| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 11/17/2005 | WO2005109479A1 Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet |
| 11/17/2005 | US20050256241 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
| 11/17/2005 | US20050253286 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
| 11/17/2005 | US20050252132 System and method for laying floor coverings |
| 11/16/2005 | EP1594935A1 Reactivatable adhesive |
| 11/16/2005 | CN1696231A Interface adhesive compsn. and rework prepn. |
| 11/16/2005 | CN1227320C Weather resistant epoxy conductive adhesives |
| 11/16/2005 | CN1227319C Anisotropic conductive adhesive film |
| 11/10/2005 | WO2005105937A1 Aqueous self-adhesive coating for electrical steel and its uses |
| 11/10/2005 | US20050249446 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 11/10/2005 | US20050247916 Compositions for use in electronics devices |
| 11/10/2005 | US20050247402 Adhesive film |
| 11/09/2005 | EP1594351A2 Compositions for use in electronics devices |
| 11/09/2005 | CN1693404A Compositions for use in electronics devices |
| 11/09/2005 | CN1693403A Process for preparing modified epoxy adhesive agent with nano powder |
| 11/03/2005 | WO2005103180A1 Adhesive sheet, semiconductor device and process for producing semiconductor device |
| 11/03/2005 | US20050245643 combination of nonfluorinated aromatic epoxy resins (bisphenol a, bisphenol f type), an alicyclic epoxy resin having cyclohexene oxide or cyclopentene oxide structure in its molecule, a photoinitiator with iodinium or sulfonium cations and B(tetrafluorobenzene)4 or SbF6 anions, silica, Mg/OH/2 filler |
| 11/03/2005 | US20050244605 Use of an adhesive for assembling a member and a wheel, a member-and-wheel assembly, a member, and a wheel |
| 11/02/2005 | EP1591465A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
| 11/02/2005 | EP1280842B1 Aqueous two-component cross-linkable composition |
| 11/02/2005 | CN1692151A Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates |
| 11/02/2005 | CN1690154A Double component adhesive for double-ply board |
| 11/02/2005 | CN1690153A Thermosetting adhesive composition and adhesive band used said composition for electronic member |
| 11/02/2005 | CN1690143A Aqueous self-bonding coating for electrical steel |
| 10/27/2005 | WO2005100431A2 Polycarboxy-functionalized prepolymers |
| 10/27/2005 | US20050239922 Curable compositions having a reduced enthalpy output |
| 10/27/2005 | US20050238881 Semiconductor assembly using dual-cure die attach adhesive |
| 10/26/2005 | EP1383844B1 A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 10/26/2005 | CN1687286A Industry adhesive and producing method thereof |
| 10/26/2005 | CN1224448C Hollow yarn membrane module, potting agent therefor and method for deaeration of liquid chemicals |
| 10/25/2005 | US6958256 Process for the back-surface grinding of wafers |
| 10/20/2005 | US20050230027 Activatable material and method of forming and using same |
| 10/19/2005 | EP1586615A1 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 10/19/2005 | EP1586595A1 Activatable material and method of forming and using same |
| 10/19/2005 | EP1415369B1 Batch electrically connecting sheet |
| 10/19/2005 | CN1685025A Hybrid plastisol/hot melt compositions |
| 10/19/2005 | CN1684225A Sheet material for forming chip protection film |
| 10/19/2005 | CN1683445A Activatable material and method of forming and using same |
| 10/13/2005 | WO2005095485A1 Hardenable composition |
| 10/13/2005 | WO2005095484A1 Epoxy adhesive composition |
| 10/13/2005 | US20050228079 Thermosetting resin composition and adhesive films |
| 10/13/2005 | US20050227064 Dicing die bonding film |
| 10/13/2005 | CA2561385A1 Hardenable composition |
| 10/13/2005 | CA2553251A1 Epoxy adhesive composition |
| 10/12/2005 | EP1585170A2 Dicing die bonding film |
| 10/12/2005 | EP1584657A1 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 10/12/2005 | EP1584645A1 Polytetrafluoroethylene composites |
| 10/12/2005 | EP1276812B1 Non-aqueous solvent-free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 10/12/2005 | CN1681900A Method of adhesion of conductive materials, laminate, and adhesive composition |
| 10/12/2005 | CN1680504A Dicing die bonding film |
| 10/11/2005 | CA2353368C Method of applying chemical anchoring adhesive |
| 10/06/2005 | WO2005093270A1 Fastening element for fastening to a base body and method for fastening said fastening element |
| 10/06/2005 | US20050222369 Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioeter structure or disulfide structure, process for producing the same, and epoxy resin composition and adhesive |
| 10/06/2005 | US20050221038 bonding with a cured mixture of tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride terpolymer, polyethylene-oxide-modified silicone polymer coupling agent, and oxygen-radical-containing copolymer (epoxy, phenoxy polymer, or hydroxylated diamine-diepoxide) |
