| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 02/06/2002 | CN1334303A Adhesive tape for electronic component |
| 02/05/2002 | US6344372 Semiconductor device with reliable connection between projective electrode and conductive wire of the substrate |
| 01/31/2002 | WO2001072919A3 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 01/31/2002 | US20020012801 Polymeric adhesive and structures with multiple polymeric layers, their process of preparation and their use |
| 01/31/2002 | US20020011308 7575654 not granted per USPTO |
| 01/30/2002 | EP1176322A2 Method of applying chemical anchoring adhesive |
| 01/30/2002 | EP1176180A1 Viscous and amine-cured chemical anchoring adhesive |
| 01/30/2002 | EP1176179A2 Rope of chemical anchoring adhesive |
| 01/30/2002 | EP1176174A1 A degradable material, container or packaging material made of same, and method of forming same |
| 01/24/2002 | US20020010274 Adhesive compositions that are removable after thermosetting |
| 01/24/2002 | US20020009597 Heat curing an epoxy resin, a phenol compound having two or more phenolic hydroxyl groups and a latent curing agent; shrinkage inhibition; used in mounting of semiconductor devices, such as an LSI circuit, on a circuit substrate |
| 01/24/2002 | US20020009582 Adhesive layer that contains epoxy-terminated adduct of an epoxy resin and a nitrile rubber |
| 01/23/2002 | EP1174481A2 One-part, heat-cured epoxy adhesive |
| 01/23/2002 | EP1174175A1 Hollow yarn membrane module, potting agent therefor and method for deaeration of liquid chemicals |
| 01/23/2002 | CN1332777A Method for fabricating optical device using purified adhesives optical path |
| 01/23/2002 | CN1332217A Fixed adhesive for epoxy resin chip having allyl or vinyl |
| 01/18/2002 | CA2351963A1 One-part, heat cured epoxy adhesive |
| 01/17/2002 | WO2002004572A1 Polyimide hybrid adhesives |
| 01/17/2002 | WO2002004542A2 High functional polymers |
| 01/17/2002 | WO2002004541A2 No-flow flux adhesive compositions |
| 01/17/2002 | US20020006484 Adhesive and coating formulations for flexible packaging |
| 01/17/2002 | CA2412574A1 High functional polymers |
| 01/10/2002 | WO2002002709A1 Oriented acrylic hotmelts$i() |
| 01/09/2002 | EP1170346A2 Die attach adhesives with epoxy resin having allyl or vinyl groups |
| 01/09/2002 | CN1330686A Acrylic terpolymer for use as self-fixuring adhesive |
| 01/09/2002 | CN1330684A Shock-resistant epoxide resin compositions |
| 01/07/2002 | CA2352125A1 Adhesives with epoxy resin having allyl or vinyl groups |
| 01/03/2002 | US20020001720 Adhesives; coatings; encapsulation |
| 01/03/2002 | US20020001688 Sheet resin composition and process for manufacturing semiconductor device therewith |
| 01/03/2002 | DE10029298A1 Befestigungsetikett Fixing label |
| 01/02/2002 | EP1168026A2 Mounting process for outgassing-sensitive optics |
| 01/02/2002 | EP1167484A2 Poly(arylene ether) adhesive compositions |
| 01/02/2002 | EP1167483A1 Adhesive tape for electronic parts |
| 01/02/2002 | EP1165647A1 Single component adhesive with an adaptable open joint time |
| 01/02/2002 | CN1329651A Adhesive powder |
| 12/27/2001 | WO2001098428A1 Adhesive for resin roll assembly and resin roll |
| 12/27/2001 | US20010056137 Aqueous two-component cross-linkable composition |
| 12/26/2001 | CN1328588A Impact-resistant epoxide resin compositions |
| 12/25/2001 | US6333101 Method of adhering adherends |
| 12/20/2001 | WO2001096588A2 Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 12/20/2001 | WO2001049797A3 Multi-layered sealant |
| 12/19/2001 | EP1164100A2 Attaching label |
| 12/19/2001 | CN1327020A Connection material and connection structure body |
| 12/19/2001 | CN1076379C Curable binder for pressure sensitive adhesives and seal glue adhesive and seal glue containing said binder |
| 12/18/2001 | US6331226 Using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin; excellent adhesion and heat resistance; liquid crystalline polymer |
| 12/18/2001 | US6331080 Optical fiber connector using colored photocurable adhesive |
| 12/18/2001 | CA2050114C Compositions suitable as binders and their use in coating and sealing compositions |
| 12/13/2001 | WO2001094493A2 Epoxy based reinforcing patches with improved adhesion to oily metal surfaces |
| 12/13/2001 | WO2001094444A1 Method for producing aliphatic oligocarbonate diols |
| 12/13/2001 | WO2001000698A3 Poly(mercaptopropylaryl) curatives |
| 12/13/2001 | DE10027907A1 Production of aliphatic oligocarbonate diols, useful in the production of plastics, fibers, coatings and adhesives, comprises reaction of aliphatic diols with dimethyl carbonate in a multi-stage process. |
