| Patents for C09J 163 - Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins (8,472) |
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| 03/04/2004 | US20040043146 Method of modifying a surface |
| 03/03/2004 | CN1478955A Coloured cementing material for paving road surface and its preparation method |
| 03/02/2004 | US6699351 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 02/26/2004 | WO2004016703A1 Epoxy compositions having improved shelf life and articles containing the same |
| 02/26/2004 | WO2003052016A3 Dual cure b-stageable adhesive for die attach |
| 02/26/2004 | US20040038061 Oriented acrylic hotmelts$IO |
| 02/26/2004 | US20040038035 Using epoxy resins and aryl iodonium cationic initiators which are cured by electron beam radiation; superior performance including superior adhesion, moisture resistance |
| 02/26/2004 | US20040038025 reflectance levels of 20 to 65% in the 600 nm to 900 nm region; polyamide or polyester filaments melt spun with carbon black additive; camoflaging fabrics; antireflectivity |
| 02/25/2004 | EP1056757B1 Substituted benzoylferrocene anionic photoinitiators |
| 02/24/2004 | US6696506 Cationic photocatalyst composition and photocurable composition |
| 02/24/2004 | CA2084588C Stabiliser mixture |
| 02/19/2004 | US20040033324 Containing a hydroxyl-containing aromatic compound, such as a phenol-formaldehyde condensate |
| 02/18/2004 | EP1389408A1 Method for producing components for electronic devices |
| 02/18/2004 | CN1138807C Solvent-free, room temp. curing reactive systems and use thereof in production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 02/17/2004 | US6692986 Method for encapsulating components |
| 02/12/2004 | WO2004013248A1 Two part epoxide adhesive with improved strength |
| 02/12/2004 | US20040029980 Hybrid plastisol/hot melt compositions |
| 02/11/2004 | EP1388852A1 Adhesive for optical disk and optical disk |
| 02/05/2004 | WO2004011569A1 Hybrid plastisol/hot melt compositions |
| 02/05/2004 | US20040024079 Non-aqueous solvent-free process for making uv curable adhesive and sealants from expodized monohydroxylated diene polymers |
| 02/04/2004 | EP1385896A1 Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds |
| 01/29/2004 | WO2004009722A1 Thermosetting adhesive for optical use, optical isolator element made with the adhesive, and optical isolator |
| 01/29/2004 | WO2004009720A2 Transformable pressure sensitive adhesive tape and use thereof in display screens |
| 01/29/2004 | WO2004009649A1 Preparation of acrylic polymer sol for coating |
| 01/28/2004 | EP1384255A2 Method for grinding the back sides of wafers |
| 01/28/2004 | EP1383844A1 A thermosetting adhesive film, and an adhesive structure based on the use thereof |
| 01/28/2004 | EP0982385B1 Adhesive, method for bonding, and assemblies of mounted boards |
| 01/28/2004 | CN1471551A High functional polymers |
| 01/28/2004 | CN1471063A High heat-resisting label |
| 01/28/2004 | CN1136270C Adhesion agent, sealing glue and paint composition |
| 01/27/2004 | US6682818 Epoxy resin blend |
| 01/22/2004 | US20040012098 Conductor bodies attached adhesive sheet, process for producing semiconductor device and semiconductor device |
| 01/20/2004 | US6680007 Suitable for use in electrical and mechanical connection of electronic parts as a substitute for the existing solder; adhesion, heat resistance, moisture resistance, flexibility and impact resistance |
| 01/15/2004 | US20040010050 Mixture of epoxides and polyol; photopolymerization |
| 01/14/2004 | EP1380625A1 Automotive adhesive |
| 01/14/2004 | EP1200036B1 Adhesive systems |
| 01/14/2004 | EP0880551B1 Improved chemical curing of epoxidized diene polymers using aromatic anhydride curing agents |
| 01/13/2004 | US6677427 Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 01/08/2004 | WO2004003096A1 Method for accelerated bondline curing |
| 01/08/2004 | WO2004003066A1 Improved interface adhesive |
| 01/08/2004 | CA2489687A1 Method for accelerated bondline curing |
| 01/07/2004 | EP1377645A1 Flexible thermal protective compositions and coatings and structures formed with them |
| 01/07/2004 | CN1466611A Low temperature bonding adhesive composition |
| 01/06/2004 | US6673858 Thermosetting adhesive material |
| 01/06/2004 | US6673441 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/02/2004 | EP1373427A2 Thermosetting adhesive |