| 10/05/2005 | EP1582753A1 Fastening element for attachment to a base and method of attaching such an element |
| 10/05/2005 | CN1678706A Adhesive composition and glass plate with thermoplastic elastomer molding |
| 10/05/2005 | CN1678639A Transformable pressure sensitive adhesive tape and use thereof in display screens |
| 10/04/2005 | US6951907 Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex |
| 09/30/2005 | CA2502128A1 Polytetrafluoroethylene composites |
| 09/29/2005 | US20050215749 Low hydrolytic chlorine; curable, for a material in an electronics. |
| 09/29/2005 | US20050215730 Polycarboxy-functionalized prepolymers |
| 09/28/2005 | EP1578881A1 Adhesive with carboxyl benzotriazole for improved adhesion to metal substrates |
| 09/28/2005 | EP1578880A1 Adhesive composition for the direct joining of a pre-gelled polyester or vinyl ester to raw rubber |
| 09/28/2005 | EP1578851A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 09/28/2005 | EP1578838A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 09/28/2005 | CN1675330A Epoxy compositions having improved shelf life and articles containing the same |
| 09/28/2005 | CN1675328A 粘接性薄膜 Adhesive film |
| 09/27/2005 | US6949602 Room temperature vulcanization, quick setting glues, bonding two surfaces with a curable blends comprising acrylic-based monomer, epoxy based monomer or epoxy resin, and a chemically reactive bifunctional monomer |
| 09/27/2005 | US6949592 Aqueous blends comprising epoxy resin binders, curing catalyst for hardening, boron trifluoride complex, use as varnish for electrical coiling item protective coatings, including tertiary amines, imidazoles for corrosion resist |
| 09/27/2005 | US6949297 Hybrid adhesives, articles, and methods |
| 09/22/2005 | WO2005088700A1 Dicing/die boding sheet |
| 09/22/2005 | WO2005087889A1 Adhesive composition |
| 09/22/2005 | US20050209401 Toughened epoxy adhesive composition |
| 09/22/2005 | US20050208296 Hardenable pressure-sensitive adhesive sheet for semiconductor and process for producing semiconductor device |
| 09/21/2005 | CN1671747A Preparation of acrylic polymer sol for coating |
| 09/21/2005 | CN1670109A Modified epoxy resin adhesive and its preparation process |
| 09/21/2005 | CN1670108A Antiwear ceramic-metal adhesive |
| 09/21/2005 | CN1670107A Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 09/21/2005 | CN1670106A Modified epoxy resin adhesive and its preparation process |
| 09/21/2005 | CN1670105A Modified epoxy resin adhesive used under low temperature |
| 09/20/2005 | US6946051 Using pressure sensitive polymer for bonding the shaped parts, through the crosslinking of the glycidyl groups; high strength elasticity bonds; replacement of epoxy adhesives |
| 09/14/2005 | EP1574537A1 Epoxy adhesive composition |
| 09/14/2005 | EP1572814A1 Uv-curable epoxy acrylates |
| 09/14/2005 | EP1141071B1 High strength epoxy adhesive and uses thereof |
| 09/14/2005 | CN1667073A Halogen-free flame resistant adhesive for preparing laminated sheet |
| 09/09/2005 | WO2005030894A3 Adhesive compositions |
| 09/08/2005 | US20050196624 a (meth)acrylate of the formula (1),** Image-1(b): a monomer containing at least two (meth)acryloyl groups of the general formula (2) in the molecule,** Image-2(c): a monomer containing a heterocycle and one olefinic double bond in the molecule, and monomer different from (a), (b) and (c), |
| 09/08/2005 | US20050196619 Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 09/07/2005 | EP1299493B1 Oriented acrylic hotmelts |
| 09/07/2005 | CN1665881A Photo-induced cation curable epoxy resin composition |
| 09/06/2005 | US6939431 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors |
| 09/01/2005 | WO2005080524A1 Two-component adhesive for producing semi-finished products and composite sandwich materials |
| 09/01/2005 | US20050191498 a mixture of a chlorinated polyolefin, an epoxy group-containing compound and a silane coupling agent, having durability and bonding strength, used for bonding moldings with automobile windows |
| 09/01/2005 | US20050191490 Polymeric nanocomposites |
| 09/01/2005 | DE102004006522A1 Elastic two-component flock adhesives, useful for the production of substrates flocked with flock fibers, comprises silyl phased polyether, solvent-free epoxy resin, optionally thixotroping agent, bases and accelerators |
| 08/31/2005 | EP1568749A1 Two-component adhesive for producing semi-finished products and sandwich composites |
| 08/31/2005 | EP1568517A1 Use of an adhesive to bond a device to a wheel, the device-wheel system, the device and the wheel |
| 08/31/2005 | EP1293549B1 Adhesive for resin roll assembly and resin roll |
| 08/31/2005 | CN1663048A Interlayer dielectric and pre-applied die attach adhesive materials |
| 08/31/2005 | CN1662624A Heat curable adhesive composition, article, semiconductor apparatus and method |