parts |
| 08/03/2000 | WO2000044807A1 Single component adhesive with an adaptable open joint time |
| 08/02/2000 | EP1023354A1 Thermally stable polyetheramines |