| 01/02/2004 | EP1373426A1 Structural bonding tapes and articles containing the same |
| 01/02/2004 | EP1373425A2 Protective articles |
| 01/02/2004 | EP1373354A1 Highly functional polymers |
| 01/02/2004 | EP1372954A1 Graphics-displaying sheet |
| 01/01/2004 | US20040000712 Interface adhesive |
| 12/31/2003 | WO2004000966A1 Heat curable adhesive composition, article, semiconductor apparatus and method |
| 12/31/2003 | WO2004000964A1 Humidity resistant water-based adhesive compositions |
| 12/31/2003 | CN1464889A Adhesive compositions including self-assembling molecules, adhesives, articles, and methods |
| 12/31/2003 | CN1132889C Ultraviolet-curing adhesive composition and its article |
| 12/25/2003 | WO2003107427A1 Interlayer dielectric and pre-applied die attach adhesive materials |
| 12/25/2003 | US20030236362 Alkyl acrylate monomer, a core-shell polymer or a semicrystalline polymer; heat curable |
| 12/24/2003 | WO2002061010A8 Method for adhering substrates using light activatable adhesive film |
| 12/23/2003 | US6667194 Method of bonding die chip with underfill fluxing composition |
| 12/18/2003 | US20030232924 Adhesives |
| 12/17/2003 | EP1371701A2 Heat-resistant label |
| 12/17/2003 | EP0912649B1 Heat-setting single-component lva (low-viscosity adhesive) system for bonding in the micro-range |
| 12/17/2003 | CN1461785A Water-resistant adhesive composite for wood |
| 12/16/2003 | US6664324 Resin solution composition for paints or adhesives |
| 12/16/2003 | US6663930 Chemical resistant adhesive composition |
| 12/11/2003 | WO2003102102A1 Segmented curable transfer tapes |
| 12/11/2003 | WO2003102101A1 Adhesive tape |
| 12/11/2003 | US20030226640 Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies |
| 12/11/2003 | CA2431665A1 Highly heat-resistant label |
| 12/10/2003 | EP1368401A1 Liquid epoxy resin emulsions, method for the production and use thereof |
| 12/10/2003 | EP0895523B1 Uv curable composition |
| 12/10/2003 | CN2591039Y Patch made of epoxyn |
| 12/10/2003 | CN1461333A Optical adhesive composition and optical apparatus |
| 12/09/2003 | CA2112410C Reactive hot-melt adhesive |
| 12/04/2003 | WO2003101164A1 Nanoparticle filled underfill |
| 12/04/2003 | WO2003099953A1 Curable adhesive articles having topographical features therein |
| 12/04/2003 | WO2003099952A1 Adhesive film and prepreg |
| 12/04/2003 | WO2002085975A8 Composition of acrylated urethane oligomer, epoxy resin and amine hardener |
| 12/04/2003 | US20030221770 An adhesive transfer tape including an embossed carrier web having recesses embossed therein and a curable adhesive precursor coated into the recesses is disclosed. |
| 12/03/2003 | EP1366130A1 Adhesives and adhesive compositions containing thioether groups |
| 11/27/2003 | US20030220455 Heat resistant resin composition and adhesive film |
| 11/27/2003 | US20030218258 Curable thermosetting adhesive |
| 11/25/2003 | US6653371 Shelf life stability |
| 11/25/2003 | US6652960 Plastic-coated metal plate |
| 11/20/2003 | WO2003095554A1 Photo-induced cation curable epoxy resin composition |
| 11/20/2003 | WO2003095526A1 Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioether structure or disulfide structure, process for producing the same, and epoxy resin composition and adhesive |
| 11/19/2003 | EP0958326B1 Method for gluing a surface to a component |
| 11/18/2003 | US6649259 Radiation curable adhesive coating |
| 11/18/2003 | US6648945 Hollow yarn membrane module, potting agent therefor and method for deaeration of liquid chemicals |
| 11/13/2003 | WO2003093387A1 Heat-curable epoxy resin composition |
| 11/13/2003 | WO2003093342A1 Mannich bases from isolated amine adducts |
| 11/13/2003 | US20030211318 Overcoating metal substrate with epoxy resin adhesive blends |
| 11/12/2003 | EP1361259A1 Fiber-metal laminate adhesive |
| 11/12/2003 | CN1454956A Single-component high-elasticity epoxy adhesive |
| 11/11/2003 | US6645632 Blend of polyimide and epoxy resin |
| 11/11/2003 | US6645595 Optical medium |
| 11/11/2003 | US6645341 Two part epoxide adhesive with improved strength |
| 11/06/2003 | WO2002070623A8 Protective articles |
| 11/06/2003 | US20030207117 Sheet resin composition and process for manufacturing semiconductor device therewith |
| 11/05/2003 | EP1359202A1 Temperature curable epoxy resin composition |