Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
---|
05/11/1999 | CA2050024C Improved aqueous emulsion dispersion adhesives based on a polyol and a hindered isocyanate compound |
05/06/1999 | EP0914027A1 Film-like adhesive for connecting circuit and circuit board |
05/06/1999 | EP0912649A1 Heat-setting single-component lva (low-viscosity adhesive) system for bonding in the micro-range |
05/06/1999 | EP0912203A1 Medical pressure-sensitive adhesives with high permeability to water vapour and high adhesive force, and plasters provided therewith |
05/06/1999 | DE19748358A1 Elektrochromes System Electrochromic system |
05/04/1999 | US5900468 Epoxy resin composition |
04/29/1999 | WO1999020673A1 Thermally stable polyetheramines |
04/28/1999 | EP0911353A1 Adhesive resin composition and adhesive film |
04/27/1999 | US5898041 Production process of liquid crystal display panel, seal material for liquid crystal cell and liquid crystal display |
04/21/1999 | EP0909773A2 Stabilized cationically-curable compositions |
04/14/1999 | CN1042947C Adhesive compsn. for vinyl halide type resin |
04/06/1999 | US5891367 Based on a silver flake-filled polymeric reaction product of a liquid bisphenol a having very low hydrolyzable chlorine content and suitable polypropylene oxide-based primary amine curing agents. |
03/31/1999 | CN1212716A Polymer-organoclay-composites and their preparation |
03/30/1999 | US5888654 High performance epoxy based laminating adhesive |
03/17/1999 | EP0902071A1 Thermosetting pressure-sensitive adhesive and adhesive sheets made by using the same |
03/17/1999 | CN1211262A Improved chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
03/16/1999 | US5883193 Includes at least one polymerizable acrylic or methacrylic acid ester of a non-tertiary alcohol, a thermosettable epoxy resin, an amine curative, a silane coupling agent, and a chelating agent |
03/11/1999 | WO1999011691A1 Epoxy resin compositions |
03/11/1999 | DE19739764A1 Epoxy adhesive containing an aliphatic poly:amine and aralkyl-poly:amine |
03/10/1999 | EP0832163B1 Solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
03/10/1999 | EP0676456B1 Heat-resistant adhesive film for printed board and method of use thereof |
03/10/1999 | CN1210555A Hot-melt adhesive composition with excellent heat and cold resistance |
03/09/1999 | US5880246 Materials for encapsulating semiconductors, for laminated sheets, for electric insulators |
03/09/1999 | US5880229 Urethane modified epoxy resin |
03/09/1999 | US5880217 Telechelic and heterotelechelic polymers with dual curing agents |
03/03/1999 | EP0898603A1 Adhesive compositions and methods of use |
02/25/1999 | DE19736850A1 Curable plugging material for fixing anchor bars in bore holes |
02/24/1999 | EP0897431A1 Bonding fibrous batts with thermosetting fiber-binders of certain epoxy resins |
02/18/1999 | WO1999007774A1 Soluble adhesives with a base consisting of a bonding agent containing di- or polysulfide bonds |
02/18/1999 | CA2299353A1 Soluble adhesives with a base consisting of a bonding agent containing di- or polysulfide bonds |
02/17/1999 | EP0896974A2 Stabilzed cationically-curable compositions |
02/11/1999 | DE19733643A1 Lösbare Klebstoffe Releasable adhesives |
02/10/1999 | EP0896372A2 Solar battery module |
02/10/1999 | EP0895523A1 Uv curable composition |
02/10/1999 | EP0785974B1 Curable binders for pressure sensitive adhesives and sealants |
02/10/1999 | EP0750654B1 Single-package, duroplastic hardenable coating compound |
01/28/1999 | WO1999004299A1 Method for fixing an optical fiber cable in a connector for a connectable optical fiber connection and adhesive used in said method |
01/27/1999 | EP0893484A2 Multilayer anisotropic electroconductive adhesive and method for manufacturing same |
01/26/1999 | US5863970 Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
01/21/1999 | WO1999002341A1 Readily bondable polyamide film |
01/20/1999 | EP0892027A1 Drop-resistant conductive epoxy adhesive |
01/19/1999 | US5861212 Latex of carboxylated highly saturated nitrile-conjugated diene copolymer rubber, resorcinol-formaldehyde resin, and aromatic epoxy resin; belts |
01/14/1999 | WO1999001520A1 Adhesive compositions with durability under conditions of high humidity |
01/13/1999 | EP0889931A1 Polymer-organoclay-composites and their preparation |
01/12/1999 | US5859181 Reacting diaminopolysiloxane, alicyclic diamine, aromatic tetracarboxylic acid, imidating resulting polyamic acid |
01/12/1999 | US5859155 Adhesive of epoxy resin, carboxylated rubber aromatic amine and dicyandiamide |
01/07/1999 | EP0889106A1 Method and composition for bonding components to glass |