| 12/12/2001 | EP1161507A1 Soluble adhesives |
| 12/11/2001 | US6329473 Used as coating for crack bridging, as an adhesive and in powder surface coatings |
| 12/11/2001 | US6329050 Adhesive for electronic parts and adhesive tape for electronic parts |
| 12/11/2001 | US6328844 Heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in pressing direction |
| 12/11/2001 | CA2198999C Adhesive composition for bonding a lining tube on to the internal surface_of an existing pipe |
| 12/05/2001 | EP1160857A2 Epoxy-based adhesive for mounting a semiconductor device on a substrate |
| 11/29/2001 | US20010046937 Substrate having particles of a photocatalyst such as TiO2, adhered on via a less degradative adhesive such as a copolymer of a vinyl ether and a fluoroolefin or a silicone |
| 11/28/2001 | EP1157742A1 Process for removing deleterious materials |
| 11/28/2001 | EP1157741A1 Photocatalyst composite and process for producing the same |
| 11/28/2001 | CN1323868A 各向异性导电粘接薄膜 Anisotropic conductive adhesive film |
| 11/22/2001 | WO2001088053A1 Rigid substrate lamination adhesive |
| 11/21/2001 | EP1155082A1 Shock-resistant epoxide resin compositions |
| 11/14/2001 | EP1154004A1 Reactive hot-melt adhesive composition |
| 11/14/2001 | EP1153098A1 Method for fabricating an optical device using purified adhesives in the optical path |
| 11/14/2001 | CN1322230A Optical fiber connector using colored photocurable adhesive |
| 11/14/2001 | CN1322219A Method for producing vinyl compounds |
| 11/08/2001 | WO2001083634A2 Formulation for strippable adhesive and coating films |
| 11/08/2001 | WO2001083629A1 Method of bonding adherend |
| 11/08/2001 | WO2001046331A3 Acidic polymer-based thermosettable psas, methods of their use, and thermoset adhesives therefrom |
| 11/08/2001 | US20010039300 Photo-curable resin composition, process for producing the same and products using the same |
| 11/07/2001 | EP1151053A1 Adhesive powder |
| 11/07/2001 | CN1320961A Anisotropic electrically conductive binding material and connecting method |
| 11/06/2001 | US6313257 Poly (mercaptopropylaryl) curatives |
| 11/06/2001 | US6312801 Adhesive tape for electronic parts |
| 11/01/2001 | WO2001081494A2 Non-aqueous solvent-free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 10/31/2001 | EP1149130A1 Acrylic terpolymer for the use as a self-fixturing adhesive |
| 10/31/2001 | CN1319636A Adhesion agent for electrode conection and connection method using same |
| 10/30/2001 | US6309794 Optical recording media comprising a resin film |
| 10/25/2001 | WO2001079374A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 10/25/2001 | US20010033544 Optical medium |
| 10/18/2001 | WO2001077202A1 Aqueous two-component cross-linkable composition |
| 10/18/2001 | US20010031837 Pressure sensitive adhesives |
| 10/18/2001 | US20010031828 Film-type adhesive for electronic components, and electronic components bonded therewith |
| 10/17/2001 | EP1146101A1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 10/17/2001 | EP0528874B2 Use of a dispersion-based two-component, filmforming reactive system |
| 10/16/2001 | US6303219 Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor device |
| 10/11/2001 | WO2001074962A1 Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device |
| 10/11/2001 | WO2001074960A2 Halogen free flame retardant adhesive resin coated composite |
| 10/11/2001 | US20010028953 Adhesive compositions and methods of use |
| 10/10/2001 | EP1142922A2 Photo-curable resin composition, process for producing the same and products using the same |
| 10/10/2001 | EP1141161A1 Photo curable adhesive composition |
| 10/10/2001 | EP1141073A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 10/10/2001 | EP1141071A2 High strength epoxy adhesive and uses thereof |
| 10/10/2001 | CN1317039A Adhesive compositions and their precursors |
| 10/04/2001 | WO2001072919A2 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 10/04/2001 | US20010026866 Anisotropically electroconductive adhesive material and connecting method |
| 10/04/2001 | US20010025947 Providing and curing liquid conductive mixture between nodes, having sufficient conductivity without diminishing resistance; electrical, integrated circuits, batteries, wireless communication devices |
| 10/04/2001 | EP1138737A1 Anisotropically electroconductive adhesive material and connecting method |
| 10/04/2001 | EP1137733A1 Two-component material for chemical fixing means |