| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 07/01/2004 | US20040127626 capable of forming or bonding low-resistance electrodes; silver powder as a conductive agent |
| 07/01/2004 | CA2510486A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 06/29/2004 | US6756469 Polysilazane-modified polyamine hardeners for epoxy resins |
| 06/24/2004 | US20040118514 Heat resistant, impact resistant, acrylic/epoxy adhesives |
| 06/23/2004 | EP1432054A1 Partially crosslinked adhesive-supported porous film for battery separator and its use |
| 06/23/2004 | EP1431365A1 Heat resistant, impact resistant, acrylic/epoxy adhesives |
| 06/23/2004 | EP1431325A1 Heat-curable epoxy resin composition with improved low-temperatur impact strength |
| 06/23/2004 | CN1506430A Adhesive for sintering alloy powder |
| 06/17/2004 | WO2003059999A3 Epoxy resin component containing a cationic methine dye |
| 06/16/2004 | CN1505672A Method for adhering substrates using light activatable adhesive film |
| 06/15/2004 | US6750550 Adhesive and semiconductor devices |
| 06/15/2004 | US6750301 Microelectronics; a maleimide or polyether compound or resin; an epoxy compound or resin having vinyl or allyl groups, selected from 2,6- digylcidylphenyl allyl ether, glycidyl vinyl benzyl ether, and glycidyl vinyl ether, curing agent |
| 06/15/2004 | US6749938 Low read-through epoxy-bonded SMC |
| 06/10/2004 | WO2004048490A1 Uv-cure adhesive composition for optical disk, cured material and goods |
| 06/10/2004 | US20040109949 Latent hardener, manufacturing method for latent hardener, and adhesive |
| 06/10/2004 | CA2505550A1 Uv-cure adhesive composition for optical disk, cured material and goods |
| 06/09/2004 | EP1425358A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| 06/09/2004 | EP1425330A1 Network polymers comprising epoxy-terminated esters |
| 06/09/2004 | EP1222229B1 Formulation for strippable adhesive and coating films and high performance adhesives |
| 06/09/2004 | CN1503831A A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 06/03/2004 | US20040106769 High functional polymers |
| 06/03/2004 | US20040105990 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity |
| 06/02/2004 | EP1424379A2 Vinyl ester adhesive compositions |
| 06/02/2004 | EP1424378A2 Curable adhesive compositions containing reactive multi-functional acrylate |
| 06/02/2004 | EP1423467A1 Fluxing compositions |
| 06/02/2004 | EP1272586B1 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 06/02/2004 | CN1500849A Curable adhesive compositions |
| 06/02/2004 | CN1500823A Partially crosslinked adhesive-supported porous film for battery separator and its use |
| 06/01/2004 | US6744133 Adhesive film for semiconductor, lead frame and semiconductor device using the same |
| 06/01/2004 | US6743470 Method of modifying a surface molecules, adhesives, articles, and methods |
| 05/27/2004 | US20040102544 Reworkable epoxidized 1-(cyclo) alkenyl ether/polycarboxylic acid product |
| 05/27/2004 | US20040101757 Partially crosslinked adhesive-supported porous film for battery separator and its use |
| 05/27/2004 | US20040101643 Adhesives containing FDA approved materials |
| 05/26/2004 | EP1422279A1 Semiconductor package with a die attach adhesive having silane functionality |
| 05/26/2004 | EP1303571B1 Polyimide hybrid adhesives |
| 05/26/2004 | CN1500127A 热固性胶粘剂 Thermosetting adhesive |
| 05/25/2004 | US6740412 Blend of thermoplastic resins, unsaturated ester polymer and modified alpha-olefin polymer |
| 05/25/2004 | US6740192 Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane |
| 05/20/2004 | US20040097014 Semiconductor package with a die attach adhesive having silane functionality |
| 05/20/2004 | US20040094264 Method for adhering substrates using light activatable adhesive film |
| 05/19/2004 | EP1420054A1 Curable adhesive compositions |
| 05/19/2004 | EP1419527A1 Adhesive tape |
| 05/19/2004 | EP1419207A1 Adhesive prepreg face sheets for sandwich panels |
| 05/19/2004 | EP1272587B1 Impact-resistant epoxy resin compositions |
| 05/19/2004 | CN1150245C Improved chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
| 05/13/2004 | US20040092640 Automotive adhesive |
| 05/13/2004 | US20040092618 Low outgassing photo or electron beam curable rubbery polymer material, preparation thereof and device comprising same |
| 05/12/2004 | CN1496394A Automotive adhesive |
| 05/12/2004 | CN1496381A Highly functional polymers |
| 05/11/2004 | US6734263 Polymeric material and a process for making the polymeric material. the polymeric material has adhesive and noise abatement properties over a broad temperature range. further, the material is chip and corrosion resistant and provides |
| 05/11/2004 | US6733880 Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same |
| 05/11/2004 | US6733695 Silver powder and thermosetting resin |
| 05/06/2004 | WO2004037939A1 Heat-curable adhesive composition |