01/05/1999 | US5856383 Snap-cure epoxy adhesives |
12/30/1998 | CN1203621A Adhesive, process for preparation thereof, and process for mounting components |
12/29/1998 | US5854325 Photosensitive adhesive composition for additive plating |
12/29/1998 | US5854315 Snap-cure epoxy adhesives |
12/23/1998 | CN1202908A Modified polyalkadiene-containing compositions |
12/16/1998 | EP0884737A1 Porous electrically insulating mica tape with UV-crosslinkable varnish, manufacturing and applications of the same |
12/13/1998 | CA2239246A1 Porous electrical insulating micatape comprising a uv radiation photocurable varnish, its manufacture and applications |
12/09/1998 | EP0882775A1 Hot-melt adhesive composition with excellent heat and cold resistance |
12/09/1998 | EP0882108A1 Polyamide based laminating, coverlay, and bond ply adhesive with heat activated cure component |
12/09/1998 | EP0445192B2 Aqueous polyurethane and polyurethane carbamide dispersions, and a process for flock-coating moulded elastomeric products and for heat-sealing textile articles using these dispersions |
12/08/1998 | US5847027 Hardeners for elastic epoxy resin systems |
12/02/1998 | EP0880551A1 Improved chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
12/02/1998 | EP0739395B1 Heat curable toughened epoxy resin compositions |
12/01/1998 | US5844320 Semiconductor unit with semiconductor device mounted with conductive adhesive |
12/01/1998 | US5843550 Adhesive tape for tape automated bonding |
11/25/1998 | CN1199763A Fastener adhesive |
11/24/1998 | US5840829 Plateable structural adhesive for cyanate ester composites |
11/19/1998 | WO1998051756A1 Adhesive, method for bonding, and assemblies of mounted boards |
11/19/1998 | CA2289733A1 Adhesive, method for bonding, and assemblies of mounted boards |
11/18/1998 | EP0878473A1 Derivatives of styrene oxide in cationically-curable compositions |
11/18/1998 | EP0878472A1 Reactive radiation- or thermally- initiated cationically-curable epoxide monomers and compositions made from those monomers |
11/18/1998 | EP0878244A2 Method for forming micron-sized and smaller liquid droplets |
11/18/1998 | CN1199075A Photo-setting adhesive |
11/17/1998 | US5837749 Photoinitiator |
11/16/1998 | CA2237881A1 Reactive radiation- or thermally-initiated cationically-curable epoxide monomers and compositions made from those monomers |
11/16/1998 | CA2237535A1 Radiation-or thermally-initiated cationically-curable epoxide compounds and compositions made from those compounds |
11/12/1998 | WO1998050480A1 Adhesive compositions that are removable after thermosetting |
11/10/1998 | US5834109 Presized backing for a coated abrasive article |
11/04/1998 | EP0875289A1 Photocatalyst composite and process for producing the same |
11/04/1998 | EP0448663B1 Tackified dual cure pressure-sensitive adhesive |
10/28/1998 | CN1197098A Low temp. adhesive and firming agent used for low temp. adhesive |
10/07/1998 | CN1195364A Ultraviolet-curing adhesive composition and its article |
10/01/1998 | DE19809672A1 Adhesive system for single or multi stage book binding process |
09/30/1998 | EP0866809A1 Modified polyalkadiene-containing compositions |
09/30/1998 | CN1040007C Stabilizer mixture |
09/23/1998 | EP0866109A1 Adhesive, process for the preparation thereof, and process for mounting components |
09/23/1998 | EP0865653A2 Electrically conducting reaction resin mixture |
09/17/1998 | WO1998040225A1 Adhesive systems for a one or multi step adhesive binding method, method for adhesive binding of printed matter |
09/15/1998 | US5807959 For semiconductors |
09/15/1998 | US5807910 Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive |
09/08/1998 | US5804672 Thermally crosslinkable heat-sealing adhesive |
09/08/1998 | US5804657 Instantaneous bond; cohesive strength; structural adhesive |
09/08/1998 | US5804005 Bonding fibrous batts with thermosetting fiber-binders of certain expoxy resins |
09/03/1998 | WO1998038262A1 Pressure-sensitive adhesive tape |
09/03/1998 | CA2280591A1 Pressure-sensitive adhesive tape |
09/02/1998 | EP0861278A1 Reactive resin manufacture |
09/02/1998 | CN1192228A Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
09/02/1998 | CN1192227A Solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
09/02/1998 | CN1191881A Resin glue and technological process of painting it on polyester film to form diamond checks |
09/01/1998 | US5800722 Multilayer printed wiring board and process for manufacturing the same |
08/26/1998 | CN1191548A Application of polymer backing onto glass substrate |
08/19/1998 | EP0859403A1 Pressure sensitive adhesive composition for the polishing of the back of a wafer |
08/19/1998 | EP0859027A1 Curable compositions |