| 05/06/2004 | US20040087685 Mixtures of thermoplastic resins, binders, thickeners, curing agents and water, used as impregnation varnishes for electronics |
| 05/06/2004 | US20040084686 Packaging material used for a display device and method of forming thereof |
| 05/06/2004 | EP1415369A1 Batch electrically connecting sheet |
| 05/06/2004 | DE69432839T2 Epoxydharz und Polyesterharz enthaltende heissschmelzbare Zusammensetzungen Epoxy resin and polyester resin containing hot melt compositions |
| 04/29/2004 | WO2004009720A3 Transformable pressure sensitive adhesive tape and use thereof in display screens |
| 04/29/2004 | US20040082743 Adhesives; stability, heat resistance; borane-amine complex as promoters for addition polymers |
| 04/29/2004 | US20040082734 Impact strength, toughness |
| 04/28/2004 | EP1412445A1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 04/28/2004 | EP0993496B1 Adhesive compositions with durability under conditions of high humidity |
| 04/22/2004 | WO2004018583A3 Method for bonding dvd layers |
| 04/22/2004 | US20040077802 For use as casting resin, adhesive, matrix resin, tooling resin or as self-flowing coating composition |
| 04/22/2004 | US20040074598 Which comprises applying a curable composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated |
| 04/22/2004 | US20040074089 Uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that |
| 04/21/2004 | EP1411102A1 Releasable microcapsule and adhesive curing system using the same |
| 04/21/2004 | CN1491245A Liquid epoxy resin emulsions, method for production and use thereof |
| 04/20/2004 | US6723803 Stable at room temperature; one-component |
| 04/20/2004 | US6723432 Can be cured and bonded to a current collector; adhesion and chemical resistance; for use in manufacture of lithium batteries and electrical double-layer capacitors of various shapes |
| 04/15/2004 | US20040072927 Two-part epoxy adhesives with improved flexibility and process for making and using same |
| 04/15/2004 | US20040069405 Blend of epoxy resin and an internally flexibilized epoxy resin; hardener mixture of a flexibilizer and an aliphatic amine and/or a polyamide; tensile elongation at room temperature of greater than 30%. |
| 04/14/2004 | CA2444382A1 Two-part epoxy adhesives with improved flexibility and process for making and using same |
| 04/13/2004 | US6720083 Adhesive and semiconductor devices |
| 04/08/2004 | US20040068061 Will not exhibit reduced adhesive forces as is typical in adhesives to which a large amount of filler is added; phenoxy resins are particularly preferred because they are highly miscible to epoxy resins |
| 04/07/2004 | EP1292630B1 Method for producing aliphatic oligocarbonate diols |
| 04/07/2004 | CN1144831C Electronic circuit device comprising epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 04/06/2004 | US6716674 Method of forming a semiconductor package |
| 04/06/2004 | US6716529 Tape automated bonding (tab); adhesive strength, moderate elastic modulus and coefficient of expansion; adhesive layer of a thermoplastic resin and a polyepoxide having skeleton containing one of dicyclopentadiene, terpene, or biphenyl |
| 04/01/2004 | WO2004026984A1 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 04/01/2004 | WO2003076485A3 Organoborane amine complex polymerization initiators and polymerizable compositions |
| 04/01/2004 | WO2003022953A8 Structural hot melt material and methods |
| 03/31/2004 | EP1401984A1 Ultraviolet activatable adhesive film |
| 03/31/2004 | EP1146101B1 Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same |
| 03/31/2004 | CN1485391A Bond composition for precision parts, case for timekeeper and manufacturing method |
| 03/31/2004 | CN1485390A Bond composition and method of agglutinating and ornamenting stone, ornament and mending agent |
| 03/25/2004 | WO2004024843A1 Adhesive composition and glass plate with thermoplastic elastomer molding |
| 03/25/2004 | US20040058181 For producing lightweight components for the construction of machinery, vehicles or tools, in particular for the construction of automobiles |
| 03/25/2004 | US20040055699 Method for accelerated bondline curing |
| 03/23/2004 | US6709741 FPC adhesive of epoxy resin, onium hexafluoroantimonate, nitrile rubber and filler |
| 03/18/2004 | US20040054081 Crosslinking using ultraviolet radiation; pressure sensitive adhesives |
| 03/18/2004 | US20040054036 High functional polymers |
| 03/17/2004 | EP1397455A1 Hot-melt adhesive provided in the form of granulated material |
| 03/17/2004 | EP1397258A1 Curable hot melt adhesive for casemaking |
| 03/16/2004 | US6706403 Rigid substrate lamination adhesive |
| 03/11/2004 | US20040048078 Article of manufacture; comprising first panel and second panel adjoining first panel; sealant over panels |
| 03/10/2004 | CN1481554A Radiation-curable compsns. for optical media |
| 03/10/2004 | CN1141349C Backing for adhesive tape and such tape |
| 03/04/2004 | WO2004018584A1 Adhesive film |
| 03/04/2004 | WO2004018583A2 Method for bonding dvd layers |